Product Overview
Kynix Part #:
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KY32-H57V1262GFR-75I
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Manufacturer Part#:
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H57V1262GFR-75I
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Product Category:
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Memory
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Stock:
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Yes
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Manufacturer:
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HYNIX
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Click Purchase button to buy original genuine H57V1262GFR-75I
|
|
Description:
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-
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Datasheet:
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H57V1262GFR-75I Datasheet
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Package:
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FBGA
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Quantity:
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2200 PCS
|
H57V1262GFR-75I Images are for reference only.
CAD Models
There is no relevant information available for this part yet.
Product Attributes
Categories
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Integrated Circuits (ICs)
Memory ICs
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Status
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Obsolete
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Package Description
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VFBGA, BGA54,9X9,32
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Brand
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HYNIX
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Sub Category
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DRAMs
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Access Mode
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FOUR BANK PAGE BURST
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Access Time-Max
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5.4 ns
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Clock Frequency-Max (fCLK)
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133 MHz
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I/O Type
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COMMON
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Interleaved Burst Length
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1,2,4,8
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JESD-30 Code
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S-PBGA-B54
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JESD-609 Code
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e1
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Memory Density
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33554432 bit
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Memory IC Type
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SYNCHRONOUS DRAM
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Memory Width
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16
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Number of Terminals
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54
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Number of Words
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2097152 words
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Number of Words Code
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2000000
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Number of Functions
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1
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Number of Ports
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1
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Organization
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2MX16
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Operating Mode
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SYNCHRONOUS
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Operating Temperature
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-40°C~85°C
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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VFBGA
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Package Equivalence Code
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BGA54,9X9,32
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, VERY THIN PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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260
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Power Supplies
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3.3 V
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Qualification Status
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Not Qualified
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Risk Rank
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5.82
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Refresh Cycles
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4096
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Rohs Code
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Yes
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Sequential Burst Length
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1,2,4,8,FP
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Standby Current-Max
|
0.002 A
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Supply Current-Max
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0.19 mA
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Supply Voltage-Nom (Vsup)
|
3.3 V
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Supply Voltage-Min (Vsup)
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3.0 V
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Supply Voltage-Max (Vsup)
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3.6 V
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Seated Height-Max
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1.0 mm
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Surface Mount
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Yes
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Technology
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CMOS
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Type
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NAND TYPE
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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Tin/Silver/Copper (Sn/Ag/Cu)
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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20
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Length
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8 mm
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Width
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8 mm
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Additional Feature
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AUTO/SELF REFRESH
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Features
There is no relevant information available for this part yet.
Advantages and Disadvantages
There is no relevant information available for this part yet.
Applications
There is no relevant information available for this part yet.
Product Functions
There is no relevant information available for this part yet.
ECCN / UNSPSC
Description
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Value
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ECCN
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EAR99
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HTSN
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8542.32.00.02
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Environmental & Export Classifications
Moisture Sensitivity Level (MSL)
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3 (168 Hours)
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Lead Free Status / RoHS Status
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Lead free / Unknown
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Documents & Media
There is no relevant information available for this part yet.
Product Manufacturer
SK hynix Inc. is a South Korean memory semiconductor supplier of dynamic random-access memory (DRAM) chips and flash memory chips. Hynix is the world's second-largest memory chipmaker (after Samsung Electronics) and the world's 3rd-largest semiconductor company.
The company’s global presence spans from four production sites in Korea and China (Icheon, Cheongju, Wuxi, and Chongqing) to five R&D centers and ten sales offices across the world. Building on its existing technological prowess, SK hynix is making relentless R&D efforts and investments to develop cutting-edge technology and cost-competitive products to attain leadership in the global semiconductor market.
Product Range
DRAM
|
NAND
|
SSD
|
CMOS Image Sensor
|
MODULE
LPDDR3/4
DDR3/4 SDRAM
GDDR5/6 SDRAM
|
UFS
eMMC
Raw NAND
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Enterprise SSD
Client SSD
SSD Consumer Site
|
-
|
Distributors
Distributor
|
Stock
|
Manufacturer
|
Descriptions
|
Kynix
|
2200 PCS
|
SK Hynix Inc
|
-
|
Sierra IC
|
4822 PCS
|
SK Hynix Inc
|
-
|
Depu Electronics
|
2500 PCS
|
SK Hynix Inc
|
2018+_FBGA_new and original
|
New Strength Electronic
|
60808 PCS
|
SK Hynix Inc
|
DC:14+ [ ] ; FBGA MC
|
Alternative Models
There is no relevant information available for this part yet.
Popularity by Region
There is no relevant information available for this part yet.
Market Price Analysis
There is no relevant information available for this part yet.
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