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H57V1262GFR-75I Datasheets| HYNIX| PDF| Price| In Stock

Author: Apogeeweb
Date: 22 Apr 2020
 1238
SK HYNIX SSD

Product Overview

Kynix Part #:

KY32-H57V1262GFR-75I

Manufacturer Part#:

H57V1262GFR-75I

Product Category:

Memory

Stock:

Yes

Manufacturer:

HYNIX

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Purchase

Description:

-

Datasheet:

H57V1262GFR-75I Datasheet

Package:

FBGA

Quantity:

2200 PCS


H57V1262GFR-75I Images are for reference only.

 H57V1262GFR-75I Image


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

VFBGA, BGA54,9X9,32

Brand

HYNIX

Sub Category

DRAMs

Access Mode

FOUR BANK PAGE BURST

Access Time-Max

5.4 ns

Clock Frequency-Max (fCLK)

133 MHz

I/O Type

COMMON

Interleaved Burst Length

1,2,4,8

JESD-30 Code

S-PBGA-B54

JESD-609 Code

e1

Memory Density

33554432 bit

Memory IC Type

SYNCHRONOUS DRAM

Memory Width

16

Number of Terminals

54

Number of Words

2097152 words

Number of Words Code

2000000

Number of Functions

1

Number of Ports

1

Organization

2MX16

Operating Mode

SYNCHRONOUS

Operating Temperature

-40°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Equivalence Code

BGA54,9X9,32

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

3.3 V

Qualification Status

Not Qualified

Risk Rank

5.82

Refresh Cycles

4096

Rohs Code

Yes

Sequential Burst Length

1,2,4,8,FP

Standby Current-Max

0.002 A

Supply Current-Max

0.19 mA

Supply Voltage-Nom (Vsup)

3.3 V

Supply Voltage-Min (Vsup)

3.0 V

Supply Voltage-Max (Vsup)

3.6 V

Seated Height-Max

1.0 mm

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

20

Length

8 mm

Width

8 mm

Additional Feature

AUTO/SELF REFRESH


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.02


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / Unknown


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

SK hynix Inc. is a South Korean memory semiconductor supplier of dynamic random-access memory (DRAM) chips and flash memory chips. Hynix is the world's second-largest memory chipmaker (after Samsung Electronics) and the world's 3rd-largest semiconductor company.

The company’s global presence spans from four production sites in Korea and China (Icheon, Cheongju, Wuxi, and Chongqing) to five R&D centers and ten sales offices across the world. Building on its existing technological prowess, SK hynix is making relentless R&D efforts and investments to develop cutting-edge technology and cost-competitive products to attain leadership in the global semiconductor market.


Product Range

DRAM

NAND

SSD

CMOS Image Sensor

MODULE

LPDDR3/4

DDR3/4 SDRAM

GDDR5/6 SDRAM

UFS

eMMC

Raw NAND

Enterprise SSD

Client SSD

SSD Consumer Site

-


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

SK Hynix Inc

-

Sierra IC

4822 PCS

SK Hynix Inc

-

Depu Electronics

2500 PCS

SK Hynix Inc

2018+_FBGA_new and original

New Strength Electronic

60808 PCS

SK Hynix Inc

DC:14+ [ ] ; FBGA MC


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

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