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HY5DU573222AFM-25 Datasheets| HYNIX| PDF| Price| In Stock

Author: Apogeeweb
Date: 21 Apr 2020
 1010
SK HYNIX SSD

Product Overview

Kynix Part #:

KY32-HY5DU573222AFM-25

Manufacturer Part#:

HY5DU573222AFM-25

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

HYNIX

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Purchase

Description:

-

Datasheet:

HY5DU573222AFM-25 Datasheet

Package:

BGA

Quantity:

2200 PCS


HY5DU573222AFM-25 Images are for reference only.

 HY5DU573222AFM-25 Image


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

LFBGA, BGA144,12X12,32

Brand

HYNIX

Sub Category

DRAMs

Access Mode

FOUR BANK PAGE BURST

Access Time-Max

0.6 ns

Clock Frequency-Max (fCLK)

400 MHz

I/O Type

COMMON

Interleaved Burst Length

2,4,8

JESD-30 Code

S-PBGA-B144

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Memory Width

32

Number of Terminals

144

Number of Words

8388608 words

Number of Words Code

8000000

Number of Functions

1

Number of Ports

1

Organization

8MX32

Operating Mode

SYNCHRONOUS

Operating Temperature

0°C~70°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA144,12X12,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Pin Count

144

Peak Reflow Temperature (Cel)

-

Power Supplies

2.8 V

Qualification Status

Not Qualified

Risk Rank

5.86

Refresh Cycles

4096

Rohs Code

No

Sequential Burst Length

2,4,8

Standby Current-Max

0.07 A

Supply Current-Max

1.1 mA

Supply Voltage-Nom (Vsup)

2.8 V

Supply Voltage-Min (Vsup)

2.55 V

Supply Voltage-Max (Vsup)

2.95 V

Seated Height-Max

1.4 mm

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

COMMERCIAL

Terminal Finish

-

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

12 mm

Width

12 mm

Additional Feature

AUTO/SELF REFRESH


Features

  • 2.5V +/- 5% VDD and VDDQ power supply supports 300/275/250MHz
  • 2.8V VDD and VDDQ wide range min/max power supply supports 400/350Mhz
  • All inputs and outputs are compatible with SSTL_2 interface
  • 12mm x 12mm, 144ball FBGA with 0.8mm pin pitch
  • Fully differential clock inputs (CK, /CK) operation
  • The signals of Chip select control the each chip with CS0 and CS1, individually.
  • Double data rate interface
  • Source synchronous - data transaction aligned to bidirectional data strobe (DQS0 ~ DQS3)
  • Data outputs on DQS edges when read (edged DQ) Data inputs on DQS centers when write (centered DQ)
  • Data(DQ) and Write masks(DM) latched on the both rising and falling edges of the data strobe
  • All addresses and control inputs except Data, Data strobes and Data masks latched on the rising edges of the clock
  • Write mask byte controls by DM (DM0 ~ DM3)
  • Programmable /CAS Latency 5 and 4,3 supported
  • Programmable Burst Length 2 / 4 / 8 with both sequential and interleave mode
  • Internal 4 bank operations with single pulsed /RAS
  • tRAS Lock-Out function supported
  • Auto refresh and self refresh supported
  • 4096 refresh cycles / 32ms (Both chips do refresh operation, simultaneously)
  • Half strength and Matched Impedance driver option controlled by EMRS

Advantages and Disadvantages

Advantages

The SK Hynix HY5DU573222AFM is a 268,435,456bit CMOS Double Data Rate(DDR) Synchronous DRAM which consists of two 128Mbit(x32) Multi chip, ideally suited for the point-to-point applications which requires high bandwidth.

The SK Hynix 8Mx32 DDR SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock.

While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the /CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it.

The data paths are internally pipelined and 2bit prefetched to achieve very high bandwidth. All input and output voltage levels are compatiblewith SSTL_2.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.24


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

SK hynix Inc. is a South Korean memory semiconductor supplier of dynamic random-access memory (DRAM) chips and flash memory chips. Hynix is the world's second-largest memory chipmaker (after Samsung Electronics) and the world's 3rd-largest semiconductor company.

The company’s global presence spans from four production sites in Korea and China (Icheon, Cheongju, Wuxi, and Chongqing) to five R&D centers and ten sales offices across the world. Building on its existing technological prowess, SK hynix is making relentless R&D efforts and investments to develop cutting-edge technology and cost-competitive products to attain leadership in the global semiconductor market.


Product Range

DRAM

NAND

SSD

CMOS Image Sensor

MODULE

LPDDR3/4

DDR3/4 SDRAM

GDDR5/6 SDRAM

UFS

eMMC

Raw NAND

Enterprise SSD

Client SSD

SSD Consumer Site

-


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

SK Hynix Inc

-

Nexxon

In Stock

SK Hynix Inc

-

Depu Electronics

15000 PCS

SK Hynix Inc

2018+_BGA_new and original

New Strength Electronic

2 PCS

SK Hynix Inc

DC:03+ ; BGA


Alternative Models

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Popularity by Region

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Market Price Analysis

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