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XPC8260ZUIHBC Datasheets| NXP| PDF| Price| In Stock

Author: Apogeeweb
Date: 14 Jan 2020
 1775
Embedded - Microprocessors


Product Overview

Kynix Part #:

KY32-XPC8260ZUIHBC

Manufacturer Part#:

XPC8260ZUIHBC

Product Category:

Embedded - Microprocessors

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

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XPC8260ZUIHBC

Purchase 

Description:

IC MPU MPC82XX 200MHZ 408TBGA

Datasheet:

XPC8260ZUIHBC Datasheet

Package:

480-LBGA

Quantity:

516 PCS


XPC8260ZUIHBC Images are for reference only.

 XPC8260ZUIHBC


CAD Models

XPC8260ZUIHBC Footprint

XPC8260ZUIHBC Footprint


Product Attributes

Additional Interfaces

I²C, SCC, SMC, SPI, UART, USART

Base Part Number

PC8260

Boundary Scan

YES

CAN

0

Categories

Integrated Circuits (ICs)

Embedded - Microprocessors

Co-Processors/DSP

Communications; RISC CPM

Core

603e

Core Processor

PowerPC G2

Data RAM Size

24 kB

Display & Interface Controllers

-

ECCN (US)

3A991.a.2

Ethernet

10/100Mbps (3)

EU RoHS

Not Compliant

Family Name

PowerQUICC II MPC82xx Processor

Graphics Acceleration

NO

HTS

8542.31.00.01

I2C

1

I2S

0

Instruction Cache Size

16KB

Instruction Set Architecture

RISC

Instruction Type

Floating Point

Integrated Cache

YES

Interface Type

Ethernet/I2C/SPI/UART

JESD-30 Code

S-PBGA-B480

L1 Cache Data Memory

16 kB

Lead Shape

Ball

Low Power Mode

NO

Manufacturer

NXP USA Inc.

Maximum Clock Frequency

200 MHz

Maximum Operating Supply Voltage (V)

1.9

Memory Type

L1 Cache, RAM

Minimum Operating Supply Voltage (V)

1.7

Mounting

Surface Mount

Mounting Style

SMD/SMT

Multiply Accumulate

No

Number of Cores/Bus Width

1 Core, 32-Bit

Number of Timers/Counters

4 Timer

On-Chip Memory

32KB/RAM

Operating Temperature

0°C ~ 105°C (TA)

Package Body Material

PLASTIC/EPOXY

Package Description

LBGA, BGA480,29X29,50

Package Height

1.05(Max)

Package Length

37.5

Package Style

GRID ARRAY, LOW PROFILE

Package Width

37.5

Packaging

Tray

Part Status

Obsolete

Pin Count

480

Qualification

AEC-Q100

RAM Controllers

DRAM, SDRAM

Risk Rank

5.79

SATA

-

Security Features

-

Series

MPC82xx

Speed

200MHz

SPI

1

Subcategory

Microprocessors

Supplier Device Package

480-TBGA (37.5x37.5)

Supplier Package

TBGA

Temperature Grade

COMMERCIAL

Terminal Form

BALL

Terminal Pitch

1.27 mm

Terminal Position

BOTTOM

Typical Operating Supply Voltage (V)

1.8

UART

3

Unit Weight

0.358491 oz

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

USART

0

USB

0

Voltage - I/O

3.3V

Watchdog Timers

No Watchdog Timer


Features

System core microprocessor supporting frequencies of 133-300 MHz

 190 MIPS at 100 MHz (Dhrystone 2.1)

 505 MIPS at 266 MHz (Dhrystone 2.1)

 570 MIPS at 300 MHz (Dhrystone 2.1)

 High-performance, superscalar microprocessor

 Disable CPU mode

 Supports the NXP® external L2 cache chip (MPC2605)

 Improved low-power core

 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative

 Memory Management Unit

 Floating point unit enabled

 Common on-chip processor (COP)

 System Integration Unit (SIU)

-Memory Controller, including two dedicated SDRAM machines

-PCI up to 66 MHz (available in subsequent versions)

-Hardware bus monitor and software watchdog timer

-IEEE 1149.1 JTAG test access port

 High-Performance Communications Processor Module (CPM) with operating frequency up to 133, 166, or 200 MHz

-G2 core and CPM may run at different frequencies

-Parallel I/0 Registers

-On-board 32 KBytes of dual-port RAM

-Two multi-channel controllers (MCCs) each supporting 128 full-duplex, 64 Kbps, HDLC lines

-Virtual DMA Functionality

 Three FCCs supporting:

-Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)

-10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)

-45 Mbps HDLC/Transparent (up to three)

 Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus

 Two UTOPIA level-2 master/slave ports, both with multi-PHY support.

 Three MII Interfaces

 Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3

 1.8V or 2.0V internal and 3.3V I/O

 300 MHz power consumption: 2.5 W

 480 TBGA package (37.5 mm x 37.5 mm)


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A001.A.3

HTSN

8542.31.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

Datasheets

MPC8260 PowerQUICC II Family

PCN Obsolescence/ EOL

EOL 01/Apr/2016


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Arm® Processors

Arm® MCUs

Power Architecture® Processors

All Processors and MCUs

Audio

Interfaces

Peripherals and Logic

Power Management

Sensors

RF

RFID/NFC

Security and Authentication


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

516 PCS

NXP Semiconductors

IC MPU MPC82XX 200MHZ 408TBGA

Digi-Key

0

NXP Semiconductors

IC MPU MPC82XX 200MHZ 480TBGA

Avnet

0

NXP Semiconductors

MPU MPC82xx RISC 32-Bit 0.29um 200MHz 3.3V 480-Pin TBGA Tray

Mouser

0

NXP Semiconductors

Microprocessors - MPU POWERQUICC II HIP3 REV C


Alternative Models

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Popularity by Region

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Market Price Analysis

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