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Jan 14 2020

K4D553235F-GC33 Datasheets| SAMSUNG| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-K4D553235F-GC33

Manufacturer Part#:

K4D553235F-GC33

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

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Description:

-

Datasheet:

K4D553235F-GC33 Datasheet

Package:

BGA

Quantity:

5362 PCS


K4D553235F-GC33 Images are for reference only.

K4D553235F-GC33 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

FBGA, BGA144,12X12,32

Brand

SAMSUNG

Sub Category

DRAMs

Access Time-Max

0.55 ns

Clock Frequency-Max (fCLK)

300 MHz

I/O Type

COMMON

Interleaved Burst Length

2,4,8

JESD-30 Code

S-PBGA-B144

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Memory Width

32

Moisture Sensitivity Level

1

Number of Terminals

144

Number of Words

8388608 words

Number of Words Code

8000000

Organization

8MX32

Operating Temperature

0°C~65°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA144,12X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Pbfree Code

No

Peak Reflow Temperature (Cel)

225

Power Supplies

1.8 V

Qualification Status

Not Qualified

Risk Rank

5.88

Refresh Cycles

4096

Rohs Code

No

Sequential Burst Length

2,4,8

Supply Current-Max

0.314 mA

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

COMMERCIAL

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED


Features

  • 1.8V + 0.1V power supply for device operation

  • 1.8V + 0.1V power supply for I/O interface

  • SSTL_18 compatible inputs/outputs

  • 4 banks operation

  • MRS cycle with address key program

      Burst latency 4, 5 and 6 (clock)

      Burst length (2, 4, and 8)

      Burst type (sequential & interleave)

  • All inputs except data & DM are sampled at rhe positive going edge of the system clock

  • Different clock input

  • No Write-Interrupted by Read Function

  • 4 DQS's (1DQS / Byte)

  • Data I/O transaction on both edge of Data strobe

  • DLL aligned data & data strobe output

  • Center aligned data & data strobe input

  • DM for write masking only

  • Auto & Self refresh

  • 32ms refresh period (4K cycle)

  • 144-Ball FBGA

  • Maximum clock frequency up to 450 MHz

  • Maximum data rate up to 900Mbps/pin


Advantages and Disadvantages

Advantages

The K4D553235F is 268,435,456 bits of hyper synchronous data rate Dynamic RAM organized as 4x2,097,152 words by 32 bits, fabricated with SAMSUNG's high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to 3.6GB/s/chip. I/O transactions are possible on both edge of the clock cycle. Range of operating frequencies, programmable burst and programmable latencies allow the device to be useful for a variety of high performance memory system applications.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / Unconfirmed


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

5362 PCS

Samsung Semiconductor

-

C Plus Electronics

26 PCS

Samsung Semiconductor

-

Chipsea Electronics

30169 PCS

Samsung Semiconductor

-

America II Electronics

299 PCS

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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