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K6F4016U6D-FF70 Datasheets| SAMSUNG| PDF| Price| In Stock

Author: Apogeeweb
Date: 8 Jan 2020
 1029
IC Chips

Product Overview

Kynix Part #:

KY32-K6F4016U6D-FF70

Manufacturer Part#:

K6F4016U6D-FF70

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

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Description:

-

Datasheet:

K6F4016U6D-FF70 Datasheet

Package:

TBGA

Quantity:

4200 PCS


K6F4016U6D-FF70 Images are for reference only.

K6F4016U6D-FF70 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

REACH Compliant

Yes

Status

Obsolete

Package Description

6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48

Brand

SAMSUNG

Sub Category

SRAMs

Access Time-Max

70 ns

I/O Type

COMMON

JESD-30 Code

R-PBGA-B48

JESD-609 Code

e0

Memory Density

4194304 bit

Memory IC Type

STANDARD SRAM

Memory Width

16

Number of Terminals

48

Number of Words

262144 words

Number of Words Code

256000

Number of Functions

1

Organization

256KX16

Operating Mode

ASYNCHRONOUS

Operating Temperature

-40°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Parallel/Serial

PARALLEL

Package Equivalence Code

BGA48,6X8,30

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

3.0 V

Qualification Status

Not Qualified

Risk Rank

5.89

Rohs Code

No

Standby Voltage-Min

1.5 V

Standby Current-Max

0.000003 A

Supply Current-Max

0.04 mA

Supply Voltage-Nom (Vsup)

3.0 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Max (Vsup)

3.3 V

Seated Height-Max

1.2 mm

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

BALL

Terminal Pitch

0.75 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

8.5 mm

Width

6.1 mm


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.B.2.A

HTSN

8542.32.00.41


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / Unconfirmed


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

3200 PCS

Samsung Semiconductor

-

Vyrian

908 PCS

Samsung Semiconductor

-

Nexxon

In Stock

Samsung Semiconductor

-

Chipsea Electronics

56559 PCS

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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