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K4X56323PI Datasheets| SAMSUNG| PDF| Price| In Stock

Author: Apogeeweb
Date: 6 Jan 2020
 1550
Memory

Product Overview

Kynix Part #:

KY32-K4X56323PI

Manufacturer Part#:

K4X56323PI

Product Category:

Memory

Stock:

Yes

Manufacturer:

SAMSUNG

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Purchase 

Description:

-

Datasheet:

K4X56323PI Datasheet

Package:

BGA

Quantity:

3200 PCS


K4X56323PI Images are for reference only.

K4X56323PI Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

LEAD FREE, FBGA-90

Brand

SAMSUNG

Sub Category

DRAMs

Access Mode

FOUR BANK PAGE BURST

Access Time-Max

5.5 ns

Clock Frequency-Max (fCLK)

166 MHz

I/O Type

COMMON

Interleaved Burst Length

2,4,8,16

JESD-30 Code

R-PBGA-B90

JESD-609 Code

e1

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Memory Width

32

Moisture Sensitivity Level

3

Number of Terminals

90

Number of Words

8388608 words

Number of Words Code

8000000

Number of Functions

1

Number of Ports

1

Organization

8MX32

Operating Mode

SYNCHRONOUS

Operating Temperature

-25°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Equivalence Code

BGA90,9X15,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Pin Count

90

Peak Reflow Temperature (Cel)

260

Power Supplies

1.8 V

Qualification Status

Not Qualified

Risk Rank

5.84

Refresh Cycles

4096

Rohs Code

Yes

Sequential Burst Length

2,4,8,16

Standby Current-Max

0.00001 A

Supply Current-Max

0.14 mA

Supply Voltage-Max (Vsup)

1.95 V

Supply Voltage-Min (Vsup)

1.70 V

Supply Voltage-Nom (Vsup)

1.80 V

Seated Height-Max

1.0 mm

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

13 mm

Width

8 mm

Additional Feature

AUTO/SELF REFRESH


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

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Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.24


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

3200 PCS

Samsung Semiconductor

-

New Strength Electronic

300 PCS

Samsung Semiconductor

DC:0825+ ; BGA


Alternative Models

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Popularity by Region

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Market Price Analysis

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