Product Overview
Kynix Part #: | KY32-MK60DX256VMD10 |
Manufacturer Part#: | MK60DX256VMD10 |
Product Category: | Embedded - Microcontrollers |
Stock: | Yes |
Manufacturer: | Freescale Semiconductor - NXP |
Click Purchase button to buy original genuine MK60DX256VMD10 |
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Description: | IC MCU 32BIT 256KB FLASH 144BGA |
Datasheet: | MK60DX256VMD10 Datasheet |
Package: | 144-LBGA |
Quantity: | 577 PCS |
MK60DX256VMD10 Images are for reference only:
CAD Models
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Product Attributes
Manufacturer: | Freescale Semiconductor - NXP |
Product Category: | Embedded - Microcontrollers |
Status: | Active |
Series: | Kinetis K60 |
ADC Resolution: | 16 bit |
Address Bus Width: | 0.0 |
Analog Comparators: | 3 |
Bit Size: | 32 |
Core Size: | 32-Bit |
Core Processor: | ARM® Cortex®-M4 |
CPU Family: | CORTEX-M4 |
Connectivity: | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
Core Architecture: | ARM |
Clock Frequency-Max: | 32.0 MHz |
Device Core: | ARM Cortex M4 |
DAC Channels: | Yes |
DAC Resolution: | 12 bit |
DMA Channels: | Yes |
Data Bus Width: | 32 bit |
Data RAM Type: | SRAM |
Data Converters: | A/D 42x16b; D/A 2x12b |
EEPROM Size: | 4K x 8 |
EU RoHS Compliant: | Yes |
External Data Bus Width: | 0.0 |
Frequency: | 100 MHz |
Family Name: | K60 |
Interface Type: | CAN, I2C, I2S, SPI, UART |
Instruction Set Architecture: | RISC |
JESD-30 Code: | S-PBGA-B144 |
Length: | 13.0 mm |
Lead Finish: | Tin/Silver/Copper |
Lead Shape: | Ball |
Mounting Type: | Surface Mount |
Mounting Style: | SMD/SMT |
Maximum CPU Frequency: | 100 MHz |
Maximum Clock Frequency: | 100 MHz |
Number of I/Os: | 100 |
Number of Pins: | 144 |
Number of ADCs: | Dual |
Number of DACs: | Dual |
Number of Timers: | 3 |
Number of I/O Lines: | 97.0 |
Number of Terminals: | 144 |
Number of SPI Channels: | 3 |
Number of I2C Channels: | 2 |
Number of USB Channels: | 1 |
Number of PWM Channels: | 8 |
Number of UART Channels: | 6 |
Number of Ethernet Channels: | 1 |
Oscillator Type: | Internal |
Operating Temperature-Min: | -40°C |
Operating Temperature-Max: | 105°C |
Pin Count: | 144 |
Peripherals: | DMA, I²S, LCD, LVD, POR, PWM, WDT |
PCB changed: | 144 |
Product Type: | ARM Microcontrollers - MCU |
PWM Channels: | Yes |
Power Supplies: | 1.8/3.3 |
Package/Case: | 144-LBGA |
Package Style: | GRID ARRAY, LOW PROFILE |
Package Code: | LBGA |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA144,12X12,40 |
Peak Reflow Temperature: | 260°C |
Programmability: | Yes |
Program Memory Size: | 256KB (256K x 8) |
Program Memory Type: | Flash |
RAM Size: | 64K x 8 |
RAM (bytes): | 65536.0 |
ROM (words): | 262144 |
ROM Programmability: | FLASH |
Speed: | 100.0 MHz |
Sub Category: | Microcontrollers |
Surface Mount: | Yes |
Special Features: | CAN Controller |
Seated Height-Max: | 1.7 mm |
Supply Current-Max: | 77.0 mA |
Supply Voltage-Nom: | 3.3 V |
Supply Voltage-Min: | 1.71 V |
Supply Voltage-Max: | 3.6 V |
Supplier Device Package: | 144-MAPBGA (13x13) |
Tradename: | Kinetis |
Technology: | CMOS |
Terminal Pitch: | 1.0 mm |
Terminal Form: | BALL |
Terminal Finish: | Tin/Silver/Copper - with Nickel barrier |
Terminal Position: | BOTTOM |
Temperature Grade: | INDUSTRIAL |
Time@Peak Reflow Temperature-Max: | 40 s |
Unit Weight: | 0.015556 oz |
Width: | 13.0 mm |
Watchdog: | 1 |
Product Features
• Core:
• ARM Cortex-M4 Core delivering 1.25 DMIPS/MHz with DSP instructions (floating-point unit available on certain Kinetis families)
• Up to 32-channel DMA for peripheral and memory servicing with minimal CPU intervention
• Broad range of performance levels rated at maximum CPU frequencies of 50 MHz, 72 MHz, 100 MHz, 120 MHz, and 150 MHz
• Ultra-low power:
• 10 low power operating modes for optimizing peripheral activity and wake-up times for extended battery life.
• Low–leakage wake-up unit, low power timer, and low power RTC for additional low power flexibility
• Industry-leading fast wake-up times
• Memory:
• Scalable memory footprints from 32 KB flash / 8 KB RAM to 1 MB flash / 128 KB RAM. Independent flash banks enable concurrent code execution and firmware updates
• Optional 16 KB cache memory for optimizing bus bandwidth and flash execution performance. Offered on K10, K20, and K60 family devices with CPU performance of up to 150 MHz.
• FlexMemory with up to 512 KB FlexNVM and up to 16 KB FlexRAM. FlexNVM can be partitioned to support additional program flash memory (ex. bootloader), data flash (ex. storage for large tables), or EEPROM backup. FlexRAM supports EEPROM byte-write/byte-erase operations and dictates the maximum EEPROM size.
• EEPROM endurance capable of exceeding 10 million cycles
• EEPROM erase/write times an order of magnitude faster than traditional EEPROM
• Multi-function external bus interface capable of interfacing to external memories, gate-array logic, or an LCD
• Mixed-signal analog:
• Fast, high precision 16-bit ADCs, 12-bit DACs, programmable gain amplifiers, high speed comparators and an internal voltage reference. Powerful signal conditioning, conversion and analysis capability with reduced system cost
• Human Machine Interface (HMI):
• Capacitive Touch Sensing Interface with full low-power support and minimal current adder when enabled
• Connectivity and Communications:
• UARTs with ISO7816 and IrDA support, I2S, CAN, I2C and DSPI
• USB OTG controller
• Reliability, Safety and Security:
• Hardware cyclic redundancy check engine for validating memory contents/communication data and increased system reliability
• Independent-clocked COP for protection against code runaway in fail-safe applications
• External watchdog monitor
• Timing and Control:
• Powerful FlexTimers which support general purpose, PWM, and motor control functions
• Carrier Modulator Transmitter for IR waveform generation
• Programmable Interrupt Timer for RTOS task scheduler time base or trigger source for ADC conversion and programmable delay block
• System:
• 5 V tolerant GPIO with pin interrupt functionality
• Wide operating voltage range from 1.71 V to 3.6 V with flash programmable down to 1.71 V with fully functional flash and analog peripherals
• Ambient operating temperature ranges from -40 °C to 105 °C
Applications
There is no relevant information available for this part yet.
Advantages and Disadvantages
There is no relevant information available for this part yet.
ECCN / UNSPSC
ECCN: | 3A991.A.2 |
HTSN: | 8542310001 |
SCHEDULE B: | 8542310000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3(168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
USHTS: | 8542310001 |
CAHTS: | 8542310000 |
CNHTS: | 8542319000 |
JPHTS: | 8542310394 |
KRHTS: | 8542311000 |
MXHTS: | 85423102 |
TARIC: | 8542319000 |
REACH SVHC: | No SVHC |
Halogen Free: | Halogen Free |
Radiation Hardening: | No |
Documents & Media
Product Manufacturer
NXP Semiconductor enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries.
Product Range
ARM ® PROCESSORS | ANALOG | POWER ARCHITECTURE ®PROCESSORS |
MEDIA AND AUDIO | RF | IDENTIFICATION & SECURITY |
Sensors | Wireless | Automotive Products |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 577 | Freescale Semiconductor - NXP | IC MCU 32BIT 256KB FLASH 144BGA |
DigiKey | 115 | NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA |
Mouser | 100 | NXP Semiconductors | ARM Microcontrollers - MCU KINETIS 256K FLEX ENET |
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