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MPC8272VRPIEA Datasheets| Freescale Semiconductor - NXP| PDF| Price| In Stock

Author: Apogeeweb
Date: 26 Dec 2019
 1593
Embedded - Microprocessors

Product Overview

Kynix Part #:

KY32-MPC8272VRPIEA

Manufacturer Part#:

MPC8272VRPIEA

Product Category:

Embedded - Microprocessors

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

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Purchase 

Description:

IC MPU MPC82XX 300MHZ 516BGA

Datasheet:

MPC8272VRPIEA Datasheet

Package:

516-BBGA

Quantity:

930 PCS


MPC8272VRPIEA Images are for reference only.

MPC8272VRPIEA Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs) Embedded - Microprocessors

Manufacturer

NXP USA Inc.

Series

MPC82xx

Packaging

Tray

Part Status

Active

Core Processor

PowerPC G2_LE

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

300MHz

Co-Processors/DSP

Communications; RISC CPM, Security; SEC

RAM Controllers

DRAM, SDRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100Mbps (2)

SATA

-

USB

USB 2.0 (1)

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 105°C (TA)

Security Features

Cryptography, Random Number Generator

Package / Case

516-BBGA

Supplier Device Package

516-FPBGA (27x27)

Additional Interfaces

I²C, SCC, SMC, SPI, UART, USART

Base Part Number

MPC8272

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

JESD-30 Code

S-PBGA-B516

JESD-609 Code

e2

Moisture Sensitivity Level

3

Number of Terminals

516

Operating Temperature-Min

0.0  Cel

Operating Temperature-Max

70.0  Cel

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA516,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

245

Power Supplies

1.5,3.3

Qualification Status

Not Qualified

Sub Category

Other uPs/uCs/Peripheral ICs

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

TIN COPPER/TIN SILVER

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30


Features

The major features of the SoC are as follows:

• Dual-issue integer (G2_LE) core

— A core version of the MPC603e microprocessor

— System core microprocessor supporting frequencies of 266–400 MHz

— Separate 16 KB data and instruction caches:

– Four-way set associative

– Physically addressed

– LRU replacement algorithm

— Power Architecture®-compliant memory management unit (MMU)

— Common on-chip processor (COP) test interface

— Supports bus snooping for cache coherency

— Floating-point unit (FPU) supports floating-point arithmetic

— Support for cache locking

• Low-power consumption

• Separate power supply for internal logic (1.5 V) and for I/O (3.3 V)

• Separate PLLs for G2_LE core and for the communications processor module (CPM)

— G2_LE core and CPM can run at different frequencies for power/performance optimization

— Internal core/bus clock multiplier that provides ratios 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, 5.5:1, 6:1, 7:1, 8:1

— Internal CPM/bus clock multiplier that provides ratios 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1, 8:1 ratios

• 64-bit data and 32-bit address 60x bus

— Bus supports multiple master designs—up to two external masters

— Supports single transfers and burst transfers

— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller

• 60x-to-PCI bridge

— Programmable host bridge and agent

— 32-bit data bus, 66 MHz, 3.3 V

— Synchronous and asynchronous 60x and PCI clock modes

— All internal address space available to external PCI host

— DMA for memory block transfers

– PCI-to-60x address remapping

• System interface unit (SIU)

— Clock synthesizer

— Reset controller

— Real-time clock (RTC) register

— Periodic interrupt timer

— Hardware bus monitor and software watchdog timer

— IEEE 1149.1 JTAG test access port

• Eight bank memory controller

— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash, and other user-definable peripherals

— Byte write enables

— 32-bit address decodes with programmable bank size

— Three user-programmable machines, general-purpose chip-select machine, and page mode pipeline SDRAM machine

— Byte selects for 64-bit bus width (60x)

— Dedicated interface logic for SDRAM

• Disable CPU mode

• Integrated security engine (SEC) (MPC8272 and MPC8248 only)

— Supports DES, 3DES, MD-5, SHA-1, AES, PKEU, RNG and RC-4 encryption algorithms in hardware

• Communications processor module (CPM)

— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for communications peripherals

— Interfaces to G2_LE core through on-chip dual-port RAM and DMA controller. (Dual-port RAM size is 16 KB plus 4 KB dedicated instruction RAM.)

— Microcode tracing capabilities

— Eight CPM trap registers

• Universal serial bus (USB) controller

— Supports USB 2.0 full/low rate compatible

— USB host mode

– Supports control, bulk, interrupt, and isochronous data transfers

– CRC16 generation and checking

– NRZI encoding/decoding with bit stuffing

– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data rate configuration). Note that low-speed operation requires an external hub.

– Flexible data buffers with multiple buffers per frame

– Supports local loopback mode for diagnostics (12 Mbps only)

— Supports USB slave mode

– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers

– CRC16 generation and checking

– CRC5 checking

– NRZI encoding/decoding with bit stuffing

– 12- or 1.5-Mbps data rate

– Flexible data buffers with multiple buffers per frame

– Automatic retransmission upon transmit error

— Serial DMA channels for receive and transmit on all serial channels

— Parallel I/O registers with open-drain and interrupt capability

— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers

— Two fast communication controllers (FCCs) supporting the following protocols:

– 10-/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII)

– Transparent

– HDLC—up to T3 rates (clear channel)

– One of the FCCs supports ATM (MPC8272 and MPC8271 only)—full-duplex SAR at 155 Mbps, 8-bit UTOPIA interface 31 Mphys, AAL5, AAL1, AAL2, AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 64-K external connections

— Three serial communications controllers (SCCs) identical to those on the MPC860 supporting the digital portions of the following protocols:

– Ethernet/IEEE 802.3 CDMA/CS

– HDLC/SDLC and HDLC bus

– Universal asynchronous receiver transmitter (UART)

– Synchronous UART

– Binary synchronous (BiSync) communications

– Transparent

– QUICC multichannel controller (QMC) up to 64 channels

• Independent transmit and receive routing, frame synchronization.

• Serial-multiplexed (full-duplex) input/output 2048, 1544, and 1536 Kbps PCM highways

• Compatible with T1/DS1 24-channel and CEPT E1 32-channel PCM highway, ISDN basic rate, ISDN primary rate, and user defined.

• Subchanneling on each time slot.

• Independent transmit and receive routing, frame synchronization and clocking

• Concatenation of any not necessarily consecutive time slots to channels independently for receiver/transmitter

• Supports H1,H11, and H12 channels

• Allows dynamic allocation of channels

– SCC3 in NMSI mode is not usable when USB is enabled.

— Two serial management controllers (SMCs), identical to those of the MPC860

– Provides management for BRI devices as general-circuit interface (GCI) controllers in time-division-multiplexed (TDM) channels

– Transparent

– UART (low-speed operation)

— One serial peripheral interface identical to the MPC860 SPI

— One I2C controller (identical to the MPC860 I2C controller)

– Microwire compatible

– Multiple-master, single-master, and slave modes

— Up to two TDM interfaces

– Supports one groups of two TDM channels

– 1024 bytes of SI RAM

— Eight independent baud rate generators and 14 input clock pins for supplying clocks to FCC, SCC, SMC, and USB serial channels

— Four independent 16-bit timers that can be interconnected as two 32-bit timers

• PCI bridge

— PCI Specification revision 2.2-compliant and supports frequencies up to 66 MHz

— On-chip arbitration

— Support for PCI to 60x memory and 60x memory to PCI streaming

— PCI host bridge or peripheral capabilities

— Includes four DMA channels for the following transfers:

– PCI-to-60x to 60x-to-PCI

– 60x-to-PCI to PCI-to-60x

– PCI-to-60x to PCI-to-60x

– 60x-to-PCI to 60x-to-PCI

— Includes the configuration registers required by the PCI standard (which are automatically loaded from the EPROM to configure the MPC8272) and message and doorbell registers

— Supports the I2O standard

— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0 August 3, 1998)

— Support for 66 MHz, 3.3 V specification

— 60x-PCI bus core logic, which uses a buffer pool to allocate buffers for each port


Advantages and Disadvantages

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Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

5A002.A.1

HTSN

8542310001

SCHEDULE B

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / ROHS3 Compliant


Documents & Media

Datasheets

MPC8272 PowerQUICC II Family
MPC8272 Fact Sheet
MPC8272 PowerQUICC ll Family Errata

Environmental Information

NXP RoHS3 Cert

Design Resources

Development Tool Selector


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.


Product Range

Devices

Boards

Developer Tools

ARM ® PROCESSORS

AUTOMOTIVE PRODUCTS

IDENTIFICATION & SECURITY

Kinetis Cortex®-M Microcontrollers

In-Vehicle Network

NFC

LPC Cortex-M Microcontrollers

Microcontrollers and Processors

RFID


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

930 PCS

Freescale Semiconductor - NXP

IC MPU MPC82XX 300MHZ 516BGA

Digi-Key

Non-stock

NXP USA Inc.

IC MPU MPC82XX 300MHZ 516BGA

Avnet

Non-stock

NXP

MPU MPC82xx RISC 32-Bit 0.13um 300MHz 3.3V 516-Pin TEPBGA Tray

Mouser

Non-stock

NXP Semiconductors

 

Microprocessors - MPU 300 MHz 570 MIPS


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

MPC8272VRPIEA Popularity by Region 

MPC8272VRPIEA Popularity by Region


Market Price Analysis

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