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Dec 26 2019

TMS320F28235ZJZS Datasheets| Texas Instruments| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-TMS320F28235ZJZS

Manufacturer Part#:

TMS320F28235ZJZS

Product Category:

Embedded - Microcontrollers

Stock:

Yes

Manufacturer:

Texas Instruments

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Description:

IC MCU 32BIT 512KB FLASH 176BGA

Datasheet:

TMS320F28235ZJZS Datasheet

Package:

BGA

Quantity:

57 PCS


TMS320F28235ZJZS Images are for reference only.

 TMS320F28235ZJZS Image


CAD Models

TMS320F28235ZJZS Symbol 

TMS320F28235ZJZS Symbol

 TMS320F28235ZJZS Footprint

TMS320F28235ZJZS Footprint


Product Attributes

Categories

Integrated Circuits (ICs) Embedded - Microcontrollers

Manufacturer

Texas Instruments

Series

C2000™ C28x Delfino™

Packaging

Tray

Part Status

Active

Core Processor

C28x

Core Size

32-Bit

Speed

150MHz

Connectivity

CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART

Peripherals

DMA, POR, PWM, WDT

Number of I/O

88

Program Memory Size

512KB (256K x 16)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

34K x 16

Voltage - Supply (Vcc/Vdd)

1.805V ~ 1.995V

Data Converters

A/D 16x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

176-BGA

Supplier Device Package

176-BGA (15x15)

Base Part Number

TMS320F28235

Mfr Package Description

BGA-176

REACH Compliant

Yes

EU RoHS Compliant

Yes

China RoHS Compliant

Yes

Status

Active

Address Bus Width

20.0

Barrel Shifter

NO

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

150.0  MHz

External Data Bus Width

32.0

Format

FIXED POINT

Integrated Cache

NO

Internal Bus Architecture

MULTIPLE

JESD-30 Code

S-PBGA-B176

JESD-609 Code

e1

Low Power Mode

YES

Moisture Sensitivity Level

3

Number of DMA Channels

6.0

Number of External Interrupts

8.0

Number of Terminals

176

Number of Timers

21.0

On Chip Data RAM Width

16

On Chip Program ROM Width

16.0

Operating Temperature-Min

-40.0  Cel

Operating Temperature-Max

125.0  Cel

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA176,14X14,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

260

Power Supplies

1.9,3.3

PWM Channels

12

Qualification Status

Not Qualified

RAM (words)

68

ROM Programmability

FLASH

Seated Height-Max

2.05  mm

Sub Category

Digital Signal Processors

Supply Current-Max

315.0  mA

Supply Voltage-Nom

1.9  V

Supply Voltage-Min

1.805  V

Supply Voltage-Max

1.995  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

15.0  mm

Width

15.0  mm

Additional Feature

ALSO OPERATES AT 3.3V SUPPLY


Features

• High-performance static CMOS technology

– Up to 150 MHz (6.67-ns cycle time)

– 1.9-V/1.8-V core, 3.3-V I/O design

• High-performance 32-bit CPU (TMS320C28x)

– IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)

– 16 × 16 and 32 × 32 MAC operations

– 16 × 16 dual MAC

– Harvard bus architecture

– Fast interrupt response and processing

– Unified memory programming model

– Code-efficient (in C/C++ and Assembly)

• Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)

• 16-bit or 32-bit External Interface (XINTF)

– More than 2M × 16 address reach

• On-chip memory

– F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM

– F28334, F28234: 128K × 16 flash, 34K × 16 SARAM

– F28332, F28232: 64K × 16 flash, 26K × 16 SARAM

– 1K × 16 OTP ROM

• Boot ROM (8K × 16)

– With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)

– Standard math tables

• Clock and system control

– On-chip oscillator

– Watchdog timer module

• GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts

• Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts

• 128-bit security key/lock

– Protects flash/OTP/RAM blocks

– Prevents firmware reverse-engineering

• Enhanced control peripherals

– Up to 18 PWM outputs

– Up to 6 HRPWM outputs with 150-ps MEP resolution

– Up to 6 event capture inputs

– Up to 2 Quadrature Encoder interfaces

– Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)

– Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)

• Three 32-bit CPU timers

• Serial port peripherals

– Up to 2 CAN modules

– Up to 3 SCI (UART) modules

– Up to 2 McBSP modules (configurable as SPI)

– One SPI module

– One Inter-Integrated Circuit (I2C) bus

• 12-bit ADC, 16 channels

– 80-ns conversion rate

– 2 × 8 channel input multiplexer

– Two sample-and-hold

– Single/simultaneous conversions

– Internal or external reference

• Up to 88 individually programmable, multiplexed GPIO pins with input filtering

• JTAG boundary scan support

– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

• Advanced emulation features

– Analysis and breakpoint functions

– Real-time debug using hardware

• Development support includes

– ANSI C/C++ compiler/assembler/linker

– Code Composer Studio™ IDE

– DSP/BIOS™ and SYS/BIOS

– Digital motor control and digital power software libraries

• Low-power modes and power savings

– IDLE, STANDBY, HALT modes supported

– Disable individual peripheral clocks

• Endianness: Little endian

• Package options:

– Lead-free, green packaging

– 176-ball plastic Ball Grid Array (BGA) (ZJZ)

– 179-ball MicroStar BGA™ (ZHH)

– 176-pin Low-Profile Quad Flatpack (LQFP) (PGF)

– 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)

• Temperature options:

– A: –40°C to 85°C (PGF, ZHH, ZJZ)

– S: –40°C to 125°C (PTP, ZJZ)

– Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

• Advanced Driver Assistance Systems (ADAS)

• Building automation

• Electronic point of sale

• Electric Vehicle/Hybrid Electric Vehicle (EV/HEV) powertrain

• Factory automation

• Grid infrastructure

• Industrial transport

• Medical, healthcare and fitness

• Motor drives

• Power delivery

• Telecom infrastructure

• Test and measurement


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A001.A.3

HTSN

8542310001

SCHEDULE B

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / ROHS3 Compliant


Documents & Media

Datasheets

TMS320F2833x, 2823x Datasheet

Product Training Modules

Microcontrollers: ControlSUITE - Comprehensive software for the entire design process
TPS75005 Single IC Power for C2000 MCU
Intro to Timers and Clocks

Video File

Let TI and MathWorks help you launch your next motor control design - in cooperation with Digi-Key

Design Resources

Development Tool Selector

PCN Design/Specification

Mechanical Spec Change 22/Apr/2019
Mult Dev Datasheet Chg 7/Aug/2019

PCN Assembly/Origin

Wafer Fab Site 27/Apr/2016

Manufacturer Product Page

TMS320F28235ZJZS Specifications

EDA / CAD Models 

Download from Ultra Librarian

Online Catalog

TMS320F28x3x Delfino™


Product Manufacturer

Texas Instruments Inc. (TI) is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. Its headquarters are in Dallas, Texas, United States. TI is one of the top ten semiconductor companies worldwide, based on sales volume. Texas Instruments's focus is on developing analog chips and embedded processors, which accounts for more than 80% of their revenue. TI also produces TI digital light processing (DLP) technology and education technology products including calculators, microcontrollers and multi-core processors. To date, TI has more than 43,000 patents worldwide.


Product Range

Devices

Boards

Developer Tools

ARM ® PROCESSORS

AUTOMOTIVE PRODUCTS

IDENTIFICATION & SECURITY

Kinetis Cortex®-M Microcontrollers

In-Vehicle Network

NFC

LPC Cortex-M Microcontrollers

Microcontrollers and Processors

RFID


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

57 PCS

Texas Instruments

IC MCU 32BIT 512KB FLASH 176BGA

Digi-Key

250 PCS

Texas Instruments

IC MCU 32BIT 512KB FLASH 176BGA

Avnet

Non-stock

Texas Instruments

MCU 32-Bit C2000 C28x RISC 512KB Flash 1.9V/3.3V 176-Pin BGA

Mouser

341 PCS

Texas Instruments

Digital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

TMS320F28235ZJZS Popularity by Region 

TMS320F28235ZJZS Popularity by Region


Market Price Analysis

 TMS320F28235ZJZS Market Price Analysis

TMS320F28235ZJZS Market Price Analysis


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