Product Overview
Kynix Part #: | KY32-TMS320F28235ZJZS |
Manufacturer Part#: | TMS320F28235ZJZS |
Product Category: | Embedded - Microcontrollers |
Stock: | Yes |
Manufacturer: | Texas Instruments |
Click Purchase button to buy original genuine TMS320F28235ZJZS | |
Description: | IC MCU 32BIT 512KB FLASH 176BGA |
Datasheet: | TMS320F28235ZJZS Datasheet |
Package: | BGA |
Quantity: | 57 PCS |
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - Microcontrollers |
Manufacturer | Texas Instruments |
Series | C2000™ C28x Delfino™ |
Packaging | Tray |
Part Status | Active |
Core Processor | C28x |
Core Size | 32-Bit |
Speed | 150MHz |
Connectivity | CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART |
Peripherals | DMA, POR, PWM, WDT |
Number of I/O | 88 |
Program Memory Size | 512KB (256K x 16) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 34K x 16 |
Voltage - Supply (Vcc/Vdd) | 1.805V ~ 1.995V |
Data Converters | A/D 16x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 125°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 176-BGA |
Supplier Device Package | 176-BGA (15x15) |
Base Part Number | TMS320F28235 |
Mfr Package Description | BGA-176 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
China RoHS Compliant | Yes |
Status | Active |
Address Bus Width | 20.0 |
Barrel Shifter | NO |
Bit Size | 32 |
Boundary Scan | YES |
Clock Frequency-Max | 150.0 MHz |
External Data Bus Width | 32.0 |
Format | FIXED POINT |
Integrated Cache | NO |
Internal Bus Architecture | MULTIPLE |
JESD-30 Code | S-PBGA-B176 |
JESD-609 Code | e1 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of DMA Channels | 6.0 |
Number of External Interrupts | 8.0 |
Number of Terminals | 176 |
Number of Timers | 21.0 |
On Chip Data RAM Width | 16 |
On Chip Program ROM Width | 16.0 |
Operating Temperature-Min | -40.0 Cel |
Operating Temperature-Max | 125.0 Cel |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA176,14X14,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.9,3.3 |
PWM Channels | 12 |
Qualification Status | Not Qualified |
RAM (words) | 68 |
ROM Programmability | FLASH |
Seated Height-Max | 2.05 mm |
Sub Category | Digital Signal Processors |
Supply Current-Max | 315.0 mA |
Supply Voltage-Nom | 1.9 V |
Supply Voltage-Min | 1.805 V |
Supply Voltage-Max | 1.995 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | AUTOMOTIVE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Pitch | 1.0 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 15.0 mm |
Width | 15.0 mm |
Additional Feature | ALSO OPERATES AT 3.3V SUPPLY |
Features
• High-performance static CMOS technology
– Up to 150 MHz (6.67-ns cycle time)
– 1.9-V/1.8-V core, 3.3-V I/O design
• High-performance 32-bit CPU (TMS320C28x)
– IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
– 16 × 16 and 32 × 32 MAC operations
– 16 × 16 dual MAC
– Harvard bus architecture
– Fast interrupt response and processing
– Unified memory programming model
– Code-efficient (in C/C++ and Assembly)
• Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
• 16-bit or 32-bit External Interface (XINTF)
– More than 2M × 16 address reach
• On-chip memory
– F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM
– F28334, F28234: 128K × 16 flash, 34K × 16 SARAM
– F28332, F28232: 64K × 16 flash, 26K × 16 SARAM
– 1K × 16 OTP ROM
• Boot ROM (8K × 16)
– With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
– Standard math tables
• Clock and system control
– On-chip oscillator
– Watchdog timer module
• GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
• Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
• 128-bit security key/lock
– Protects flash/OTP/RAM blocks
– Prevents firmware reverse-engineering
• Enhanced control peripherals
– Up to 18 PWM outputs
– Up to 6 HRPWM outputs with 150-ps MEP resolution
– Up to 6 event capture inputs
– Up to 2 Quadrature Encoder interfaces
– Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)
– Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
• Three 32-bit CPU timers
• Serial port peripherals
– Up to 2 CAN modules
– Up to 3 SCI (UART) modules
– Up to 2 McBSP modules (configurable as SPI)
– One SPI module
– One Inter-Integrated Circuit (I2C) bus
• 12-bit ADC, 16 channels
– 80-ns conversion rate
– 2 × 8 channel input multiplexer
– Two sample-and-hold
– Single/simultaneous conversions
– Internal or external reference
• Up to 88 individually programmable, multiplexed GPIO pins with input filtering
• JTAG boundary scan support
– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
• Advanced emulation features
– Analysis and breakpoint functions
– Real-time debug using hardware
• Development support includes
– ANSI C/C++ compiler/assembler/linker
– Code Composer Studio™ IDE
– DSP/BIOS™ and SYS/BIOS
– Digital motor control and digital power software libraries
• Low-power modes and power savings
– IDLE, STANDBY, HALT modes supported
– Disable individual peripheral clocks
• Endianness: Little endian
• Package options:
– Lead-free, green packaging
– 176-ball plastic Ball Grid Array (BGA) (ZJZ)
– 179-ball MicroStar BGA™ (ZHH)
– 176-pin Low-Profile Quad Flatpack (LQFP) (PGF)
– 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
• Temperature options:
– A: –40°C to 85°C (PGF, ZHH, ZJZ)
– S: –40°C to 125°C (PTP, ZJZ)
– Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)
Advantages and Disadvantages
There is no relevant information available for this part yet.
Applications
• Advanced Driver Assistance Systems (ADAS)
• Building automation
• Electronic point of sale
• Electric Vehicle/Hybrid Electric Vehicle (EV/HEV) powertrain
• Factory automation
• Grid infrastructure
• Industrial transport
• Medical, healthcare and fitness
• Motor drives
• Power delivery
• Telecom infrastructure
• Test and measurement
Product Functions
There is no relevant information available for this part yet.
ECCN / UNSPSC
Description | Value |
ECCN | 3A001.A.3 |
HTSN | 8542310001 |
SCHEDULE B | 8542310000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Lead free / ROHS3 Compliant |
Documents & Media
Product Manufacturer
Texas Instruments Inc. (TI) is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. Its headquarters are in Dallas, Texas, United States. TI is one of the top ten semiconductor companies worldwide, based on sales volume. Texas Instruments's focus is on developing analog chips and embedded processors, which accounts for more than 80% of their revenue. TI also produces TI digital light processing (DLP) technology and education technology products including calculators, microcontrollers and multi-core processors. To date, TI has more than 43,000 patents worldwide.
Product Range
Devices | Boards | Developer Tools |
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Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 57 PCS | Texas Instruments | IC MCU 32BIT 512KB FLASH 176BGA |
Digi-Key | 250 PCS | Texas Instruments | IC MCU 32BIT 512KB FLASH 176BGA |
Avnet | Non-stock | Texas Instruments | MCU 32-Bit C2000 C28x RISC 512KB Flash 1.9V/3.3V 176-Pin BGA |
Mouser | 341 PCS | Texas Instruments | Digital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr |
Alternative Models
There is no relevant information available for this part yet.
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