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XC3S5000-4FG900I Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 25 Apr 2019
 1960
IC Chips

Product Overview

Kynix Part #:

KY32-XC3S5000-4FG900I

Manufacturer Part#:

XC3S5000-4FG900I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine XC3S5000-4FG900I

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Description:

IC FPGA 633 I/O 900FBGA

Datasheet:

XC3S5000-4FG900I Datasheet

Package:

XILINX

Quantity:

70 PCS


XC3S5000-4FG900I Images are for reference only.

XC3S5000-4FG900I


CAD Models

Symbol

Symbol

Footprint

Footprint


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Series:

Spartan®-3

Part Status:

Active

Number of LABs/CLBs:

8320

Number of Logic Elements/Cells:

74880

Total RAM Bits:

1916928

Number of I/O:

633

Number of Gates:

5000000

Voltage - Supply:

1.14V ~ 1.26V

Mounting Type:

Surface Mount

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

900-BBGA

Supplier Device Package:

900-FBGA (31x31)

Device Logic Cells:

74,880

Device Logic Gates:

5000000

Device Logic Units:

74,880

Device System Gates

5000000

In System Programmability:

Yes

Lead Finish:

Tin/Lead

Max Processing Temp:

225

Maximum Internal Frequency:

630 MHz

Maximum Number of User I/Os:

633

Mounting:

Surface Mount

MSL Level:

3

Operating Temperature:

-40 to 100 °C

Pin Count:

900

Product Dimensions:

31 x 31 x 1.75 mm

RAM Bits:

1,916,928 Bit

Re-programmability Support:

1

Screening Level:

Industrial

Speed Grade:

4

Supplier Package:

FBGA

Typical Operating Supply Voltage:

1.2000 V

REACH Compliant:

Yes

Status:

Active

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max:

630.0  MHz

Combinatorial Delay of a CLB-Max:

0.61  ns

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e0

Number of Equivalent Gates:

5000000.0

Number of Inputs:

633.0

Package Body Material:

PLASTIC/EPOXY

Power Supplies:

1.2,1.2/3.3,2.5

Qualification Status:

Not Qualified

Seated Height-Max:

2.6  mm

Technology:

CMOS

Length:

31.0  mm

Width:

31.0  mm

Part Life Cycle Code:

Active

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Risk Rank:

5.14

Seated Height-Max:

2.6 mm


Product Features

• Low-cost, high-performance logic solution for high-volume, consumer-oriented applications

• Densities up to 74,880 logic cells

• SelectIO™ interface signaling

• Up to 633 I/O pins

• 622+ Mb/s data transfer rate per I/O

• 18 single-ended signal standards

• 8 differential I/O standards including LVDS, RSDS

• Termination by Digitally Controlled Impedance

• Signal swing ranging from 1.14V to 3.465V

• Double Data Rate (DDR) support

• DDR, DDR2 SDRAM support up to 333 Mb/s

• Logic resources

• Abundant logic cells with shift register capability

• Wide, fast multiplexers

• Fast look-ahead carry logic

• Dedicated 18 x 18 multipliers

• JTAG logic compatible with IEEE 1149.1/1532

• SelectRAM™ hierarchical memory

• Up to 1,872 Kbits of total block RAM • Up to 520 Kbits of total distributed RAM

• Digital Clock Manager (up to four DCMs)

• Clock skew elimination

• Frequency synthesis

• High resolution phase shifting

• Eight global clock lines and abundant routing

• Fully supported by Xilinx ISE® and WebPACK™ software development systems • MicroBlaze™ and PicoBlaze™ processor, PCI®, PCI Express® PIPE Endpoint, and other IP cores

• Pb-free packaging options

• Automotive Spartan-3 XA Family variant


Product Functions

The Spartan-3 family builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex®-II platform technology. These Spartan-3 FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN:

3A991.d

HTSN:

PARTS...

SCHEDULE B:

PARTS...


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Spartan-3 FPGA


Additional Resources

Standard Package

27


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

70 PCS

XILINX

IC FPGA 633 I/O 900FBGA

Digikey

--

Xilinx Inc.

IC FPGA 633 I/O 900FBGA

Avnet

--

Xilinx Inc.

--


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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