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A3P600-PQ208I Datasheets| Microsemi Corporation| PDF| Price| In Stock

Author: Apogeeweb
Date: 22 Apr 2019
 1661
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-A3P600-PQ208I

Manufacturer Part#:

A3P600-PQ208I

Product Category:

Embedded - FPGAs (Field Programmable Gate Array)

Stock:

Yes

Manufacturer:

Microsemi Corporation

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Description:

IC FPGA 154 I/O 208PQFP

Datasheet:

A3P600-PQ208I Datasheet

Package:

208-BFQFP

Quantity:

182 PCS


A3P600-PQ208I Images are for reference only.

A3P600-PQ208I


CAD Models

Footprint

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Product Attributes

Manufacturer:

Microsemi Corporation

Product Category:

Embedded - FPGAs (Field Programmable Gate Array)

Series:

ProASIC3

Mounting-Style:

SMD/SMT

Tradename:

Actel

Package-Case:

208-BFQFP

Operating-Temperature:

-40°C ~ 100°C (TJ)

Mounting-Type:

Surface Mount

Voltage-Supply:

1.425 V ~ 1.575 V

Supplier-Device-Package:

208-PQFP (28x28)

Number-of-Gates:

600000

Number-of-I-O:

154

Number-of-LABs-CLBs:

--

Number-of-Logic-Elements-Cells:

--

Total-RAM-Bits:

110592

Maximum-Operating-Temperature:

+ 85 C

Minimum-Operating-Temperature:

- 40 C

Operating-Supply-Voltage:

1.5 V

Maximum-Operating-Frequency:

231 MHz

Package-Case:

PQFP-208

Number-of-I-Os:

154 I/O

Height:

3.4 mm

Length:

28 mm

Width:

28 mm

EU RoHS

Not Compliant

ECCN (US)

3A001.a.7.a

Part Status

Obsolete

HTS

8542.39.00.01

Family Name

ProASIC®3

Process Technology

130nm

User I/Os

154

Number of I/O Banks

4

Number of Inter Dielectric Layers

7

Number of Registers

13824

Device System Gates

600000

Program Memory Type

Flash

Embedded Memory (Kbit)

108

Total Number of Block RAM

24

Device Logic Gates

600000

Number of Global Clocks

18

Device Number of DLLs/PLLs

1

Programmability

Yes

Reprogrammability Support

Yes

Copy Protection

No

In-System Programmability

Yes

Opr. Frequency (MHz)

231

Speed Grade

STD

Maximum Differential I/O Pairs

35

Maximum I/O Performance

700Mbps

Pin Count

208

Part Life Cycle Code:

Obsolete

HTS Code:

8542.39.00.01

Risk Rank:

5.87

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e0

Moisture Sensitivity Level:

3

Number of CLBs:

13824

Package Body Material:

PLASTIC/EPOXY

Qualification Status:

Not Qualified

Seated Height-Max:

4.1 mm


Product Features

High Capacity

• 15 K to 1 M System Gates

• Up to 144 Kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI†

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)† • FlashLock® to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os‡

• Programmable Output Slew Rate† and Drive Strength

• Weak Pull-Up/-Down • IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL†

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory†

• 1 Kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

• True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

• M1 ProASIC3 Devices—ARM®Cortex®-M1 Soft Processor Available with or without Debug


Product Functions

ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3 devices the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030 devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates, supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os. ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

USHTS:

8542310001

CAHTS:

8542390000

CNHTS:

8542319000

JPHTS:

8542390990

MXHTS:

85423999

TARIC:

8542399000

ECCN:

3A001.a.7.a


Documents & Media

Datasheets

A3P600-PQ208I Datasheet

PCN Obsolescence/ EOL

Mult Devices 07/Feb/2018

PCN Design/Specification

Mult Dev Design Advisory 13/Oct/2017

Mult Dev Software Chg 8/Oct/2018

PCN Assembly/Origin

Mult Dev Test Site 28/Feb/2019

EOL

Product Discontinuance Notification

Product Discontinuance Notification


Additional Resources

Standard Package

24



Product Manufacturer

Microsemi Corporation was an Aliso Viejo, California-based provider of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets.

In February 2018, it was announced that Chandler, Arizona-based Microchip Technology was acquiring the company for over USD$10B, pending regulatory approval. In May 2018, it was announced that Microchip had completed its acquisition of Microsemi. In August 2018, Microchip discovered that Microsemi shipped large orders to distributors on discount before the closing of the acquisition and had a culture of excessive extravagance, casting some doubt on the future prospect of the acquisition.


Product Range

Audio & Voice

Ethernet and PoE Solutions

Optical Networking

Circuit Protection

FPGA & SoC

Power Discretes & Modules

Drivers, Interfaces, and PCIe Switches

High-Reliability

Power Management


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

182 PCS

Microsemi Corporation

IC FPGA 154 I/O 208QFP

Digikey

--

Microsemi Corporation

IC FPGA 154 I/O 208QFP

Mouser

--

Microsemi

FPGA - Field Programmable Gate Array ProASIC3


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

Popularity by Region



Market Price Analysis

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