Product Overview
Kynix Part #: | KY32-SPC5675KFF0MMS2 |
Manufacturer Part#: | SPC5675KFF0MMS2 |
Product Category: | Embedded - Microcontrollers |
Stock: | Yes |
Manufacturer: | Freescale Semiconductor - NXP |
Click Purchase button to buy original genuine SPC5675KFF0MMS2 | |
Description: | IC MCU 32BIT 2MB FLASH 473MAPBGA |
Datasheet: | SPC5675KFF0MMS2 Datasheet |
Package: | 473-LFBGA |
Quantity: | 435 PCS |
SPC5675KFF0MMS2 Images are for reference only.
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - Microcontrollers |
Manufacturer | NXP USA Inc. |
Series | MPC56xx Qorivva |
Packaging | Tray |
Part Status | Active |
Core Processor | e200z7d |
Core Size | 32-Bit Dual-Core |
Speed | 180MHz |
Connectivity | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI |
Peripherals | DMA, POR, PWM, WDT |
Program Memory Size | 2MB (2M x 8) |
Program Memory Type | FLASH |
EEPROM Size | 64K x 8 |
RAM Size | 512K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.14V ~ 5.5V |
Data Converters | A/D 34x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 125°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 473-LFBGA |
Supplier Device Package | 473-MAPBGA (19x19) |
Base Part Number | SPC5675 |
EU RoHS Compliant | Yes |
Status | Transferred |
Bit Size | 32 |
CPU Family | E200 |
JESD-30 Code | S-PBGA-B473 |
JESD-609 Code | e2 |
Moisture Sensitivity Level | 3 |
Number of Terminals | 473 |
Operating Temperature-Min | -40.0 Cel |
Operating Temperature-Max | 125.0 Cel |
Package Body Material | PLASTIC/EPOXY |
Package Code | FBGA |
Package Equivalence Code | BGA473,23X23,32 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, FINE PITCH |
Power Supplies | 1.2,3.3,5 |
Qualification Status | Not Qualified |
RAM (bytes) | 524288.0 |
ROM Programmability | FLASH |
ROM (words) | 2097152 |
Screening Level | AEC-Q100 |
Speed | 180.0 MHz |
Sub Category | Microcontrollers |
Supply Current-Max | 900.0 mA |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | AUTOMOTIVE |
Terminal Finish | Tin/Silver (Sn/Ag) |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Features
• High-performance e200z7d dual core
— 32-bit Power Architectureâ technology CPU
— Up to 180 MHz core frequency
— Dual-issue core
— Variable length encoding (VLE)
— Memory management unit (MMU) with 64 entries
— 16 KB instruction cache and 16 KB data cache
• Memory available
— Up to 2 MB code flash memory with ECC
— 64 KB data flash memory with ECC
— Up to 512 KB on-chip SRAM with ECC
• SIL3/ASILD innovative safety concept: LockStep mode and fail-safe protection
— Sphere of replication (SoR) for key components
— Redundancy checking units on outputs of the SoR connected to FCCU
— Fault collection and control unit (FCCU)
— Boot-time built-in self-test for memory (MBIST) and logic (LBIST) triggered by hardware
— Boot-time built-in self-test for ADC and flash memory
— Replicated safety-enhanced watchdog timer
— Silicon substrate (die) temperature sensor
— Non-maskable interrupt (NMI)
— 16-region memory protection unit (MPU)
— Clock monitoring units (CMU)
— Power management unit (PMU)
— Cyclic redundancy check (CRC) units
• Decoupled Parallel mode for high-performance use of replicated cores
• Nexus Class 3+ interface
• Interrupts
— Replicated 16-priority interrupt controller
• GPIOs individually programmable as input, output, or special function
• 3 general-purpose eTimer units (6 channels each)
• 3 FlexPWM units with four 16-bit channels per module
• Communications interfaces
— 4 LINFlex modules
— 3 DSPI modules with automatic chip select generation
— 4 FlexCAN interfaces (2.0B Active) with 32 message objects
— FlexRay module (V2.1) with dual channel, up to 128 message objects and up to 10 Mbit/s
— Fast Ethernet Controller (FEC)
— 3 I2 C modules
• Four 12-bit analog-to-digital converters (ADCs)
— 22 input channels
— Programmable cross triggering unit (CTU) to synchronize ADC conversion with timer and PWM
• External bus interface
• 16-bit external DDR memory controller
• Parallel digital interface (PDI)
• On-chip CAN/UART bootstrap loader
• Capable of operating on a single 3.3 V voltage supply
— 3.3 V-only modules: I/O, oscillators, flash memory
— 3.3 V or 5 V modules: ADCs, supply to internal VREG
— 1.8–3.3 V supply range: DRAM/PDI
• Operating junction temperature range –40 to 150 °C
Advantages and Disadvantages
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Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.A.2 |
HTSN | 8542310001 |
SCHEDULE B | 8542310000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3(168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS3 Compliant |
Documents & Media
Product Manufacturer
NXP Semiconductors N.V. is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.
Product Range
Devices | Boards | Developer Tools |
ARM ® PROCESSORS | AUTOMOTIVE PRODUCTS | IDENTIFICATION & SECURITY |
Kinetis Cortex®-M Microcontrollers | In-Vehicle Network | NFC |
LPC Cortex-M Microcontrollers | Microcontrollers and Processors | RFID |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix | 435 PCS | Freescale Semiconductor - NXP | IC MCU 32BIT 2MB FLASH 473MAPBGA |
Digi-Key | 369 PCS | NXP USA Inc. | IC MCU 32BIT 2MB FLASH 473MAPBGA |
Avnet | Non-stock | NXP | MCU 32-bit MPC56xx e200 RISC 2048KB Flash 3.3V/5V 473-Pin MAPBGA Tray |
Mouser | Non-stock | NXP Semiconductors | 32-bit Microcontrollers - MCU 2MFlash,512KSRAM,EBI |
Alternative Models
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Market Price Analysis
SPC5675KFF0MMS2 Market Price Analysis
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