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SPC5675KFF0MMS2 Datasheets| Freescale Semiconductor - NXP| PDF| Price| In Stock

Author: Apogeeweb
Date: 14 Dec 2019
 1527
Embedded - Microcontrollers

Product Overview

Kynix Part #:

KY32-SPC5675KFF0MMS2

Manufacturer Part#:

SPC5675KFF0MMS2

Product Category:

Embedded - Microcontrollers

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

Click Purchase button to buy original genuine SPC5675KFF0MMS2

Purchase 

Description:

IC MCU 32BIT 2MB FLASH 473MAPBGA

Datasheet:

SPC5675KFF0MMS2 Datasheet

Package:

473-LFBGA

Quantity:

435 PCS


SPC5675KFF0MMS2 Images are for reference only.

 SPC5675KFF0MMS2 Image


CAD Models

 SPC5675KFF0MMS2 Symbol

SPC5675KFF0MMS2 Symbol

 SPC5675KFF0MMS2 Footprint

SPC5675KFF0MMS2 Footprint


Product Attributes

Categories

Integrated Circuits (ICs) Embedded - Microcontrollers

Manufacturer

NXP USA Inc.

Series

MPC56xx Qorivva

Packaging

Tray

Part Status

Active

Core Processor

e200z7d

Core Size

32-Bit Dual-Core

Speed

180MHz

Connectivity

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

Peripherals

DMA, POR, PWM, WDT

Program Memory Size

2MB (2M x 8)

Program Memory Type

FLASH

EEPROM Size

64K x 8

RAM Size

512K x 8

Voltage - Supply (Vcc/Vdd)

1.14V ~ 5.5V

Data Converters

A/D 34x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

473-LFBGA

Supplier Device Package

473-MAPBGA (19x19)

Base Part Number

SPC5675

EU RoHS Compliant

Yes

Status

Transferred

Bit Size

32

CPU Family

E200

JESD-30 Code

S-PBGA-B473

JESD-609 Code

e2

Moisture Sensitivity Level

3

Number of Terminals

473

Operating Temperature-Min

-40.0  Cel

Operating Temperature-Max

125.0  Cel

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA473,23X23,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Power Supplies

1.2,3.3,5

Qualification Status

Not Qualified

RAM (bytes)

524288.0

ROM Programmability

FLASH

ROM (words)

2097152

Screening Level

AEC-Q100

Speed

180.0  MHz

Sub Category

Microcontrollers

Supply Current-Max

900.0  mA

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

Tin/Silver (Sn/Ag)

Terminal Form

BALL

Terminal Pitch

0.8  mm

Terminal Position

BOTTOM


Features

• High-performance e200z7d dual core

— 32-bit Power Architectureâ technology CPU

— Up to 180 MHz core frequency

— Dual-issue core

— Variable length encoding (VLE)

— Memory management unit (MMU) with 64 entries

— 16 KB instruction cache and 16 KB data cache

• Memory available

— Up to 2 MB code flash memory with ECC

— 64 KB data flash memory with ECC

— Up to 512 KB on-chip SRAM with ECC

• SIL3/ASILD innovative safety concept: LockStep mode and fail-safe protection

— Sphere of replication (SoR) for key components

— Redundancy checking units on outputs of the SoR connected to FCCU

— Fault collection and control unit (FCCU)

— Boot-time built-in self-test for memory (MBIST) and logic (LBIST) triggered by hardware

— Boot-time built-in self-test for ADC and flash memory

— Replicated safety-enhanced watchdog timer

— Silicon substrate (die) temperature sensor

— Non-maskable interrupt (NMI)

— 16-region memory protection unit (MPU)

— Clock monitoring units (CMU)

— Power management unit (PMU)

— Cyclic redundancy check (CRC) units

• Decoupled Parallel mode for high-performance use of replicated cores

• Nexus Class 3+ interface

• Interrupts

— Replicated 16-priority interrupt controller

• GPIOs individually programmable as input, output, or special function

• 3 general-purpose eTimer units (6 channels each)

• 3 FlexPWM units with four 16-bit channels per module

• Communications interfaces

— 4 LINFlex modules

— 3 DSPI modules with automatic chip select generation

— 4 FlexCAN interfaces (2.0B Active) with 32 message objects

— FlexRay module (V2.1) with dual channel, up to 128 message objects and up to 10 Mbit/s

— Fast Ethernet Controller (FEC)

— 3 I2 C modules

• Four 12-bit analog-to-digital converters (ADCs)

— 22 input channels

— Programmable cross triggering unit (CTU) to synchronize ADC conversion with timer and PWM

• External bus interface

• 16-bit external DDR memory controller

• Parallel digital interface (PDI)

• On-chip CAN/UART bootstrap loader

• Capable of operating on a single 3.3 V voltage supply

— 3.3 V-only modules: I/O, oscillators, flash memory

— 3.3 V or 5 V modules: ADCs, supply to internal VREG

— 1.8–3.3 V supply range: DRAM/PDI

• Operating junction temperature range –40 to 150 °C


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.A.2

HTSN

8542310001

SCHEDULE B

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS3 Compliant


Documents & Media

Datasheets

MPC5675K Datasheet
MPC5675K Ref Manual
MPC5675K Fact Sheet

Environmental Information

NXP RoHS3 Cert

Design Resources

Development Tool Selector

Online Catalog

MPC56xx Qorivva


Product Manufacturer

NXP Semiconductors N.V.is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.


Product Range

Devices

Boards

Developer Tools

ARM ® PROCESSORS

AUTOMOTIVE PRODUCTS

IDENTIFICATION & SECURITY

Kinetis Cortex®-M Microcontrollers

In-Vehicle Network

NFC

LPC Cortex-M Microcontrollers

Microcontrollers and Processors

RFID


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

435 PCS

Freescale Semiconductor - NXP

IC MCU 32BIT 2MB FLASH 473MAPBGA

Digi-Key

369 PCS

NXP USA Inc.

IC MCU 32BIT 2MB FLASH 473MAPBGA

Avnet

Non-stock

NXP

MCU 32-bit MPC56xx e200 RISC 2048KB Flash 3.3V/5V 473-Pin MAPBGA Tray

Mouser

Non-stock

NXP Semiconductors

 

32-bit Microcontrollers - MCU 2MFlash,512KSRAM,EBI


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 SPC5675KFF0MMS2 Popularity by Region

SPC5675KFF0MMS2 Popularity by Region


Market Price Analysis

 SPC5675KFF0MMS2 Market Price Analysis

SPC5675KFF0MMS2 Market Price Analysis


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