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K4S640832D-TL1L Datasheets| SAMSUNG| PDF| Price| In Stock

Author: Apogeeweb
Date: 14 Dec 2019
 1361
Memory

Product Overview

Kynix Part #:

KY32-K4S640832D-TL1L

Manufacturer Part#:

K4S640832D-TL1L

Product Category:

Memory

Stock:

Yes

Manufacturer:

SAMSUNG

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Description:

-

Datasheet:

K4S640832D-TL1L Datasheet

Package:

TSOP

Quantity:

2200 PCS


K4S640832D-TL1L Images are for reference only.

 K4S640832D-TL1L Image


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54

Brand

SAMSUNG

Sub Category

DRAMs

Access Mode

FOUR BANK PAGE BURST

Access Time-Max

6.0 ns

Clock Frequency-Max (fCLK)

100 MHz

I/O Type

COMMON

Interleaved Burst Length

1,2,4,8

JESD-30 Code

R-PDSO-G54

JESD-609 Code

e0

Memory Density

67108864 bit

Memory IC Type

SYNCHRONOUS DRAM

Memory Width

8

Number of Terminals

54

Number of Words

8388608 words

Number of Words Code

8000000

Number of Functions

1

Number of Ports

1

Organization

8MX8

Operating Mode

SYNCHRONOUS

Operating Temperature

0°C~70°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP2

Package Equivalence Code

TSOP54,.46,32

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

3.3 V

Qualification Status

Not Qualified

Risk Rank

5.89

Refresh Cycles

4096

Rohs Code

No

Sequential Burst Length

1,2,4,8,FP

Standby Current-Max

0.001 A

Supply Current-Max

0.125 mA

Supply Voltage-Nom (Vsup)

3.3 V

Supply Voltage-Min (Vsup)

3.0 V

Supply Voltage-Max (Vsup)

3.6 V

Seated Height-Max

1.2 mm

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

COMMERCIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

GULL WING

Terminal Pitch

0.8 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

22.22 mm

Width

10.16 mm

Additional Feature

AUTO/SELF REFRESH


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.02


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / Unconfirmed


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

Samsung Semiconductor

-

Nexxon

In Stock

Samsung Semiconductor

-

Depu Electronics

2961 PCS

Samsung Semiconductor

TSOP54 ; DC:09+

New Strength Electronic

4999 PCS

Samsung Semiconductor

DC:. [ ] ; . MC


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

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