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K6F2008V2E-LF70 Datasheets| SAMSUNG| PDF| Price| In Stock

Author: Apogeeweb
Date: 11 Dec 2019
 1500
Memory

Product Overview

Kynix Part #:

KY32-K6F2008V2E-LF70

Manufacturer Part#:

K6F2008V2E-LF70

Product Category:

Memory

Stock:

Yes

Manufacturer:

SAMSUNG

Click Purchase button to buy original genuine K6F2008V2E-LF70

Purchase 

Description:

-

Datasheet:

K6F2008V2E-LF70 Datasheet

Package:

TSOP

Quantity:

2200 PCS


K6F2008V2E-LF70 Images are for reference only.

K6F2008V2E-LF70 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

EU RoHS Compliant

Yes

Status

Obsolete

Package Description

8 X 13.40 MM, LEAD FREE, TSOP1-32

Brand

SAMSUNG

Sub Category

SRAMs

I/O Type

COMMON

JESD-30 Code

R-PDSO-G32

JESD-609 Code

e3/e6

Memory Density

2097152 bit

Memory IC Type

STANDARD SRAM

Memory Width

8

Moisture Sensitivity Level

2

Number of Terminals

32

Number of Words

262144 words

Number of Words Code

256000

Number of Functions

1

Organization

256KX8

Operating Mode

ASYNCHRONOUS

Operating Temperature

-40°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP1

Parallel/Serial

PARALLEL

Package Equivalence Code

TSSOP32,.56,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (Cel)

260

Power Supplies

-

Qualification Status

Not Qualified

Risk Rank

5.82

Rohs Code

Yes

Seated Height-Max

1.2 mm

Standby Current-Max

0.000002 A

Supply Current-Max

0.035 mA

Standby Voltage-Min

1.5 V

Supply Voltage-Nom (Vsup)

3.3 V

Supply Voltage-Min (Vsup)

3.0 V

Supply Voltage-Max (Vsup)

3.6 V

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

INDUSTRIAL

Terminal Finish

PURE TIN/TIN BISMUTH

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

40

Length

11.8 mm

Width

8.0 mm


Features

  • Process Technology: Full CMOS

  • Organization: 256KX8

  • Power Supply Voltage: 3.0 ~3.6 V

  • Low Data Retention Voltage: 1.5 V (Min)

  • Three State Outputs

  • Package Type: 32-TSOP-0813.4F, 32-TSOP1-0813.4F(LF)


Advantages and Disadvantages

Advantages

The K6F2008V2E families are fabricated by SAMSUNG advanced Full CMOS process technology. The families support industrial temperature ranges for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

2

Lead Free Status / RoHS Status

Lead free / Non-Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

Samsung Semiconductor

-

Direct Components

3721 PCS

Samsung Semiconductor

-

Bison Technologies

80 PCS

Samsung Semiconductor

-

Semi Source

1583 PCS

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

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