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K6F4016U4E-EF70 Datasheets| SAMSUNG| PDF| Price| In Stock

Author: Apogeeweb
Date: 10 Dec 2019
 1142
IC Chips

Product Overview

Kynix Part #:

KY32-K6F4016U4E-EF70

Manufacturer Part#:

K6F4016U4E-EF70

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

Click Purchase button to buy original genuine K6F4016U4E-EF70

Purchase 

Description:

-

Datasheet:

K6F4016U4E-EF70 Datasheet

Package:

PBGA48

Quantity:

2200 PCS


K6F4016U4E-EF70 Images are for reference only.

K6F4016U4E-EF70 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

6 X 7 MM, TBGA-48

Brand

SAMSUNG

Sub Category

SRAMs

Access Time-Max

70 ns

I/O Type

COMMON

JESD-30 Code

R-PBGA-B48

JESD-609 Code

e0

Memory Density

4194304 bit

Memory IC Type

STANDARD SRAM

Memory Width

16

Moisture Sensitivity Level

3

Number of Terminals

48

Number of Words

262144 words

Number of Words Code

256000

Number of Functions

1

Organization

256KX16

Operating Mode

ASYNCHRONOUS

Operating Temperature

-40°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Parallel/Serial

PARALLEL

Package Equivalence Code

BGA48,6X8,30

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

-

Qualification Status

Not Qualified

Risk Rank

5.84

Rohs Code

No

Seated Height-Max

1.0 mm

Standby Current-Max

0.000003 A

Supply Current-Max

0.022 mA

Standby Voltage-Min

1.5 V

Supply Voltage-Nom (Vsup)

3.0 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Max (Vsup)

3.3 V

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

BALL

Terminal Pitch

0.75 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

7.0 mm

Width

6.0 mm


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.B.2.A

HTSN

8542.32.00.41


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / Not Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

Samsung Semiconductor

-

Chip 1 Exchange

29229 PCS

Samsung Semiconductor

-

Bison Technologies

2194 PCS

Samsung Semiconductor

-

C Plus Electronics

-

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

There is no relevant information available for this part yet.


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