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XC7K325T-1FB900I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 12 Apr 2019
 1944
IC Chips

Product Overview

Kynix Part #:

KY32-XC7K325T-1FB900I

Manufacturer Part#:

XC7K325T-1FB900I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

Click Purchase button to buy original genuine XC7K325T-1FB900I

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Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

XC7K325T-1FB900I Datasheet

Package:

BGA

Quantity:

88 PCS


XC7K325T-1FB900I Images are for reference only.

XC7K325T-1FB900I


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

IC Chips

Series:

Kintex-7

Package-Case:

900-BBGA, FCBGA

Operating-Temperature:

-40°C ~ 100°C (TJ)

Mounting-Type:

Surface Mount

Voltage-Supply:

0.97 V ~ 1.03 V

Supplier-Device-Package:

900-FCBGA (31x31)

Number-of-Gates:

--

Number-of-I-O:

500

Number-of-LABs-CLBs:

25475

Number-of-Logic-Elements-Cells:

326080

Total-RAM-Bits:

16404480

Audio I/O:

No

Configuration Memory:

16MB QSPI; 128MB BPI FLASH

Device Logic Cells:

326,080

Device Logic Units:

203,800

Display Mode:

HMDI Output

Ethernet:

Yes

GPIO:

Yes

Interface Standards:

FMC LPC; I2C; HPC; XADC; SMA; SFP+

Lead Finish:

Tin|Lead

Maximum Number of User I/Os:

350

Maximum Propagation Delay Time:

0.12 ns

Memory Card Interface:

SD Card

Memory Size:

1GB

Memory Type:

DDR3

Mounting:

Surface Mount

Number of Registers:

407,600

PCIe:

PCIe

Pin Count:

900

Product Dimensions:

31 x 31 x 2.65

RAM Bits:

16,404,480 Bit

Re-programmability Support:

1

Screening Level:

Industrial

Speed Grade:

1

Typical Operating Supply Voltage:

1.0000 V

USB:

USB-Serial Bridge

Part Life Cycle Code:

Active

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Risk Rank:

5.66

Combinatorial Delay of a CLB-Max:

0.74 ns

JESD-30 Code:

JESD-609 Code:

Length:

31 mm

Number of CLBs:

25475

Seated Height-Max:

2.54 mm

Width:

31 mm


Product Features

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

• Quickly deploy embedded processing with MicroBlaze™ processor.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Product Functions

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN:

3A991D

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

 

Datasheets

Kintex-7 FPGAs Datasheet

Kintex-7 FPGAs CES9937 Errata

Kintex-7 FPGA CES Errata

7 Series FPGA Overview

 

PCN Assembly/Origin

Zynq-7000 Datasheet Update 02/Jun/2014

Cross-Ship Lead-Free Notice 31/Oct/2016

Product Marking Chg 31/Oct/2016

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014

PCN Packaging

Mult Devices 26/Jun/2017


Additional Resources

Standard Package

1


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

88 PCS

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Digikey

--

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Digipart

--

Xilinx Inc.

IC FPGA KINTEX-7 900-FBGA


Alternative Models

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Popularity by Region

Popularity by Region


Market Price Analysis

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