Product Overview
Kynix Part #: | KY32-P1013NSN2EFB |
Manufacturer Part#: | P1013NSN2EFB |
Product Category: | Embedded - Microprocessors |
Stock: | Yes |
Manufacturer: | Freescale Semiconductor - NXP |
Click Purchase button to buy original genuine P1013NSN2EFB |
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Description: | IC MPU Q OR IQ 1.055GHZ 689TBGA |
Datasheet: | P1013NSN2EFB Datasheet |
Package: | 689-BBGA Exposed Pad |
Quantity: | 73 PCS |
P1013NSN2EFB Images are for reference only:
CAD Models
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Product Attributes
Manufacturer: | Freescale Semiconductor - NXP |
Product Category: | Embedded - Microprocessors |
Status: | Active |
Series: | QorIQ P1 |
Core Processor: | PowerPC e500v2 |
Core Architecture: | e500 |
Co-Processors/DSP: | - |
Device Core: | e500 |
Data Bus Width: | 32 bit |
Display & Interface Controllers | LCD |
Ethernet: | 10/100/1000Mbps (2) |
Ethernet Speed: | 10Mbps/100Mbps/1000Mbps |
Ethernet Interface Type: | RMII/RGMII/SGMII |
EU RoHS Compliant: | Yes |
Frequency: | 1.055 GHz |
Family Name: | QorIQ P1013 |
Graphics Acceleration: | No |
Interface Type: | Ethernet/I2C/UART/USB |
Instruction Type: | Floating Point |
Instruction Set Architecture: | RISC |
JESD-609 Code: | e2 |
Lead Shape: | Ball |
Memory Size: | 32 kB |
Memory Type: | L1/L2 Cache |
Mounting-Style: | SMD/SMT |
Multiply Accumulate: | No |
Maximum Clock Frequency: | 600 MHz |
Number of Pins: | 689 |
Number of I/Os: | 87 |
Number of CPU Cores: | 1 |
Operating Temperature-Min: | 0.0°C |
Operating Temperature-Max: | 105°C |
Pin Count: | 689 |
PCB changed: | 689 |
Package/Case: | 689-BBGA Exposed Pad |
Peak Reflow Temperature: | 260 °C |
RAM Size: | 32 kB |
RAM Controllers: | DDR2, DDR3 |
REACH Compliant: | Yes |
SATA: | SATA 3Gbps (2) |
Speed: | 1.055GHz |
Security Features: | - |
Supplier Device Package: | 689-TEPBGA II (31x31) |
Tradename: | QorIQ |
Technology: | CMOS |
Terminal Finish: | Tin/Silver (Sn/Ag) |
Time@Peak Reflow Temperature-Max: | 40 s |
USB: | USB 2.0 + PHY (2) |
Unit Weight: | 0.185090 oz |
Product Features
• Dual (P1022) or single (P1013) highperformance e500v2 cores built on Power Architecture technology
— 36-bit physical addressing
— Double precision floating point support
— Signal processing engine (SPE) APU (auxiliary processing unit)
— 32 KB L1 instruction cache and 32 KB L1 data cache for each core
— 600 MHz to 1055 MHz core clock frequency
• 256 KB L2 cache with ECC, also configurable as SRAM and stashing memory
• 64-bit DDR2/DDR3 SDRAM memory controller with ECC support
• Two 10/100/1000 Mbps virtualized enhanced three-speed Ethernet controllers (eTSECs)
— TCP/IP acceleration and classification capabilities
— IEEE® 1588 support
— Loseless flow control
— RMII, RGMII, SGMII
• Integrated security engine (optional)
— Crypto algorithm support includes 3DES, AES, RSA/ECC, MD5/SHA, ARC4, Kasumi, Snow 3G and FIPS deterministic RNG
— Single pass encryption/message authentication for common security protocols (IPsec, SSL, SRTP, WiMAX)
— XOR acceleration
• High-speed interfaces (not all available simultaneously)
— Six SerDes lanes (multiplexed across controllers)
— One x4 and two x1 PCI Express interfaces
— Two serial ATA (SATA) interfaces
— Two SGMII interfaces
• Audio visual interfaces
— LCD interface supporting a display of 1280 x 1024P @ 60 Hz, 24 bits per pixel
— I2S interface with maximum sampling frequency of 192 kHz
• VoIP TDM interface
— Support for up to 128 channels
• Two High-Speed USB controllers (USB 2.0)
— Host and device support
— Enhanced host controller interface (EHCI)
— ULPI interface to PHY
• Enhanced secure digital host controller (SD/MMC)
• Serial peripheral interface
• Programmable interrupt controller (PIC) compliant with Open-PIC standard
• Dual four-channel DMA controllers
• Dual I2C controllers, DUART, timers
• Enhanced local bus controller (eLBC)
• Advanced power and energy management
— Low power operation
— Support for dynamic and static power management
— Doze, nap and sleep modes for dynamic power management
— Packet-lossless deep sleep: power removed from major portion of the chip
— PMC wake on: filtered LAN activity, USB connection, GPIO, internal timer or external interrupt event
• Up to 87 general-purpose signals
• Available in extended temperature (optional)
• 689-pin TEPBGA package
Applications
There is no relevant information available for this part yet.
Advantages and Disadvantages
There is no relevant information available for this part yet.
ECCN / UNSPSC
ECCN | 3A991.A.2 |
HTSN: | 8542310001 |
SCHEDULE B: | 8542310000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3(168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
USHTS: | 8542310001 |
CAHTS: | 8542310012 |
CNHTS: | 8542319000 |
JPHTS: | 8542310313 |
KRHTS: | 8542311000 |
MXHTS: | 85423102 |
TARIC: | 8542319000 |
Halogen Free: | Halogen Free |
Documents & Media
Product Manufacturer
NXP Semiconductor enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries.
Product Range
ARM ® PROCESSORS | ANALOG | POWER ARCHITECTURE ®PROCESSORS |
MEDIA AND AUDIO | RF | IDENTIFICATION & SECURITY |
Sensors | Wireless | Automotive Products |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 73 | Freescale Semiconductor - NXP | IC MPU Q OR IQ 1.055GHZ 689TBGA |
DigiKey | 0 | NXP USA Inc. | IC MPU Q OR IQ 1.055GHZ 689TBGA |
Mouser | 27 | NXP Semiconductors | Microprocessors - MPU 600/400/667 ST NE r1.1 |
Alternative Models
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