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Dec 2 2019

W971GG6KB-25 Datasheets| Winbond Electronics| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-W971GG6KB-25

Manufacturer Part#:

W971GG6KB-25

Product Category:

Memory ICs

Stock:

Yes

Manufacturer:

Winbond Electronics Corporation

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Description:

IC DDR2 SDRAM 1GBIT 2.5NS 84BGA

Datasheet:

W971GG6KB-25 Datasheet

Package:

FBGA

Quantity:

10200 PCS


W971GG6KB-25 Images are for reference only.

W971GG6KB-25 Image 


CAD Models

W971GG6KB-25 Footprint 

W971GG6KB-25 Footprint


Product Attributes

Categories

Integrated Circuits (ICs) Memory

Manufacturer

Winbond Electronics

Series

-

Packaging

Tray

Part Status

Obsolete

Memory Type

Volatile

Memory Format

DRAM

Technology

SDRAM - DDR2

Memory Size

1Gb (64M x 16)

Memory Interface

Parallel

Clock Frequency

200MHz

Write Cycle Time - Word, Page

15ns

Access Time

400ps

Voltage - Supply

1.7V ~ 1.9V

Operating Temperature

0°C ~ 85°C (TC)

Mounting Type

Surface Mount

Package / Case

84-TFBGA

Supplier Device Package

84-WBGA (8x12.5)

Mfr Package Description

8 X 12.50 MM, ROHS COMPLIANT, WBGA-84

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Sub Category

DRAMs

Access Mode

MULTI BANK PAGE BURST

Access Time-Max

0.4  ns

Clock Frequency-Max (fCLK)

400.0  MHz

Interleaved Burst Length

4,8

I/O Type

COMMON

JESD-30 Code

R-PBGA-B84

Memory Density

1.073741824E9  bit

Memory IC Type

DDR DRAM

Memory Width

16

Number of Functions

1

Number of Ports

1

Number of Terminals

84

Number of Words

6.7108864E7  words

Number of Words Code

64M

Operating Mode

SYNCHRONOUS

Operating Temperature-Min

0.0  Cel

Operating Temperature-Max

85.0  Cel

Organization

64MX16

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA84,9X15,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification Status

Not Qualified

Refresh Cycles

8192.0

Seated Height-Max

1.2  mm

Sequential Burst Length

4,8

Standby Current-Max

0.008  Amp

Supply Current-Max

0.185  Amp

Supply Voltage-Nom (Vsup)

1.8  V

Supply Voltage-Min (Vsup)

1.7  V

Supply Voltage-Max (Vsup)

1.9  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

0.8  mm

Terminal Position

BOTTOM

Length

12.5  mm

Width

8.0  mm

Additional Feature

AUTO/SELF REFRESH


Features

· Power Supply: VDD, VDDQ = 1.8 V ± 0.1 V

· Double Data Rate architecture: two data transfers per clock cycle

· CAS Latency: 3, 4, 5, 6 and 7

· Burst Length: 4 and 8

· Bi-directional, differential data strobes (DQS and DQS) are transmitted / received with data

· Edge-aligned with Read data and center-aligned with Write data

· DLL aligns DQ and DQS transitions with clock

· Differential clock inputs (CLK and CLK)

· Data masks (DM) for write data

· Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS

· Posted CAS programmable additive latency supported to make command and data bus efficiency

· Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)

· Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality

· Auto-precharge operation for read and write bursts

· Auto Refresh and Self Refresh modes

· Precharged Power Down and Active Power Down

· Write Data Mask

· Write Latency = Read Latency - 1 (WL = RL - 1)

· Interface: SSTL_18

· Packaged in WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS3 Compliant


Documents & Media

Datasheets

W971GG6KB

PCN Obsolescence/ EOL

W971GG6KB 23/Nov/206

PCN Assembly/Origin

Mult Dev Test Site Add 11/Oct/2017

PCN Packaging

Dessicant Supplier Chg 3/May/2016

EDA / CAD Models

Download from Ultra Librarian


Product Manufacturer

There is no relevant information available for this part yet.


Product Range

Devices

Boards

Developer Tools

Memory

Storage

Advanced Solutions

DRAM

Memory Cards

3D XPoint™ Technology

DRAM Modules

Solid State Drives

Advanced Computing Solutions


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

10200 PCS

Winbond Electronics

IC DDR2 SDRAM 1GBIT 2.5NS 84BGA

Digi-Key

Non-stock

Winbond Electronics

IC DRAM 1G PARALLEL 84WBGA

Avnet

Non-stock

-

-

Mouser

Non-stock

Winbond

Winbond Electronics Corporation


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

W971GG6KB-25 Popularity by Region 

W971GG6KB-25 Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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