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Nov 16 2019

XC6SLX150-3FGG676I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC6SLX150-3FGG676I

Manufacturer Part#:

XC6SLX150-3FGG676I

Product Category:

Embedded - FPGAs (Field Programmable Gate Array)

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 498 I/O 676FBGA

Datasheet:

XC6SLX150-3FGG676I Datasheet

Package:

676-BGA

Quantity:

108 PCS


XC6SLX150-3FGG676I Images are for reference only.

XC6SLX150-3FGG676I Image 


CAD Models

 XC6SLX150-3FGG676I Symbol

XC6SLX150-3FGG676I Symbol

 XC6SLX150-3FGG676I Footprint.png

XC6SLX150-3FGG676I Footprint


Product Attributes

Categories

Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Spartan®-6 LX

Packaging

Tray

Part Status

Active

Number of LABs/CLBs

11519

Number of Logic Elements/Cells

147443

Total RAM Bits

4939776

Number of I/O

498

Voltage - Supply

1.14V ~ 1.26V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BGA

Supplier Device Package

676-FBGA (27x27)

Base Part Number

XC6SLX150

Mfr Package Description

27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

862.0  MHz

Combinatorial Delay of a CLB-Max

0.21  ns

JESD-30 Code

S-PBGA-B676

JESD-609 Code

e1

Moisture Sensitivity Level

3

Number of CLBs

11519.0

Number of Inputs

498.0

Number of Logic Cells

147443.0

Number of Outputs

498.0

Number of Terminals

676

Operating Temperature-Min

-40.0  Cel

Operating Temperature-Max

100.0  Cel

Organization

11519 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA676,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

250

Power Supplies

1.2,2.5/3.3

Qualification Status

Not Qualified

Seated Height-Max

2.44  mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.2  V

Supply Voltage-Min

1.14  V

Supply Voltage-Max

1.26  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Length

27.0  mm

Width

27.0  mm


Features

 Spartan-6 Family:

• Spartan-6 LX FPGA: Logic optimized

• Spartan-6 LXT FPGA: High-speed serial connectivity

 Designed for low cost

• Multiple efficient integrated blocks

• Optimized selection of I/O standards

• Staggered pads

• High-volume plastic wire-bonded packages

 Low static and dynamic power

• 45 nm process optimized for cost and low power

• Hibernate power-down mode for zero power

• Suspend mode maintains state and configuration with multi-pin wake-up, control enhancement

• Lower-power 1.0V core voltage (LX FPGAs, -1L only)

• High performance 1.2V core voltage (LX and LXT FPGAs, -2, -3, and -3N speed grades)

 Multi-voltage, multi-standard SelectIO™ interface banks

• Up to 1,080 Mb/s data transfer rate per differential I/O

• Selectable output drive, up to 24 mA per pin

• 3.3V to 1.2V I/O standards and protocols

• Low-cost HSTL and SSTL memory interfaces

• Hot swap compliance

• Adjustable I/O slew rates to improve signal integrity

 High-speed GTP serial transceivers in the LXT FPGAs

• Up to 3.2 Gb/s

• High-speed interfaces including: Serial ATA, Aurora, 1G Ethernet, PCI Express, OBSAI, CPRI, EPON, GPON, DisplayPort, and XAUI

 Integrated Endpoint block for PCI Express designs (LXT)

Low-cost PCI® technology support compatible with the 33 MHz, 32- and 64-bit specification.

 Efficient DSP48A1 slices

• High-performance arithmetic and signal processing

• Fast 18 x 18 multiplier and 48-bit accumulator

• Pipelining and cascading capability

• Pre-adder to assist filter applications

 Integrated Memory Controller blocks

• DDR, DDR2, DDR3, and LPDDR support

• Data rates up to 800 Mb/s (12.8 Gb/s peak bandwidth)

• Multi-port bus structure with independent FIFO to reduce design timing issues

 Abundant logic resources with increased logic capacity

• Optional shift register or distributed RAM support

• Efficient 6-input LUTs improve performance and minimize power

• LUT with dual flip-flops for pipeline centric applications

 Block RAM with a wide range of granularity

• Fast block RAM with byte write enable

• 18 Kb blocks that can be optionally programmed as two independent 9 Kb block RAMs

 Clock Management Tile (CMT) for enhanced performance

• Low noise, flexible clocking

• Digital Clock Managers (DCMs) eliminate clock skew and duty cycle distortion

• Phase-Locked Loops (PLLs) for low-jitter clocking

• Frequency synthesis with simultaneous multiplication, division, and phase shifting

• Sixteen low-skew global clock networks

 Simplified configuration, supports low-cost standards

• 2-pin auto-detect configuration

• Broad third-party SPI (up to x4) and NOR flash support

• Feature rich Xilinx Platform Flash with JTAG

• MultiBoot support for remote upgrade with multiple bitstreams, using watchdog protection

Enhanced security for design protection

• Unique Device DNA identifier for design authentication

• AES bitstream encryption in the larger devices

 Faster embedded processing with enhanced, low cost, MicroBlaze™ soft processor

 Industry-leading IP and reference designs


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.d

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS3 Compliant


Documents & Media

Datasheets

Spartan-6 FPGA Datasheet
Spartan-6 Family Overview

Design Resources

Development Tool Selector

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programmable logic devices. It is known for inventing the field-programming gate array and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

108 PCS

Xilinx Inc.

IC FPGA 498 I/O 676FBGA

Digi-Key

Non-stock

Xilinx Inc.

IC FPGA 498 I/O 676FBGA

Avnet

Non-stock

Xilinx Inc.

FPGA Spartan-6 LX Family 147443 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA

Mouser

52 PCS

Xilinx Inc.

FPGA - Field Programmable Gate Array XC6SLX150-3FGG676I


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 

There is no relevant information available for this part yet.


Market Price Analysis

XC6SLX150-3FGG676I Market Price Analysis 

XC6SLX150-3FGG676I Market Price Analysis


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