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Nov 15 2019

TMS320DM335ZCE270 Datasheets| Texas Instruments| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-TMS320DM335ZCE270

Manufacturer Part#:

TMS320DM335ZCE270

Product Category:

Embedded - DSP (Digital Signal Processors)

Stock:

Yes

Manufacturer:

Texas Instruments

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Description:

IC DGTL MEDIA SOC 337NFBGA

Datasheet:

TMS320DM335ZCE270 Datasheet

Package:

337-LFBGA

Quantity:

144 PCS


TMS320DM335ZCE270 Images are for reference only.

TMS320DM335ZCE270 Image 


CAD Models

TMS320DM335ZCE270 Footprint 

TMS320DM335ZCE270 Footprint


Product Attributes

Categories

Integrated Circuits (ICs) Embedded - DSP (Digital Signal Processors)

Manufacturer

Texas Instruments

Series

TMS320DM3x, DaVinci™

Packaging

Tube

Part Status

Not For New Designs

Type

Digital Media System-on-Chip (DMSoC)

Interface

ASP, EBI/EMI, I²C, SPI, UART, USB

Clock Rate

270MHz

Non-Volatile Memory

ROM (8kB)

On-Chip RAM

56kB

Voltage - I/O

1.8V, 3.3V

Voltage - Core

1.30V

Operating Temperature

0°C ~ 85°C (TC)

Mounting Type

Surface Mount

Package / Case

337-LFBGA

Supplier Device Package

337-NFBGA (13x13)

Base Part Number

TMS320DM335

Mfr Package Description

NFBGA-337

REACH Compliant

Yes

EU RoHS Compliant

Yes

China RoHS Compliant

Yes

Status

NRFND

JESD-30 Code

S-PBGA-B337

JESD-609 Code

e1

Moisture Sensitivity Level

3

Number of Terminals

337

Operating Temperature-Min

0.0  Cel

Operating Temperature-Max

85.0  Cel

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Qualification Status

Not Qualified

Seated Height-Max

1.3  mm

Supply Voltage-Nom

1.3  V

Supply Voltage-Min

1.235  V

Supply Voltage-Max

1.365  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

0.65  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

13.0  mm

Width

13.0  mm


Features

·  Highlights

· High-Performance Digital Media System-On-Chip (DMSoC)

· Up to 216-MHz ARM926EJ-STM Clock Rate

· Digital HDTV (720p/1080i) output for connection to external encoder

· Video Processing Subsystem

Hardware IPIPE for Real-Time Image Processing

Up to 14-bit CCD/CMOS Digital Interface

Histogram Module

Resize Image 1/16x to 8x

Hardware On-Screen Display

Up to 75-MHz Pixel Clock

Composite NTSC/PAL video encoder output

· Peripherals include DDR and mDDR SDRAM, 2 MMC/SD/SDIO and SmartMedia Flash Card Interfaces, USB 2.0, 3 UARTs and 3 SPIs

· Enhanced Direct-Memory-Access (EDMA)

· Configurable Power-Saving Modes

· On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, or UART

· 3.3-V and 1.8-V I/O, 1.3-V Core

· Debug Interface Support

· Up to 104 General-Purpose I/O (GPIO) Pins

· 337-Pin Ball Grid Array at 65 nm Process Technology

·  High-Performance Digital Media System-on-Chip

· 135-, 216-MHz ARM926EJ-S™ Clock Rate

· Fully Software-Compatible With ARM™

· Extended Temperature 135- and 216-MHz Devices are Available

·  ARM926EJ-S Core

· Support for 32-Bit and 16-Bit (Thumb Mode) Instruction Sets

· DSP Instruction Extensions and Single Cycle MAC

· ARM® Jazelle® Technology

· EmbeddedICE-RT™ Logic for Real-Time Debug

·  ARM9 Memory Architecture

· 16K-Byte Instruction Cache

· 8K-Byte Data Cache

· 32K-Byte RAM

· 8K-Byte ROM

· Little Endian

·  Video Processing Subsystem

· Front End Provides:

Hardware IPIPE for Real-Time Image Processing

Up to 14-bit CCD/CMOS Digital Interface

16-/8-bit Generic YcBcR-4:2 Interface (BT.601)

10-/8-bit CCIR6565/BT655 Interface

Up to 75-MHz Pixel Clock

Histogram Module

Resize Engine

§ Resize Images From 1/16x to 8x

§ Separate Horizontal/Vertical Control

§ Two Simultaneous Output Paths

· Back End Provides:

Hardware On-Screen Display (OSD)

Composite NTSC/PAL video encoder output

8-/16-bit YCC and Up to 18-Bit RGB666 Digital Output

BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface

Digital HDTV (720p/1080i)output for connection to external encoder

·  External Memory Interfaces (EMIFs)

· DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O)

· Asynchronous16-/8-bit Wide EMIF (AEMIF)

Flash Memory Interfaces

§ NAND (8-/16-bit Wide Data)

§ OneNAND(16-bit Wide Data)

·  Flash Card Interfaces

· Two Multimedia Card (MMC) / Secure Digital (SD/SDIO)

· SmartMedia

·  Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)

·  USB Port with Integrated 2.0 High-Speed PHY that Supports

· USB 2.0 Full and High-Speed Device

· USB 2.0 Low, Full, and High-Speed Host

·  Three 64-Bit General-Purpose Timers (each configurable as two 32-bit timers)

·  One 64-Bit Watch Dog Timer

·  Three UARTs (One fast UART with RTS and CTS Flow Control)

·  Three Serial Port Interfaces (SPI) each with two Chip-Selects

·  One Master/Slave Inter-Integrated Circuit (I2C) Bus®

·  Two Audio Serial Port (ASP)

· I2S and TDM I2S

· AC97 Audio Codec Interface

· S/PDIF via Software

· Standard Voice Codec Interface (AIC12)

· SPI Protocol (Master Mode Only)

·  Four Pulse Width Modulator (PWM) Outputs

·  Four RTO (Real Time Out) Outputs

·  Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.A.2

HTSN

8542310001

SCHEDULE B

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS3 Compliant


Documents & Media

Datasheets

TMS320DM335

Design Resources

Development Tool Selector

EDA / CAD Models

Download from Ultra Librarian


Product Manufacturer

Texas Instruments Inc. (TI) is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. Its headquarters are in Dallas, Texas, United States. TI is one of the top ten semiconductor companies worldwide, based on sales volume. Texas Instruments's focus is on developing analog chips and embedded processors, which accounts for more than 80% of their revenue. TI also produces TI digital light processing (DLP) technology and education technology products including calculators, microcontrollers and multi-core processors. To date, TI has more than 43,000 patents worldwide.


Product Range

Devices

Boards

Developer Tools

ARM ® PROCESSORS

AUTOMOTIVE PRODUCTS

IDENTIFICATION & SECURITY

Kinetis Cortex®-M Microcontrollers

In-Vehicle Network

NFC

LPC Cortex-M Microcontrollers

Microcontrollers and Processors

RFID


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

144 PCS

Texas Instruments

IC DGTL MEDIA SOC 337NFBGA

Digi-Key

Non-stock

Texas Instruments

IC DGTL MEDIA SOC 337NFBGA

Avnet

Non-stock

Texas Instruments

Digital Media System 337-Pin BGA

Mouser

Non-stock

Texas Instruments

Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on Chip


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

TMS320DM335ZCE270 Popularity by Region 

TMS320DM335ZCE270 Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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