Product Overview
Kynix Part #: | KY32-XQ2V1000-4FG456N |
Manufacturer Part#: | XQ2V1000-4FG456N |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XQ2V1000-4FG456N | |
Description: | - |
Datasheet: | XQ2V1000-4FG456N Datasheet |
Package: | BGA |
Quantity: | 131 PCS |
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Package Description | 1 MM PITCH, MO-151AAJ-1, FBGA-456 |
Series | - |
Status | Active |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Base Part Number | XQ2V1000 |
Clock Frequency-Max | 650 MHz |
Delay Time tpd(1) Max | 0.44 ns |
JESD-30 Code | S-PBGA-B456 |
JESD-609 Code | e0 |
Moisture Sensitivity Level | 3 |
Max Processing Temp | 240 |
Mounting Type | Surface Mount |
Number of Terminals | 456 |
Number of I/Os | 324 |
Number of CLBs | 1,280 |
Number of Gates | 1,000,000 |
Number of Inputs | 324 |
Number of Logic Cells | 11,520 |
Number of Outputs | 324 |
Operating Temperature | -55°C ~ 125°C (TJ) |
Organization | 1280 CLBS, 1000000 GATES |
Package Body Material | PLASTIC/EPOXY |
Pbfree Code | No |
Package Code | BGA |
Package Shape | SQUARE |
Pin Count | 456 |
PCB | 456 |
Packaging | Tray |
Package Equivalence Code | BGA456,22X22,40 |
Package Style | GRID ARRAY |
Power Supplies | 1.5,1.5/3.3,3.3 V |
Peak Reflow Temperature (Cel) | 225 |
Package / Case | 456-LBGA |
Supplier Device Package | 456-FTBGA (23x23) |
Qualification Status | Not Qualified |
Rohs Code | No |
Risk Rank | 5.85 |
RAM Size | 737,280 b |
Radiation Hardening | No |
Seated Height-Max | 2.6 mm |
Speed Grade | 4 |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 1.5 V |
Supply Voltage-Min | 1.425 V |
Supply Voltage-Max | 1.575 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Form | BALL |
Terminal Pitch | 1.0 mm |
Terminal Position | BOTTOM |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Length | 23 mm |
Width | 23 mm |
Features
Summary of QPro™ Virtex™-II Features
• Industry’s first military-grade platform FPGA solution
• Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)
• 100% factory tested
• Guaranteed over the full military temperature range (–55°C to +125°C) or industrial temperature range (–40°C to +100°C)
• Ceramic and plastic wire-bond and flip-chip grid array packages
• IP-immersion architecture
• Densities from 1M to 6M system gates
• 300+ MHz internal clock speed (Advance Data)
• 622+ Mb/s I/O (Advance Data)
• SelectRAM™ Memory Hierarchy
• 2.5 Mb of dual-port RAM in 18 Kbit block SelectRAM resources
• Up to 1 Mb of distributed SelectRAM resources
• High-performance interfaces to external memory
• DRAM interfaces
- SDR/DDR SDRAM
- Network FCRAM
- Reduced Latency DRAM
• SRAM interfaces
- SDR/DDR SRAM
- QDR SRAM
• CAM interfaces
• Arithmetic functions
• Dedicated 18-bit x 18-bit multiplier blocks
• Fast look-ahead carry logic chains
• Flexible logic resources
• Up to 67,584 internal registers/latches with Clock Enable
• Up to 67,584 look-up tables (LUTs) or cascadable 16- bit shift registers
• Wide multiplexers and wide-input function support
• Horizontal cascade chain and sum-of-products support
• Internal 3-state busing
• High-performance clock management circuitry
• Up to 12 DCM (Digital Clock Manager) modules
- Precise clock de-skew
- Flexible frequency synthesis
- High-resolution phase shifting
• 16 global clock multiplexer buffers
• Active interconnect technology
• Fourth-generation segmented routing structure
• Predictable, fast routing delay, independent of fanout
• SelectIO™-Ultra Technology
• Up to 824 user I/Os
• 19 single-ended and six differential standards
• Programmable sink current (2 mA to 24 mA) per I/O
• Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards
• PCI compliant (32/33 MHz) at 3.3V
• Differential signaling
• 622 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers
• Bus LVDS I/O
• Lightning Data Transport (LDT) I/O with current driver buffers
• Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O• Built-in DDR input and output registers
• Proprietary high-performance SelectLink Technology
- High-bandwidth data path
- Double Data Rate (DDR) link
- Web-based HDL generation methodology
• Supported by Xilinx Foundation Series™ and Alliance Series™ Development Systems
• Integrated VHDL and Verilog design flows
• Compilation of 10M system gates designs
• Internet Team Design (ITD) tool
• SRAM-based in-system configuration
• Fast SelectMAP configuration
• Triple Data Encryption Standard (DES) security option (Bitstream Encryption)
• IEEE 1532 support
• Partial reconfiguration
• Unlimited reprogrammability
• Readback capability
• 0.15 µm 8-layer metal process with 0.12 µm high-speed transistors
• 1.5V (VCCINT) core power supply, dedicated 3.3V VCCAUX auxiliary and VCCO I/O power supplies
• IEEE 1149.1 compatible Boundary-Scan logic support
Advantages and Disadvantages
Advantages
The Virtex-II family includes platform FPGAs developed for high performance from low-density to high-density designs that are based on IP cores and customized modules.
The leading-edge 0.15 µm/0.12 µm CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 8 million system gates, the Virtex-II family enhances programmable logic design capabilities and is a powerful alternative to maskprogrammed gates arrays.
Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A001.A.2.C |
HTSN | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS Compliant |
Documents & Media
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Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 131 PCS | Xilinx, Inc. | - |
Digi-Key | 0 | Xilinx, Inc. | FPGA QPRO 1MGATES 456FBGA |
Quest Components | 0 | Xilinx, Inc. | FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA456 |
Alternative Models
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Popularity by Region
XQ2V1000-4FG456N Popularity by Region
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