Product Overview
Kynix Part #: | KY32-XQV300-4PQ240N |
Manufacturer Part#: | XQV300-4PQ240N |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XQV300-4PQ240N | |
Description: | - |
Datasheet: | XQV300-4PQ240N Datasheet |
Package: | QFP |
Quantity: | 455 PCS |
XQV300-4PQ240N Images are for reference only.
CAD Models
XQV300-4PQ240N Symbol
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Package Description | PLASTIC, QFP-240 |
REACH Compliant | Yes |
Status | End Of Life |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Base Part Number | XQV300 |
Delay Time tpd(1) Max | 0.8 ns |
JESD-30 Code | S-PQFP-G240 |
JESD-609 Code | e0 |
Moisture Sensitivity Level | 3 |
Mounting Type | Surface Mount |
Number of Terminals | 240 |
Number of CLBs | 1,536 |
Number of Gates | 322,970 |
Number of Inputs | 166 |
Number of Logic Cells | 6,912 |
Number of Outputs | 166 |
Operating Temperature | -55°C ~ 125°C (TJ) |
Organization | 1536 CLBS, 322970 GATES |
Package Body Material | PLASTIC/EPOXY |
Pbfree Code | No |
Package Code | FQFP |
Package Shape | SQUARE |
Pin Count | 240 |
PCB | 240 |
Peak Reflow Temperature (Cel) | 225 |
Packaging | Tray |
Package Equivalence Code | QFP240,1.3SQ,20 |
Package Style | FLATPACK, FINE PITCH |
Power Supplies | 1.2/3.6,2.5 V |
Qualification Status | Not Qualified |
Rohs Code | No |
Risk Rank | 5.27 |
Radiation Hardening | No |
Seated Height-Max | 4.1 mm |
Speed Grade | 4 |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 2.5 V |
Supply Voltage-Min | 2.375 V |
Supply Voltage-Max | 2.625 V |
Surface Mount | Yes |
Screening Level | MIL-PRF-38535 |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm |
Terminal Position | QUAD |
Terminal Finish | Tin/Lead (Sn85Pb15) |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 32 mm |
Width | 32 mm |
Features
• Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)
• Guaranteed over the full military temperature range (–55°C to +125°C)
• Ceramic and Plastic Packages
• Fast, high-density Field-Programmable Gate Arrays
- Densities from 100K to 1M system gates
- System performance up to 200 MHz
- Hot-swappable for Compact PCI
• Multi-standard SelectI/O™ interfaces
- 16 high-performance interface standards
- Connects directly to ZBTRAM devices
• Built-in clock-management circuitry
- Four dedicated delay-locked loops (DLLs) for advanced clock control
- Four primary low-skew global clock distribution nets, plus 24 secondary global nets
• Hierarchical memory system
- LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register
- Configurable synchronous dual-ported 4K-bit RAMs
- Fast interfaces to external high-performance RAMs
• Flexible architecture that balances speed and density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input functions
- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensing device
• Supported by FPGA Foundation™ and Alliance Development Systems
- Complete support for Unified Libraries, Relationally Placed Macros, and Design Manager
- Wide selection of PC and workstation platforms
• SRAM-based in-system configuration
- Unlimited reprogrammability
- Four programming modes
• 0.22 µm 5-layer metal process
• 100% factory tested
• Available to Standard Microcircuit Drawings
- 5962-99572 for XQV300
- 5962-99573 for XQV600
- 5962-99574 for XQV1000
Advantages and Disadvantages
Advantages
The QPro™ Virtex™ FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays.
Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A001.A.2.C |
HTSN | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Documents & Media
There is no relevant information available for this part yet.
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 455 PCS | Xilinx, Inc. | - |
Heisener Electronics | 296 PCS | Xilinx, Inc. | IC FPGA 2.5V 300K GATES 240-BGA |
Resion LLC | 81 PCS | Xilinx, Inc. | - |
Nexxon, Inc | In Stock | Xilinx, Inc. | - |
Alternative Models
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Popularity by Region
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Market Price Analysis
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