Product Overview
Kynix Part #: | KY32-XC4VFX20-12FFG672C |
Manufacturer Part#: | XC4VFX20-12FFG672C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC4VFX20-12FFG672C | |
Description: | - |
Datasheet: | |
Package: | BGA |
Quantity: | 88 PCS |
XC4VFX20-12FFG672C Images are for reference only.
CAD Models
XC4VFX20-12FFG672C Symbol
XC4VFX20-12FFG672C Footprint
Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Series | Virtex®-4 FX |
Part Status | Active |
Base Part Number | XC4VFX20 |
Package Description | LEAD FREE, FBGA-672 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Clock Frequency-Max | 1181 MHz |
JESD-30 Code | S-PBGA-B672 |
JESD-609 Code | e1 |
Lead Finish | Tin/Silver/Copper |
Manufacturer | Xilinx Inc. |
Max Processing Temp | 245 |
Maximum Number of User I/Os | 320 |
Mounting | Surface Mount |
Number of LABs/CLBs | 2136 |
Number of Logic Elements/Cells | 19,224 |
Number of I/O | 320 |
Number of Reflow Cycle | 3 |
Number of Inputs | 320 |
Number of Outputs | 320 |
Operating Temperature | 0 to 85 °C |
Organization | 2136 CLBS |
Pin Count | 672 |
PCB | 672 |
Package Shape | SQUARE |
Package Equivalence Code | BGA672,26X26,40 |
Package Style | GRID ARRAY |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Process Technology | 90 nm |
Product Dimensions | 27 x 27 mm |
Program Memory Type | SRAM |
Package / Case | 672-BBGA, FCBGA |
Package Body Material | PLASTIC/EPOXY |
Pin Count | 672 |
Pbfree Code | Yes |
Supplier Device Package | 672-FCBGA (27x27) |
RAM Bits | 1,253,376 b |
Risk Rank | 5.21 |
Rohs Code | Yes |
Reflow Solder Time (Sec) | 30 |
Radiation Hardening | No |
Speed Grade | 12 |
Seated Height-Max | 3 mm |
Supply Voltage-Nom | 1.2 V |
Supply Voltage-Min | 1.14 V |
Supply Voltage-Max | 1.26 V |
Width | 27 mm |
Length | 27 mm |
Terminal Pitch | 1 mm |
Technology | CMOS |
Transceiver Speed | 6.5 Gbps |
Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
[email protected] Reflow Temperature-Max (s) | 30 |
Terminal Form | BALL |
Terminal Position | BOTTOM |
Typical Operating Supply Voltage | 1.2 V |
Features
High-performance, full-featured solution for embedded platform applications
Xesium™ Clock Technology
Digital clock manager (DCM) blocks
Additional phase-matched clock dividers (PMCD)
Differential global clocks
XtremeDSP™ Slice
18 x 18, two’s complement, signed Multiplier
Optional pipeline stages
Built-in Accumulator (48-bit) and Adder/Subtracter
Smart RAM Memory Hierarchy
Distributed RAM
Dual-port 18-Kbit RAM blocks · Optional pipeline stages · Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
SelectIO™ Technology
1.5V to 3.3V I/O operation
Built-in ChipSync™ source-synchronous technology
Digitally controlled impedance (DCI) active termination
Fine grained I/O banking (configuration in one bank)
Flexible Logic Resources
Secure Chip AES Bitstream Encryption
90 nm Copper CMOS Process
1.2V Core Voltage
Flip-Chip Packaging including Pb-Free Package Choices
RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
IBM PowerPC RISC Processor Core [FX only]
PowerPC 405 (PPC405) Core
Auxiliary Processor Unit Interface (User Coprocessor)
Multiple Tri-Mode Ethernet MACs [FX only]
Advantages and Disadvantages
There is no relevant information available for this part yet.
Applications
There is no relevant information available for this part yet.
Product Functions
There is no relevant information available for this part yet.
ECCN / UNSPSC
Description | Value |
ECCN | EAR99 |
HTSN | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
There is no relevant information available for this part yet.
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
89 PCS | Xilinx, Inc. | - | |
Digi-Key | 0 | Xilinx, Inc. | - |
Avnet | Europe - 0 | Xilinx, Inc. | FPGA Virtex-4 FX Family 19224 Cells 90nm (CMOS) Technology 1.2V 672-Pin FCBGA (Alt: XC4VFX20-12FFG672CS1) |
Mouser | 0 | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
Alternative Models
There is no relevant information available for this part yet.
Popularity by Region
XC4VFX20-12FFG672C Popularity by Region
Market Price Analysis
There is no relevant information available for this part yet.
You May Also Be Interested In
Part Number | Manufacturer | Package | Quantity | Description |
Xilinx Inc. | BGA | 88 PCS | - | |
Xilinx Inc. | BGA | 88 PCS | IC FPGA 350 I/O 1158FCBGA | |
Xilinx Inc. | BGA | 88 PCS | IC FPGA 600 I/O 1157FCBGA | |
Xilinx Inc. | BGA | 88 PCS | - | |
Xilinx Inc. | BGA | 88 PCS | IC FPGA 350 I/O 1158FCBGA | |
Xilinx Inc. | BGA | 88 PCS | IC FPGA 600 I/O 1927BGA |
Best Sales of diode
Photo | Part | Company | Description | Pricing (USD) |
Alternative Models
Part | Compare | Manufacturers | Category | Description |
Ordering & Quality
Image | Mfr. Part # | Company | Description | Package | Qty | Pricing (USD) |