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XC4VFX20-12FFG672C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 10 Oct 2019
 1510
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC4VFX20-12FFG672C

Manufacturer Part#:

XC4VFX20-12FFG672C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

-

Datasheet:

XC4VFX20-12FFG672C Datasheet

Package:

BGA

Quantity:

88 PCS


XC4VFX20-12FFG672C Images are for reference only.

XC4VFX20-12FFG672C Image 


CAD Models

 XC4VFX20-12FFG672C Symbol

XC4VFX20-12FFG672C Symbol

XC4VFX20-12FFG672C Footprint 

XC4VFX20-12FFG672C Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Series

Virtex®-4 FX

Part Status

Active

Base Part Number

XC4VFX20

Package Description

LEAD FREE, FBGA-672

REACH Compliant

Yes

EU RoHS Compliant

Yes

Clock Frequency-Max

1181 MHz

JESD-30 Code

S-PBGA-B672

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Manufacturer

Xilinx Inc.

Max Processing Temp

245

Maximum Number of User I/Os

320

Mounting

Surface Mount

Number of LABs/CLBs

2136

Number of Logic Elements/Cells

19,224

Number of I/O

320

Number of Reflow Cycle

3

Number of Inputs

320

Number of Outputs

320

Operating Temperature

0 to 85 °C

Organization

2136 CLBS

Pin Count

672

PCB

672

Package Shape

SQUARE

Package Equivalence Code

BGA672,26X26,40

Package Style

GRID ARRAY

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Process Technology  

90 nm

Product Dimensions

27 x 27 mm

Program Memory Type  

SRAM

Package / Case

672-BBGA, FCBGA

Package Body Material

PLASTIC/EPOXY

Pin Count

672

Pbfree Code

Yes

Supplier Device Package

672-FCBGA (27x27)

RAM Bits

1,253,376 b

Risk Rank

5.21

Rohs Code

Yes

Reflow Solder Time (Sec)

30

Radiation Hardening

No

Speed Grade

12

Seated Height-Max

3 mm

Supply Voltage-Nom

1.2 V

Supply Voltage-Min

1.14 V

Supply Voltage-Max

1.26 V

Width

27 mm

Length

27 mm

Terminal Pitch

1 mm

Technology

CMOS

Transceiver Speed  

6.5 Gbps

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

[email protected] Reflow Temperature-Max (s)

30

Terminal Form

BALL

Terminal Position

BOTTOM

Typical Operating Supply Voltage

1.2 V


Features

High-performance, full-featured solution for embedded platform applications

Xesium™ Clock Technology

  • Digital clock manager (DCM) blocks

  • Additional phase-matched clock dividers (PMCD)

  • Differential global clocks

XtremeDSP™ Slice

  • 18 x 18, two’s complement, signed Multiplier

  • Optional pipeline stages

  • Built-in Accumulator (48-bit) and Adder/Subtracter

Smart RAM Memory Hierarchy

  • Distributed RAM

  • Dual-port 18-Kbit RAM blocks · Optional pipeline stages · Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals

  • High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.

SelectIO™ Technology

  • 1.5V to 3.3V I/O operation

  • Built-in ChipSync™ source-synchronous technology

  • Digitally controlled impedance (DCI) active termination

  • Fine grained I/O banking (configuration in one bank)

Flexible Logic Resources

Secure Chip AES Bitstream Encryption

90 nm Copper CMOS Process

1.2V Core Voltage

Flip-Chip Packaging including Pb-Free Package Choices

RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]

IBM PowerPC RISC Processor Core [FX only]

  • PowerPC 405 (PPC405) Core

  • Auxiliary Processor Unit Interface (User Coprocessor)

Multiple Tri-Mode Ethernet MACs [FX only]


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

89 PCS

Xilinx, Inc.

-

Digi-Key

0

Xilinx, Inc.

-

Avnet

Europe - 0

Xilinx, Inc.

FPGA Virtex-4 FX Family 19224 Cells 90nm (CMOS) Technology 1.2V 672-Pin FCBGA (Alt: XC4VFX20-12FFG672CS1)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC4VFX20-12FFG672C Popularity by Region 

XC4VFX20-12FFG672C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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