Product Overview
Kynix Part #: | KY32-XC3S1200E-4FGG320C |
Manufacturer Part#: | XC3S1200E-4FGG320C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC3S1200E-4FGG320C | |
Description: | IC FPGA 250 I/O 320FBGA |
Datasheet: | XC3S1200E-4FGG320C Datasheet |
Package: | BGA |
Quantity: | 2585 PCS |
XC3S1200E-4FGG320C Images are for reference only.
CAD Models
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XC3S1200E-4FGG320C Footprint
Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Series | Spartan®-3E |
Base Part Number | XC3S1200E |
Brand | Xilinx |
Package Description | 19 X 19 MM, 2 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-320 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Status | Active |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Basic Package Type | Ball Grid Array |
Clock Frequency-Max | 572 MHz |
Combinatorial Delay of a CLB-Max | 0.76 ns |
Data Rate | 333 Mb/s |
Distributed RAM | 136 kbit |
Embedded Block RAM - EBR | 504 kbit |
In System Programmability | Yes |
JESD-30 Code | S-PBGA-B320 |
JESD-609 Code | e1 |
Moisture Sensitivity Level | 3 |
Maximum Number of User I/Os | 250 |
Maximum Internal Frequency | 572 MHz |
Number of CLBs/LABs | 2,168 |
Number of Inputs | 250 |
Number of Registers | 17,344 |
Number of Logic Cells | 19,512 |
Number of Logic Units | 2,168 |
Number of Equivalent Gates | 1,200,000 |
Number of Gates | 1,200,000 |
Number of Outputs | 194 |
Number of Terminals | 320 |
Number of I/O | 250 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Organization | 2168 CLBS, 1200000 GATES |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Pbfree Code | Yes |
Package Equivalence Code | BGA320,18X18,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 260 |
Packaging | Tray |
Power Supplies | 1.2,1.2/3.3,2.5 V |
Product Dimensions | 19 x 19 x 1.4 mm |
Pin Count | 320 |
PCB | 320 |
Package / Case | 320-BGA |
Supplier Device Package | 320-FBGA (19x19) |
Qualification Status | Not Qualified |
Rohs Code | Yes |
Re-programmability Support | 1 |
Radiation Hardening | No |
Risk Rank | 1.6 |
RAM Bits | 516,096 b |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 1.2 V |
Supply Voltage-Min | 1.14V |
Supply Voltage-Max | 1.26 V |
Seated Height-Max | 2.0 mm |
Speed Grade | 4 |
Screening Level | Commercial |
Surface Mount | Yes |
Typical Operating Supply Voltage | 1.2 V |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal Pitch | 1.0 mm |
Terminal Form | Ball |
Terminal Position | Bottom |
Time@Peak Reflow Temperature-Max (s) | 30 |
Tradename | Spartan |
Length | 19 mm |
Width | 19 mm |
Features
Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
Proven advanced 90-nanometer process technology
Multi-voltage, multi-standard SelectIO™ interface pins
Up to 376 I/O pins or 156 differential signal pairs
LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
622+ Mb/s data transfer rate per I/O
True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
Enhanced Double Data Rate (DDR) support
DDR SDRAM support up to 333 Mb/s
Abundant, flexible logic resources
Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
Efficient wide multiplexers, wide logic
Fast look-ahead carry logic
Enhanced 18 x 18 multipliers with optional pipeline
IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM™ memory architecture
Up to 648 Kbits of fast block RAM
Up to 231 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
Clock skew elimination (delay locked loop)
Frequency synthesis, multiplication, division
High-resolution phase shifting
Wide frequency range (5 MHz to over 300 MHz)
Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
Low-cost, space-saving SPI serial Flash PROM
x8 or x8/x16 parallel NOR Flash PROM
Low-cost Xilinx® Platform Flash with JTAG
Complete Xilinx ISE® and WebPACK™ software
MicroBlaze™ and PicoBlazeä embedded processor cores
Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)
Low-cost QFP and BGA packaging options
Common footprints support easy density migration
Pb-free packaging options
Advantages and Disadvantages
Advantages
The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates.
The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.
Applications
There is no relevant information available for this part yet.
Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | 8542390001 |
SCHEDULE B | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 2585 PCS | Xilinx, Inc. | IC FPGA 250 I/O 320FBGA |
Digi-Key | 199 PCS | Xilinx, Inc. | IC FPGA 250 I/O 320FBGA |
Avnet | Americas - 380 Asia - 0 | Xilinx, Inc. | FPGA Spartan-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 320-Pin F-BGA - Trays (Alt: XC3S1200E-4FGG320C) |
Mouser | 239 PCS | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
Alternative Models
There is no relevant information available for this part yet.
Popularity by Region
XC3S1200E-4FGG320C Popularity by Region
Market Price Analysis
XC3S1200E-4FGG320C Market Price Analysis
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