Product Overview
Kynix Part #: | KY32-5CEFA4U19I7N |
Manufacturer Part#: | 5CEFA4U19I7N |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Altera |
Click Purchase button to buy original genuine 5CEFA4U19I7N | |
Description: | IC FPGA 224 I/O 484UBGA |
Datasheet: | 5CEFA4U19I7N Datasheet |
Package: | BGA |
Quantity: | 121 PCS |
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Package Description | ROHS COMPLIANT, UBGA-484 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Status | Transferred |
Series | Cyclone V E |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Base Part Number | 5CEFA4 |
Copy Protection | Yes |
Device Number of DLLs/PLLs | 4 |
Dedicated DSP | 66 |
Embedded Block RAM - EBR | 303 kbit |
Embedded Memory | 3080 kbit |
External Memory Interface | LPDDR2|DDR3 SDRAM|DDR2 SDRAM |
In System Programmability | Yes |
Lead Finish | Tin/Silver/Copper |
JESD-30 Code | S-PBGA-B484 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level | 4 |
Maximum Operating Frequency | 800 MHz |
Number of CLBs | 18,480 |
Number of Inputs | 304 |
Number of Registers | 73.920 |
Number of Logic Cells | 49000 |
Number of Logic Units | 49000 |
Number of Outputs | 304 |
Number of Block RAM | 308 |
Number of Multipliers | 132 (18x18) |
Number of Logic Blocks (LABs) | 18,480 |
Number of Global Clocks | 16 |
Number of Terminals | 484 |
Number of I/O | 224 |
Organization | 18480 CLBS |
Operating Temperature | -40°C ~ 100°C (TJ) |
Operating Supply Voltage | 1.2 V |
Package Body Material | PLASTIC/EPOXY |
Program Memory Type | SRAM |
Package Code | FBGA |
Programmability | Yes |
Reprogrammability Support | Yes |
Package Equivalence Code | BGA484,22X22,32 |
Package Shape | SQUARE |
Packaging | Tray |
Pin Count | 484 |
Process Technology | 28 nm |
Power Supplies | 1.2,2.5/3.3 V |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 260 |
Product Type | FPGA - Field Programmable Gate Array |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Package / Case | 484-FBGA |
RAM Bits | 3,464,192 b |
Radiation Hardening | No |
Re-programmability Support | 1 |
Supplier Device Package | 484-UBGA (19x19) |
Qualification Status | Not Qualified |
Seated Height-Max | 1.9 mm |
Sub Category | Programmable Logic ICs |
Supply Voltage-Nom | 1.1 V |
Supply Voltage-Min | 1.07 V |
Supply Voltage-Max | 1.13 V |
Surface Mount | Yes |
Speed Grade | 7 |
Technology | CMOS |
Temperature Grade | Industrial |
Tradename | Cyclone |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | Bottom |
Time@Peak Reflow Temperature-Max (s) | 30 |
Typical Operating Supply Voltage | 1.2000 V |
User I/Os | 224 |
Height | 1.35 mm |
Length | 19 mm |
Width | 19 mm |
Features
TSMC's 28-nm low-power (28LP) process technology
1.1 V core voltage
Wirebond low-halogen packages
Multiple device densities with compatible package footprints for seamless migration between different device densities
RoHS-compliant and leaded(1)options
Enhanced 8-input ALM with four registers
M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of the ALMs as MLAB memory
Variable-precision DSP
• Native support for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same variable-precision DSP block
• 64-bit accumulator and cascade
• Embedded internal coefficient memory
• Preadder/subtractor for improved efficiency
Memory controller
DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support
Embedded transceiver I/O
PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with multifunction support, endpoint, and root port
Up to 550 MHz global clock network
Global, quadrant, and peripheral clock networks
Clock networks that are not used can be powered down to reduce dynamic power
Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
Integer mode and fractional mode
875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
400 MHz/800 Mbps external memory interface
On-chip termination (OCT)
3.3 V support with up to 16 mA drive strength
614 Mbps to 6.144 Gbps integrated transceiver speed
Transmit pre-emphasis and receiver equalization
Dynamic partial reconfiguration of individual channels
Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with support for symmetric and asymmetric multiprocessing
Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0
On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO interfaces
System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA) controller, FPGA configuration manager, and clock and reset managers
On-chip RAM and boot ROM
HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa
FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport front end (MPFE) of the HPS SDRAM controller
Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
Tamper protection—comprehensive design protection to protect your valuable IP investments
Enhanced advanced encryption standard (AES) design security features
CvP
Dynamic reconfiguration of the FPGA
Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and x16 configuration options
Internal scrubbing (2)
Partial reconfiguration (3)
Advantages and Disadvantages
Advantages
Enhanced with integrated transceivers and hard memory controllers, the Cyclone V devices are suitable for applications in the industrial, wireless and wireline, military, and automotive markets.
Lower power consumption
Improved logic integration and differentiation capabilities
Hard processor system (HPS) with integrated Arm* Cortex*-A9 MPCore* processor
Lowest system cost
Applications
There is no relevant information available for this part yet.
Product Functions
There is no relevant information available for this part yet.
ECCN / UNSPSC
Description | Value |
ECCN (US) | 3A991 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 121 PCS | Intel Corporation | IC FPGA 224 I/O 484UBGA |
Digi-Key | On Order | Intel Corporation | IC FPGA 224 I/O 484UBGA |
Arrow | 0 | Intel Corporation | FPGA Cyclone® V E Family 49000 Cells 28nm Technology 1.1V 484-Pin UFBGA |
Mouser | 0 | Intel Corporation | FPGA - Field Programmable Gate Array FPGA - Cyclone V E 1848 LABs 224 IOs |
Alternative Models
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5CEFA4U19I7N Popularity by Region
Market Price Analysis
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