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Sep 12 2019

XC7VX485T-L2FFG1930E Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7VX485T-L2FFG1930E

Manufacturer Part#:

XC7VX485T-L2FFG1930E

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 700 I/O 1930BGA

Datasheet:

XC7VX485T-L2FFG1930E Datasheet

Package:

BGA

Quantity:

88 PCS


XC7VX485T-L2FFG1930E Images are for reference only.

XC7VX485T-L2FFG1930E Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Virtex®-7 XT

Base Part Number

XC7VX485T

Package Description

FBGA-1930

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,818 MHz

Combinatorial Delay of a CLB-Max

0.61 ns

Clock Management

MMCM, PLL

Data Rate

28.05 Gb/s

Distributed RAM

8175 kbit

Embedded Block RAM - EBR

37080 kbit

JESD-30 Code

S-PBGA-B1930

JESD-609 Code

e1

Moisture Sensitivity Level

4

Maximum Number of User I/Os

700

Number of CLBs

37,950

Number of Inputs

700

Number of Logic Cells

485,760

Number of Logic Units

303,600

Number of Outputs  

700

Number of Terminals

1930

Number of I/O

700

Number of Logic Blocks (LABs)

37,950

Number of Registers

607,200

Operating Temperature

0°C ~ 100°C (TJ)

Organization

37950 CLBS

Operating Frequency Max

710 MHz

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Product Range

Virtex®-7 XC7VX485T Series

Package Type

FCBGA

Package Equivalence Code

BGA, BGA1924,44X44,40

Product Dimensions

45 x 45 mm

Package Shape

SQUARE

Packaging

Tray

Pbfree Code

Yes

Product Type

FPGA - Field Programmable Gate Array

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8 V

Pin Count

1930

PCB

1930

Propagation Delay

0.1ns

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1930-FCBGA (45x45)

Qualification Status  

Not Qualified

RAM Bits

37,969,920 b

Rohs Code

Yes

Risk Rank

5.64

Sub Category

Field Programmable Gate Arrays

Seated Height-Max

3.65 mm

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97V

Supply Voltage-Max

1.03 V

Surface Mount  

Yes

Speed Grade

2L

Technology

CMOS

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Typical Operating Supply Voltage

1.0 V

Length

45 mm

Width

45 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.

Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

-

Digi-Key

0

Xilinx, Inc.

-

Avnet

Americas - 6

Xilinx, Inc.

-

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

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Market Price Analysis

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