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XC7VX1140T-G2FL1928E Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 19 Aug 2019
 808
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7VX1140T-G2FL1928E

Manufacturer Part#:

XC7VX1140T-G2FL1928E

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

Click Purchase button to buy original genuine XC7VX1140T-G2FL1928E

Purchase 

Description:

-

Datasheet:

XC7VX1140T-G2FL1928E Datasheet

Package:

BGA

Quantity:

88 PCS


XC7VX1140T-G2FL1928E Images are for reference only.

XC7VX1140T-G2FL1928E Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Virtex®-7 XT

Base Part Number

XC7VX1140T

Package Description

FBGA-1924

REACH Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,818 MHz

Clock Management

MMCM, PLL

JESD-30 Code

S-PBGA-B1924

Moisture Sensitivity Level

4

Maximum Propagation Delay Time

0.1 ns

Number of CLBs

89,000

Number of Inputs

480

Number of Logic Cells

1,139,200

Number of Logic Units

712,000

Number of Outputs  

480

Number of Terminals

1924

Number of I/O

480

Number of Logic Blocks (LABs)

89,000

Number of Registers

1,424,000

Operating Temperature

0°C ~ 100°C (TJ)

Organization

89,000 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Product Range

Virtex®-7 XC7VX1140T Series

Package Type

FCBGA

Package Equivalence Code

BGA, BGA1924,44X44,40

Product Dimensions

45 x 45 mm

Package Shape

SQUARE

Product Type

FPGA - Field Programmable Gate Array

Packaging

Tray

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8 V

Pin Count

1924

PCB

1924

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1928-FCBGA (45x45)

Qualification Status  

Not Qualified

RAM Bits

69,304,320 b

Rohs Code

No

Risk Rank

5.85

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97V

Supply Voltage-Max

1.03 V

Surface Mount  

Yes

Technology

CMOS

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Turn-On Delay Time

0.1 ns

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Typical Operating Supply Voltage

1.0 V

Length

45 mm

Width

45 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages 

Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

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Product Functions

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ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

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Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

-

Digi-Key

0

Xilinx, Inc.

-

Avnet

Americas - 16

Xilinx, Inc.

-

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

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Market Price Analysis

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