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XC7K70T-1FBG676C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 13 Aug 2019
 2057
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7K70T-1FBG676C

Manufacturer Part#:

XC7K70T-1FBG676C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 300 I/O 676FCBGA

Datasheet:

XC7K70T-1FBG676C Datasheet

Package:

BGA

Quantity:

155 PCS


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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K70T

Package Description

FBGA-676

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,098 MHz

Combinatorial Delay of a CLB-Max

0.74 ns

Clock Management

MMCM, PLL

Distributed RAM  

838 kbit

Embedded Block RAM - EBR

4860 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B676

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Maximum Number of User I/Os

200

Max Processing Temp

250

Number of CLBs

5,125

Number of Inputs

300

Number of Logic Cells

65,600

Number of Logic Units

41,000

Number of Outputs  

300

Number of Terminals

676

Number of I/O

300

Number of Transceivers

4

Number of Logic Blocks (LABs)

5,125

Number of Registers

82,000

Operating Temperature

0°C ~ 85°C (TJ)

Organization

5125 CLBS

Operating Supply Voltage

1 V

Package Body Material

PLASTIC

Package Code

BGA

Pbfree Code

Yes

Product Range

Kintex-7 XC7K70T Series

Package Type

FCBGA

Package Equivalence Code

BGA, BGA676,26X26,40

Package Shape

SQUARE

Product Dimensions

27 x 27 x 1.84 mm

Product Type

FPGA - Field Programmable Gate Array

Package Style

GRID ARRAY

Packaging

Tray

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8,3.3 V

Pin Count

676

PCB

676

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27x27)

Qualification Status  

Not Qualified

RAM Bits

4,976,640 b

Rohs Code

Yes

Risk Rank

1.58

Re-programmability Support

1

Radiation Hardening

No

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97 V

Supply Voltage-Max

1.03 V

Sub Category

Programmable Logic ICs

Surface Mount  

Yes

Seated Height-Max

2.54 mm

Speed Grade

1

Screening Level

Commercial

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Tradename

Kintex

Length

27 mm

Width

27 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542390001

SCHEDULE B

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet                         

7 Series FPGA Overview

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

Featured Product

TE0741 Series with Xilinx Kintex®-7

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

Cross-Ship Lead-Free Notice 31/Oct/2016

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

155 PCS

Xilinx, Inc.

IC FPGA 300 I/O 676FCBGA

Digi-Key

177 PCS

Xilinx, Inc.

IC FPGA 300 I/O 676FCBGA

Avnet

Americas - 0

Europe - 7

Asia - 0

Xilinx, Inc.

FPGA Kintex-7 Family 65600 Cells 28nm Technology 1V 676-Pin Lidless FCBGA (Alt: XC7K70T-1FBG676C)

Mouser

78 PCS

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

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Market Price Analysis

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