Product Overview
Kynix Part#: | KY32-XC3S1600E-5FGG400C |
Manufacturer Part#: | XC3S1600E-5FGG400C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx |
Click Purchase button to buy original genuine XC3S1600E-5FGG400C |
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Description: | - |
Datasheet: | XC3S1600E-5FGG400C Datasheet |
Package: | BGA |
Quantity: | 328 PCS |
XC3S400AN-5FGG400C Images are for reference only:
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Product Attributes
Manufacturer: | Xilinx |
Product Category: | IC Chips |
Status: | Active |
Series: | Spartan®-3E |
Clock Frequency-Max: | 657.0 MHz |
Combinatorial Delay of a CLB-Max: | 0.66 ns |
Data Rate: | 333 Mb/s |
Distributed RAM: | 231 kbit |
Device Logic Cells: | 33192 |
Device Logic Units: | 3688 |
Device Logic Gates: | 1600000 |
Device System Gates: | 1600000 |
EU RoHS Compliant: | Yes |
Embedded Block RAM - EBR: | 648 kbit |
In System Programmability: | Yes |
JESD-30 Code: | S-PBGA-B400 |
JESD-609 Code: | e1 |
Length: | 21.0 mm |
Lead Finish: | Tin/Silver/Copper |
Mounting Type: | Surface Mount |
Mounting Style: | SMD/SMT |
Maximum Internal Frequency: | 657 MHz |
Maximum Operating Frequency: | 300 MHz |
Number of I/Os: | 304 |
Number of Pins: | 400 |
Number of CLBs: | 3688.0 |
Number of Inputs: | 304.0 |
Number of Outputs: | 132.0 |
Number of Registers: | 29504 |
Number of Terminals: | 400 |
Number of Logic Cells: | 33192.0 |
Number of Equivalent Gates: | 1600000.0 |
Organization: | 3688 CLBS, 1600000 GATES |
Operating Temperature-Min: | 0.0 °C |
Operating Temperature-Max: | 85.0 °C |
Pin Count: | 400 |
Product Type: | FPGA - Field Programmable Gate Array |
Power Supplies: | 1.2,1.2/3.3,2.5 |
Package / Case: | 400-BGA |
Package Code: | BGA |
Package Style: | GRID ARRAY |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA400,20X20,40 |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
Peak Reflow Temperature: | 250 °C |
RAM Bits: | 663,552 Bit |
REACH Compliant: | Yes |
Re-programmability Support: | 1 |
Speed Grade: | 5 |
Sub Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
Screening Level: | Commercial |
Seated Height-Max: | 2.43 mm |
Supply Voltage-Nom: | 1.2V |
Supply Voltage-Min: | 1.14 V |
Supply Voltage-Max: | 1.26 V |
Supplier Device Package: | 400-FBGA (21x21) |
Tradename: | Spartan |
Technology: | CMOS |
Total RAM Bits: | 663552 |
Terminal Form: | BALL |
Terminal Pitch: | 1.0 mm |
Terminal Finish: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal Position: | BOTTOM |
Temperature Grade: | OTHER |
Time@Peak Reflow Temperature-Max: | 30 s |
Voltage - Supply: | 1.14 V ~ 1.26 V |
Width: | 21.0 mm |
Product Features
• Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
• Proven advanced 90-nanometer process technology
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 376 I/O pins or 156 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• 622+ Mb/s data transfer rate per I/O
• True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
• Enhanced Double Data Rate (DDR) support
• DDR SDRAM support up to 333 Mb/s
• Abundant, flexible logic resources
• Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
• Efficient wide multiplexers, wide logic
• Fast look-ahead carry logic
• Enhanced 18 x 18 multipliers with optional pipeline
• IEEE 1149.1/1532 JTAG programming/debug port
• Hierarchical SelectRAM™ memory architecture
• Up to 648 Kbits of fast block RAM
• Up to 231 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
• Clock skew elimination (delay locked loop)
• Frequency synthesis, multiplication, division
• High-resolution phase shifting
• Wide frequency range (5 MHz to over 300 MHz)
• Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing
• Configuration interface to industry-standard PROMs
• Low-cost, space-saving SPI serial Flash PROM
• x8 or x8/x16 parallel NOR Flash PROM
• Low-cost Xilinx® Platform Flash with JTAG
• Complete Xilinx ISE® and WebPACK™ software
• MicroBlaze™ and PicoBlazeä embedded processor cores
• Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)
• Low-cost QFP and BGA packaging options
• Common footprints support easy density migration
• Pb-free packaging options
• XA Automotive version available
Product Functions
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Applications
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Advantages and Disadvantages
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ECCN / UNSPSC
ECCN: | 3A991D |
HTSN: | 8542390001"8542.39.00.01 |
SCHEDULE B: | 8542390000"8542.39.00.00 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
RoHS: | Compliant |
TARIC: | 8542399000 |
USHTS: | 8542390001 |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 328 | Xilinx | - |
DigiKey | 0 | Xilinx Inc. | IC FPGA 304 I/O 400FBGA |
Mouser | 0 | Xilinx | FPGA - Field Programmable Gate Array |
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