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XC7K410T-L2FFG900E Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 7 Aug 2019
 1165
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7K410T-L2FFG900E

Manufacturer Part#:

XC7K410T-L2FFG900E

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

XC7K410T-L2FFG900E Datasheet

Package:

BGA

Quantity:

88 PCS


XC7K410T-L2FFG900E Images are for reference only.

XC7K410T-L2FFG900E Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K410T

Package Description

FBGA-900

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Contact Manufacturer

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Combinatorial Delay of a CLB-Max

0.91 ns

Contact Plating

Copper , Tin , Silver

Clock Management

MMCM, PLL

Device Number of DLLs/PLLs

10

In System Programmability

Yes

JESD-30 Code

S-PBGA-B900

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Moisture Sensitivity Level

4

Max Processing Temp

245 °C

Maximum Number of User I/Os

350

Memory Size

1 GB

Memory Type

DDR3

Number of Multipliers

1540 (25x18)

Number of CLBs

31,775

Number of Inputs

500

Number of Reflow Cycle

3

Number of Logic Cells

406,720

Number of Logic Units

254,200

Number of Outputs  

500

Number of Terminals

900

Number of Transceivers

16

Number of I/O

500

Number of Logic Blocks (LABs)

31,775

Number of Registers

508,400

Operating Temperature

0°C ~ 100°C (TJ)

Organization

31,775 CLBS

Operating Frequency Max

710 MHz

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Product Range

Kintex-7 XC7K410T Series

Package Type

FCBGA

Package Equivalence Code

BGA, BGA900,30X30,40

Package Shape

SQUARE

Product Dimensions

31 x 31 x 2.85 mm

ProgrammabilityYes

Yes

Pbfree Code

Yes

Product Type

FPGA - Field Programmable Gate Array

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

0.9,1.8,3.3 V

Program Memory Type

SRAM

Pin Count

900

PCB

900

Process Technology

28 nm

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31 x 31)

Qualification Status  

Not Qualified

RAM Bits

29,306,880 b

Rohs Code

Yes

Risk Rank

5.45

Re-programmability Support

1

Seated Height-Max

3.35 mm

Sub Category

Programmable Logic ICs

Supply Voltage-Nom

0.9 V

Supply Voltage-Min

0.87 V

Supply Voltage-Max

0.93 V

Surface Mount  

Yes

Speed Grade

2L

Screening Level

Extended

Technology

CMOS

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Transceiver Blocks

16

Total Number of Block RAM

795

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Tradename

Kintex

Typical Operating Supply Voltage

1 V

Length

31 mm

Width

31 mm

Additional Feature

ALSO OPERATES AT 1 V SUPPLY


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages 

Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542390001

SCHEDULE B

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet                         

7 Series FPGA Overview

Kintex-7 FPGA CES Errata

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

Featured Product

TE0741 Series with Xilinx Kintex®-7

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

Cross-Ship Lead-Free Notice 31/Oct/2016

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014

HTML Datasheet

7 Series FPGA Overview

Kintex-7 FPGAs Datasheet


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

IC FPGA 500 I/O 900FCBGA

Digi-Key

3 PCS

Xilinx, Inc.

IC FPGA 500 I/O 900FCBGA

Avnet

Americas - 0

Europe - 0

Asia - 0

Xilinx, Inc.

FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V 900-Pin FC-BGA (Alt: XC7K410T-L2FFG900E)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models


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Popularity by Region

XC7K410T-L2FFG900E Popularity by Region

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Market Price Analysis

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