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XC7K410T-L2FBG676E Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 7 Aug 2019
 1674
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7K410T-L2FBG676E

Manufacturer Part#:

XC7K410T-L2FBG676E

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

XC7K410T-L2FBG676E Datasheet

Package:

BGA

Quantity:

88 PCS


XC7K410T-L2FBG676E Images are for reference only.

XC7K410T-L2FBG676E Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K410T

Package Description

FBGA-676

REACH Compliant

Yes

Ethernet

Yes

Status

Contact Manufacturer

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Combinatorial Delay of a CLB-Max

0.91ns

Data Rate

6.6 Gb/s

Distributed RAM  

5,663 kbit

Embedded Block RAM - EBR

28,620 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B676

JESD-609 Code

e1

Moisture Sensitivity Level

4

Max Processing Temp

250 Cel

Maximum Operating Frequency

640 MHz

Maximum Number of User I/Os

250

Number of CLBs

31,775

Number of Inputs

400

Number of Logic Cells

406,720

Number of Logic Units

254,200

Number of Outputs  

400

Number of Terminals

676

Number of I/O

400

Number of Transceivers

8

Number of Logic Blocks (LABs)

31,775

Number of Registers

508,400

Operating Temperature

0°C ~ 100°C (TJ)

Organization

31,775 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Type

FCBGA

Package Equivalence Code

BGA, BGA676,26X26,40

Packaging

Tray

Package Style

GRID ARRAY

Product Type

FPGA - Field Programmable Gate Array

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Package Shape

SQUARE

Power Supplies

0.9,1.8,3.3 V

Pin Count

676

PCB

676

Pbfree Code

Yes

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27 x 27)

Product Dimensions

27 x 27 x 1.84 mm

Qualification Status  

Not Qualified

RAM Bits

29,306,880 b

RoHS

Compliant

Risk Rank

5.76

Rohs Code

Yes

Radiation Hardening

No

Sub Category

Programmable Logic ICs

Surface Mount  

Yes

Seated Height-Max

2.54 mm

Screening Level

Extended

Supply Voltage-Min

0.87 V

Supply Voltage-Nom

0.9 V

Supply Voltage-Max

0.93 V

Speed Grade

2L

Technology

CMOS

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Typical Operating Supply Voltage

1 V

Length

27 mm

Width

27 mm

Additional Feature

ALSO OPERATES AT 1 V SUPPLY


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages 

Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991D

HTSN

8542390000"8542.39.00.01

SCHEDULE B

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet                         

7 Series FPGA Overview

Kintex-7 FPGA CES Errata

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

Featured Product

TE0741 Series with Xilinx Kintex®-7

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

Cross-Ship Lead-Free Notice 31/Oct/2016

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014

HTML Datasheet

7 Series FPGA Overview

Kintex-7 FPGAs Datasheet


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

IC FPGA 400 I/O 676FCBGA

Digi-Key

Limited Supply

Xilinx, Inc.

IC FPGA 400 I/O 676FCBGA

Avnet

Americas - 8

Europe - 0

Xilinx, Inc.

FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V 676-Pin Lidless FCBGA - Trays (Alt: XC7K410T-L2FBG676E)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7K410T-L2FBG676E Popularity by Region

XC7K410T-L2FBG676E Popularity by Region


Market Price Analysis

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