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May 22 2020

MC908QB4CDWE Datasheets| NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MC908QB4CDWE

Manufacturer Part#:

MC908QB4CDWE

Product Category:

Embedded - Microcontrollers

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

Click Purchase button to buy original genuine MC908QB4CDWE

Description:

IC MCU 8BIT 4KB FLASH 16SOIC

Datasheet:

MC908QB4CDWE Datasheet

Package:

16-SOIC (0.295", 7.50mm Width)

Quantity:

3816 PCS

MC908QB4CDWE Images are for reference only.

 


CAD Models

MC908QB4CDWE Footprint


Product Attributes

ADC Resolution

10 bit

Additional Feature

OPERATES AT 3V SUPPLY AT 4 MHZ

Address Bus Width

0.0

Bit Size

8

China RoHS Compliant

Yes

Clock Frequency-Max

32.0 MHz

Connectivity

SCI, SPI

Core Processor

HC08

Core Size

8-Bit

Data Converters

A/D 10x10b

Data RAM Size

256 B

DMA Channels

NO

EEPROM Size

-

EU RoHS Compliant

Yes

External Data Bus Width

0.0

Interface Type

ESCI SPI

JESD-30 Code

R-PDSO-G16

JESD-609 Code

e3

Length

10.3 mm

Manufacturer

Freescale Semiconductor - NXP

Maximum Clock Frequency

8 MHz

Maximum Operating Temperature

+ 85 C

Mfr Package Description

1.27 MM PITCH, LEAD FREE, PLASTIC, MS-013AA, SOIC-16

Minimum Operating Temperature

- 40 C

Moisture Sensitivity Level

3

Mounting Style

SMD/SMT

Number of ADC Channels

10

Number of I O

13

Number of Terminals

16

Number of Timers Counters

4 Timer

Operating Temperature-Max

85.0 Cel

Operating Temperature-Min

-40.0 Cel

Oscillator Type

Internal

Package Body Material

PLASTIC/EPOXY

Package Case

16-SOIC (0.295", 7.50mm Width)

Package Case

SOIC-16 Wide

Packaging

Tube Alternate Packaging

Peak Reflow Temperature (Cel)

260

Peripherals

LVD, POR, PWM

Power Supplies

3/5

Processor Series

HC08QB

Product Category

Embedded - Microcontrollers

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

Qualification Status

Not Qualified

RAM (bytes)

128.0

RAM Size

128 x 8

ROM (words)

4096

ROM Programmability

FLASH

Seated Height-Max

2.65 mm

Series

HC08

Speed:

8.0 MHz

Status

Transferred

Sub Category

Microcontrollers

Supplier Device Package

16-SOIC

Supply Voltage Max

5.5 V

Supply Voltage Min

2.7 V

Supply Voltage-Nom

5.0 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Matte Tin (Sn)

Terminal Form

GULL WING

Terminal Pitch

1.27 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

40

Unit Weight

0.014963 oz

Width

7.5 mm


Features

  • High-performance M68HC08 CPU core
  • Fully upward-compatible object code with M68HC05 Family
  • 5-V and 3-V operating voltages (VDD)
  • 8-MHz internal bus operation at 5 V, 4-MHz at 3 V
  • Trimmable internal oscillator

– Software selectable 1 MHz, 2 MHz, or 3.2 MHz internal bus operation

– 8-bit trim capability

– ± 25% untrimmed

– Trimmable to approximately 0.4%(1)

  • Software selectable crystal oscillator range, 32–100 kHz, 1–8 MHz, and 8–32 MHz
  • Software configurable input clock from either internal or external source
  • Auto wakeup from STOP capability using dedicated internal 32-kHz RC or bus clock source
  • On-chip in-application programmable FLASH memory

– Internal program/erase voltage generation

– Monitor ROM containing user callable program/erase routines

– FLASH security

  • On-chip random-access memory (RAM)
  • Enhanced serial communications interface (ESCI) module
  • Serial peripheral interface (SPI) module
  • 4-channel, 16-bit timer interface (TIM) module
  • 10-channel, 10-bit analog-to-digital converter (ADC) with internal bandgapreference channel (ADC10)
  • Up to 13 bidirectional input/output (I/O) lines and one input only:

– Six shared with KBI

– Ten shared with ADC

– Four shared with TIM

– Two shared with ESCI

– Four shared with SPI

– One input only shared with IRQ

– High current sink/source capability on all port pins

– Selectable pullups on all ports, selectable on an individual bit basis

– Three-state ability on all port pins

  • 6-bit keyboard interrupt with wakeup feature (KBI)

– Programmable for rising/falling or high/low level detect

  • Low-voltage inhibit (LVI) module features:

– Software selectable trip point

  • System protection features:

– Computer operating properly (COP) watchdog

– Low-voltage detection with reset

– Illegal opcode detection with reset

– Illegal address detection with reset

  • External asynchronous interrupt pin with internal pullup (IRQ) shared with general-purpose inputpin
  • Master asynchronous reset pin with internal pullup (RST) shared withgeneral-purpose input/output (I/O) pin
  • Memory mapped I/O registers
  • Power saving stop and wait modes
  • MC68HC908QB8, MC68HC908QB4 and MC68HC908QY8 are available in these packages:

– 16-pin plastic dual in-line package (PDIP)

– 16-pin small outline integrated circuit (SOIC) package

– 16-pin thin shrink small outline packages (TSSOP)


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.



ECCN / UNSPSC

Description

Value

ECCN

3A991.A.2

HTSN

8542.31.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS3 Compliant


Documents & Media

Datasheets

MC68HC908(QB,QY)8,4

Environmental Information

NXP RoHS3 Cert

Design Resources

Development Tool Selector

PCN Design/Specification

Copper Wire Update 18/Dec/2014

Copper Wire Revision A 13/Jan/2015


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

3816 PCS

NXP Semiconductors

IC MCU 8BIT 4KB FLASH 16SOIC

Digi-Key

Limited Supply - Call

NXP Semiconductors

IC MCU 8BIT 4KB FLASH 16SOIC

Rochester Electronics

1645 PCS

NXP Semiconductors

-

Rochester Electronics

3832 PCS

Freescale Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

MC908QB4CDWE Popularity by Region

Market Price Analysis

MC908QB4CDWE Market Price Analysis


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