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Jul 26 2019

XC6VLX365T-2FFG1156I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC6VLX365T-2FFG1156I

Manufacturer Part#:

XC6VLX365T-2FFG1156I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 600 I/O 1156FCBGA

Datasheet:

XC6VLX365T-2FFG1156I Datasheet

Package:

BGA1156

Quantity:

176 PCS

XC6VLX365T-2FFG1156I Images are for reference only.

 XC6VLX365T-2FFG1156I


CAD Models

 XC6VLX365T-2FFG1156I Symbol

XC6VLX365T-2FFG1156I Symbol

 XC6VLX365T-2FFG1156I Footprint

XC6VLX365T-2FFG1156I Footprint


Product Attributes

Manufacturer

Xilinx Inc.

Product Category

IC Chips

Series

VirtexR 6 LXT

Mfr Package Description

35 X 35 MM, LEAD FREE, FBGA-1156

Package-Case

1156-BBGA, FCBGA

Clock Frequency-Max

1286.0  MHz

Combinatorial Delay of a CLB-Max

4.29  ns

EU RoHS Compliant

Yes

JESD-30 Code

S-PBGA-B1156

JESD-609 Code

e1

Moisture Sensitivity Level

4

Mounting-Type

Surface Mount

Number of Terminals

1156

Number-of-Gates

-

Number-of-I-O

600

Number-of-LABs-CLBs

28440

Number-of-Logic-Elements-Cells

364032

Operating-Temperature

-40°C ~ 100°C (TJ)

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA1156,34X34,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

245

Power Supplies

1,1.2/2.5

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

REACH Compliant

Yes

Seated Height-Max

3.5  mm

Status

Active

Sub Category

Field Programmable Gate Arrays

Supplier-Device-Package

1156-FCBGA (35x35)

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Total-RAM-Bits

15335424

Voltage-Supply

0.95 V ~ 1.05 V

Length

35.0  mm

Width

35.0  mm


Features

  • Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity

  • LXT and SXT devices are footprint compatible in the same package

  • Advanced, high-performance FPGA Logic

  • Real 6-input look-up table (LUT) technology

  • Dual LUT5 (5-input LUT) option

  • LUT/dual flip-flop pair for applications requiring rich register mix

  • Improved routing efficiency

  • 64-bit (or two 32-bit) distributed LUT RAM option per 6-input LUT

  • SRL32/dual SRL16 with registered outputs option

  • Powerful mixed-mode clock managers (MMCM)

  • MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division

  • 36-Kb block RAM/FIFOs

  • Dual-port RAM blocks

  • Programmable

− Dual-port widths up to 36 bits

− Simple dual-port widths up to 72 bits

  • Enhanced programmable FIFO logic

  • Built-in optional error-correction circuitry

  • Optionally use each block as two independent 18 Kb blocks

  • High-performance parallel SelectIO™ technology

  • 1.2 to 2.5V I/O operation

  • Source-synchronous interfacing using ChipSync™ technology

  • Digitally controlled impedance (DCI) active termination

  • Flexible fine-grained I/O banking

  • High-speed memory interface support with integrated write-leveling capability

  • Advanced DSP48E1 slices

  • 25 x 18, two's complement multiplier/accumulator

  • Optional pipelining

  • New optional pre-adder to assist filtering applications

  • Optional bitwise logic functionality

  • Dedicated cascade connections

  • Flexible configuration options

  • SPI and Parallel Flash interface

  • Multi-bitstream support with dedicated fallback reconfiguration logic

  • Automatic bus width detection

  • System Monitor capability on all devices

  • On-chip/off-chip thermal and supply voltage monitoring

  • JTAG access to all monitored quantities

  • Integrated interface blocks for PCI Express® designs

  • Compliant to the PCI Express Base Specification 2.0

  • Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with GTX transceivers

  • Endpoint and Root Port capable

  • x1, x2, x4, or x8 lane support per block

  • GTX transceivers: up to 6.6 Gb/s

  • Data rates below 480 Mb/s supported by oversampling in FPGA logic.

  • GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s

  • Integrated 10/100/1000 Mb/s Ethernet MAC block

  • Supports 1000BASE-X PCS/PMA and SGMII using GTX transceivers

  • Supports MII, GMII, and RGMII using SelectIO technology resources

  • 2500Mb/s support available

  • 40 nm copper CMOS process technology

  • 1.0V core voltage (-1, -2, -3 speed grades only)

  • Lower-power 0.9V core voltage option (-1L speed grade only)

  • High signal-integrity flip-chip packaging available in standard or Pb-free package options


Advantages and Disadvantages  

Advantages

The Virtex®-6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) columnbased architecture, the Virtex-6 family contains multiple distinct sub-families. This overview covers the devices in the LXT, SXT, and HXT sub-families. Each sub-family contains a different ratio of features to most efficiently address the needs of a wide variety of advanced logic designs. In addition to the high-performance logic fabric, Virtex-6 FPGAs contain many built-in system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGA-based systems. Built on a 40 nm state-of-theart copper process technology, Virtex-6 FPGAs are a programmable alternative to custom ASIC technology. Virtex-6 FPGAs offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991D

HTSN

8542390001"8542.39.00.01

SCHEDULE B

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheet

Virtex-6 FPGA Datasheet
Virtex-6 FPGA Family Overview

PCN Design/Specification

Virtex-6 FIFO Input Logic Reset 18/Apr/2011


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

176 PCS

Xilinx, Inc.

IC FPGA 600 I/O 1156FCBGA

Digi-Key

0

Xilinx, Inc.

IC FPGA 600 I/O 1156FCBGA

Avnet

0

Xilinx, Inc.

FPGA Virtex-6 LXT Family 364032 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA - Trays (Alt: XC6VLX365T-2FFG1156I)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region  

 XC6VLX365T-2FFG1156I Popularity by Region

XC6VLX365T-2FFG1156I Popularity by Region


Market Price Analysis  

There is no relevant information available for this part yet.


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