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XC7K325T-1FB676C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 25 Jul 2019
 1314
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7K325T-1FB676C

Manufacturer Part#:

XC7K325T-1FB676C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Purchase 

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

XC7K325T-1FB676C Datasheet

Package:

BGA

Quantity:

88 PCS


XC7K325T-1FB676C Images are for reference only.

XC7K325T-1FB676C Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K325T

Audio I/O

No

Configuration Memory

16MB QSPI; 128MB BPI FLASH

Display Mode

HMDI Output

Package Description

FBGA-676

REACH Compliant

Yes

EU RoHS Compliant

Yes

Ethernet

Yes

GPIO

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,818 MHz

Display Mode

HMDI Output

Ethernet

Yes

GPIO

Yes

In System Programmability

No

Interface Standards

FMC LPC; I2C; HPC; XADC; SMA; SFP+

JESD-30 Code

S-PBGA-B676

JESD-609 Code

e0

Lead Finish

Tin|Lead

Memory Card Interface

SD Card

Memory Size

1GB

Memory Type

DDR3

Moisture Sensitivity Level

4

Maximum Propagation Delay Time

0.12 ns

Maximum Number of User I/Os

250

Number of CLBs

25,475

Number of Inputs

400

Number of Logic Cells

326,080

Number of Logic Units

203,800

Number of Outputs  

400

Number of Terminals

676

Number of I/O

400

Number of Logic Blocks (LABs)

25,475

Number of Registers

407,600

Operating Temperature

0°C ~ 85°C (TJ)

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

PCIe

PCIe

Package Type

FCBGA

Package Equivalence Code

BGA, BGA676,26X26,40

Product Dimensions

27 x 27 x 1.84 mm

Package Shape

SQUARE

Programmability   

No

Pbfree Code

Yes

Package Style

GRID ARRAY

Power Supplies

1,1.8,3.3 V

Pin Count

676

PCB

676

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27x27)

Qualification Status  

Not Qualified

RAM Bits

16,404,480b

Rohs Code

Yes

Re-programmability Support

1

Risk Rank

5.85

Rohs Code

No

Radiation Hardening

No

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97V

Supply Voltage-Max

1.03 V

Surface Mount  

Yes

Speed Grade

1

Screening Level

Commercial

Technology

CMOS

Terminal Finish

Tin/Lead (Sn63Pb37)

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Typical Operating Supply Voltage

1.0000 V

USB

USB-Serial Bridge

Length

27 mm

Width

27 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTS

8542390001

SCHEDULE B

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet                    Kintex-7 FPGAs CES9937 Errata

Kintex-7 FPGA CES Errata

7 Series FPGA Overview

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

IC FPGA 400 I/O 676FCBGA

Digi-Key

Limited Supply

Xilinx, Inc.

IC FPGA 400 I/O 676FCBGA

Avnet

Americas - 0

Asia - 0

Xilinx, Inc.

FPGA Kintex-7 326080 Cells 28nm Technology 1V 676-Pin FCBGA - Trays (Alt: XC7K325T-1FB676C)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

XC7K325T-1FB676C Popularity by Region 

XC7K325T-1FB676C Popularity by Region


Market Price Analysis

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