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XC7Z045-1FFG900C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 24 Jul 2019
 1521
Embedded - System On Chip (SoC)

Product Overview

Kynix Part #:

KY32-XC7Z045-1FFG900C

Manufacturer Part#:

XC7Z045-1FFG900C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC SOC CORTEX-A9 KINTEX7 900FBGA

Datasheet:

XC7Z045-1FFG900C Datasheet

Package:

BGA900

Quantity:

83 PCS


XC7Z045-1FFG900C Images are for reference only.

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CAD Models

 XC7Z045-1FFG900C Symbol

XC7Z045-1FFG900C Symbol

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - System On Chip (SoC)

Base Part Number

XC7Z045

Series

Zynq®-7000

Architecture

MCU, FPGA

Part Status

Active

Boundary Scan

Yes

Bus Compatibility

CAN, ETHERNET, I2C, PCI, SPI, UART, USB

Contact Plating

Copper, Tin, Silver

CPU Speed  

667MHz

Core Architecture

ARM

Clock Frequency-Max

667 MHz

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Data Bus Width

32 Bit

Device Core

ARM Cortex A9

Frequency

1GHz

Flash Size

-

I/O Voltage

1.2, 3.3 V

Instruction Type

Floating Point

Instruction Set Architecture

Thumb-2

Interface

I2C, SPI, USB, CAN, Ethernet, MMC, SDIO, SD, UART, USART, EBI/EMI

JESD-30 Code

S-PBGA-B484

JESD-609 Code

e1

Lead Finish

Tin|Silver|Copper

Max Frequency

667 MHz

Max Processing Temp

245

MPU Family

Zynq

MPU Series

7000

MCU RAM

256 KB

Mounting

Surface Mount

Memory Type

ROMless

Mounting Style

SMD/SMT

Number of I/O Lines

4

Number of Terminals

900

Number of Logic Elements/Cells

190,000

Number of CPU Cores

2

Number of I/Os

130

Number of Pins

900

Operating Supply Voltage

1V

Operating Temperature

0°C ~ 85°C (TJ)

Packaging

Tray

Pin Count

900

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

250

Product Dimensions

31 x 31 x 2.65(Max) mm

Primary Attributes

Kintex™-7 FPGA, 350K Logic Cells

Peripherals

DMA

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

RAM Size

256KB

Rohs Code

Yes

RAM Size

256 KBit

Risk Rank

1.3

RAM (words)

256,000

Radiation Hardening

No

Speed

667 MHz

Seated Height-Max

3.35 mm

Speed Grade

-1

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Length

31 mm

Width

31 mm

Watchdog Timers

1


Features

  • Dual-core ARM® Cortex™-A9 Based Application Processor Unit (APU)

  • 2.5 DMIPS/MHz per CPU

  • CPU frequency: Up to 1 GHz

  • Coherent multiprocessor support

  • ARMv7-A architecture

  • TrustZone® security

  • Thumb®-2 instruction set

  • Jazelle® RCT execution Environment Architecture

  • NEON™ media-processing engine

  • Single and double precision Vector Floating Point Unit (VFPU)

  • CoreSight™ and Program Trace Macrocell (PTM)

  • Timer and Interrupts

  • 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

  • 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

  • Byte-parity support

  • On-chip boot ROM

  • 256 KB on-chip RAM (OCM)

  • Byte-parity support

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

  • Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

  • Two SD/SDIO 2.0/MMC3.31 compliant controllers

  • Two full-duplex SPI ports with three peripheral chip selects

  • Two high-speed UARTs (up to 1 Mb/s)

  • Two master and slave I2C interfaces

  • GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

  • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

  • True Dual-Port

  • Up to 72 bits wide

  • Configurable as dual 18 Kb


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542320002

SCHEDULE B

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status

Lead free


Documents & Media

Datasheets

Zynq-7000 All Programmable SoC Overview

XC7Z030,35,45,100 Datasheet

Zynq-7000 Errata

Zynq-7000 User Guide

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

Featured Product

All Programmable Zynq®-7 SoC

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

Zynq-7000 AP Requirement 28/Sep/2015

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

83 PCS

Xilinx, Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

Digi-Key

16 PCS

Xilinx, Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

Avnet

Americas - 82

Asia - 0

 

Xilinx, Inc.

MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 900-Pin FC-BGA - Trays (Alt: XC7Z045-1FFG900C)

Mouser

3 PCS

Xilinx, Inc.

Processors - Application Specialized XC7Z045-1FFG900C


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7Z045-1FFG900C Popularity by Region 

XC7Z045-1FFG900C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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