Product Overview
Kynix Part #: | KY32-XC7Z045-1FFG900C |
Manufacturer Part#: | XC7Z045-1FFG900C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC7Z045-1FFG900C | |
Description: | IC SOC CORTEX-A9 KINTEX7 900FBGA |
Datasheet: | XC7Z045-1FFG900C Datasheet |
Package: | BGA900 |
Quantity: | 83 PCS |
XC7Z045-1FFG900C Images are for reference only.
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - System On Chip (SoC) |
Base Part Number | XC7Z045 |
Series | Zynq®-7000 |
Architecture | MCU, FPGA |
Part Status | Active |
Boundary Scan | Yes |
Bus Compatibility | CAN, ETHERNET, I2C, PCI, SPI, UART, USB |
Contact Plating | Copper, Tin, Silver |
CPU Speed | 667MHz |
Core Architecture | ARM |
Clock Frequency-Max | 667 MHz |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Data Bus Width | 32 Bit |
Device Core | ARM Cortex A9 |
Frequency | 1GHz |
Flash Size | - |
I/O Voltage | 1.2, 3.3 V |
Instruction Type | Floating Point |
Instruction Set Architecture | Thumb-2 |
Interface | I2C, SPI, USB, CAN, Ethernet, MMC, SDIO, SD, UART, USART, EBI/EMI |
JESD-30 Code | S-PBGA-B484 |
JESD-609 Code | e1 |
Lead Finish | Tin|Silver|Copper |
Max Frequency | 667 MHz |
Max Processing Temp | 245 |
MPU Family | Zynq |
MPU Series | 7000 |
MCU RAM | 256 KB |
Mounting | Surface Mount |
Memory Type | ROMless |
Mounting Style | SMD/SMT |
Number of I/O Lines | 4 |
Number of Terminals | 900 |
Number of Logic Elements/Cells | 190,000 |
Number of CPU Cores | 2 |
Number of I/Os | 130 |
Number of Pins | 900 |
Operating Supply Voltage | 1V |
Operating Temperature | 0°C ~ 85°C (TJ) |
Packaging | Tray |
Pin Count | 900 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 250 |
Product Dimensions | 31 x 31 x 2.65(Max) mm |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Peripherals | DMA |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31x31) |
RAM Size | 256KB |
Rohs Code | Yes |
RAM Size | 256 KBit |
Risk Rank | 1.3 |
RAM (words) | 256,000 |
Radiation Hardening | No |
Speed | 667 MHz |
Seated Height-Max | 3.35 mm |
Speed Grade | -1 |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal Form | BALL |
Terminal Pitch | 1 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Length | 31 mm |
Width | 31 mm |
Watchdog Timers | 1 |
Features
Dual-core ARM® Cortex™-A9 Based Application Processor Unit (APU)
2.5 DMIPS/MHz per CPU
CPU frequency: Up to 1 GHz
Coherent multiprocessor support
ARMv7-A architecture
TrustZone® security
Thumb®-2 instruction set
Jazelle® RCT execution Environment Architecture
NEON™ media-processing engine
Single and double precision Vector Floating Point Unit (VFPU)
CoreSight™ and Program Trace Macrocell (PTM)
Timer and Interrupts
32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)
512 KB 8-way set-associative Level 2 cache (shared between the CPUs)
Byte-parity support
On-chip boot ROM
256 KB on-chip RAM (OCM)
Byte-parity support
Multiprotocol dynamic memory controller
16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories
ECC support in 16-bit mode
1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories
Static memory interfaces
Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support
Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints
Two SD/SDIO 2.0/MMC3.31 compliant controllers
Two full-duplex SPI ports with three peripheral chip selects
Two high-speed UARTs (up to 1 Mb/s)
Two master and slave I2C interfaces
GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic
Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments
True Dual-Port
Up to 72 bits wide
Configurable as dual 18 Kb
Advantages and Disadvantages
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Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | 8542320002 |
SCHEDULE B | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status | Lead free |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 83 PCS | Xilinx, Inc. | IC SOC CORTEX-A9 KINTEX7 900FBGA |
Digi-Key | 16 PCS | Xilinx, Inc. | IC SOC CORTEX-A9 KINTEX7 900FBGA |
Avnet | Americas - 82 Asia - 0 | Xilinx, Inc. | MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 900-Pin FC-BGA - Trays (Alt: XC7Z045-1FFG900C) |
Mouser | 3 PCS | Xilinx, Inc. | Processors - Application Specialized XC7Z045-1FFG900C |
Alternative Models
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