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Jul 19 2019

XCF32PFS48C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XCF32PFS48C

Manufacturer Part#:

XCF32PFS48C

Product Category:

Memory - Configuration Proms for FPGA's

Stock:

Yes

Manufacturer:

XILINX

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XCF32PFS48C

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Description:

IC PROM SRL/PAR 1.8V 32M 48CSBGA

Datasheet:

XCF32PFS48C Datasheet

Package:

BGA

Quantity:

7910 PCS

XCF32PFS48C Images are for reference only.

XCF32PFS48C 


CAD Models 

XCF32PFS48C symbol 

XCF32PFS48C Symbol

XCF32PFS48C 

XCF32PFS48C Footprint


Product Attributes

Manufacturer

XILINX

Data Retention Time-Min

20

Endurance

20000.0  Write/Erase Cycles

Function

Configuration PROM

JESD-30 Code

R-PBGA-B48

JESD-609 Code

e0

Lead Finish

Tin/Lead

Length

9.0 mm

Max Processing Temp

240

Memory Density

3.3554432E7  bit

Memory IC Type

CONFIGURATION MEMORY

Memory Width

1

Memory-Size

32Mb

Mfr Package Description

PLASTIC, TFBGA-48

Moisture Sensitivity Level

3

Mounting

Surface Mount

Number of Functions

1

Number of Terminals

48

Number of Words Code

32M

Operating Mode

SYNCHRONOUS

Operating Temperature

-40 to 85 °C

Organization

32MX1

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA48,6X8,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package-Case

48-TFBGA, CSPBGA

Packaging

Tray

Parallel/Serial

SERIAL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Pin Count

48

Power Supplies (V)

1.5/3.3,1.8

Product Category

Memory - Configuration Proms for FPGA's

Product Dimensions

9 x 8 x 0.86 mm

Programmable-Type

In System Programmable

Qualification Status

Not Qualified

REACH Compliant

Yes

Screening Level

Industrial

Seated Height-Max

1.2 mm

Series

-

Status

Active

Sub Category

Flash Memories

Supplier-Device-Package

48-CSP (8x9)

Supply Current-Max

0.04 Amp

Supply Voltage-Max (Vsup)

2.0 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn63Pb37)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Type

NOR TYPE

Width

8.0 mm


Features 

In-System Programmable PROMs for Configuration of Xilinx® FPGAs

Low-Power Advanced CMOS NOR Flash Process

Endurance of 20,000 Program/Erase Cycles

Operation over Full Industrial Temperature Range (–40°C to +85°C)

IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing

JTAG Command Initiation of Standard FPGA Configuration

Cascadable for Storing Longer or Multiple Bitstreams

Dedicated Boundary-Scan (JTAG) I/O Power Supply (VCCJ)

I/O Pins Compatible with Voltage Levels Ranging From 1.8V to 3.3V

Design Support Using the Xilinx ISE® Alliance and Foundation™ Software Packages

1.8V Supply Voltage

Serial or Parallel FPGA Configuration Interface

Available in Small-Footprint VOG48, FS48, and FSG48 Packages

Design Revision Technology Enables Storing and Accessing Multiple Design Revisions for Configuration

Built-In Data Decompressor Compatible with Xilinx Advanced Compression Technology

It can also operates at 2.5,3.3 volt noninal.


Advantages and Disadvantages  

Advantage

Xilinx introduces the Platform Flash series of in-system programmable configuration PROMs. Available in 1 to 32 Mb densities, these PROMs provide an easy-to-use, cost-effective, and reprogrammable method for storing large Xilinx FPGA configuration bitstreams. The Platform Flash PROM series includes both the 3.3V XCFxxS PROM and the 1.8V XCFxxP PROM. The XCFxxS version includes 4 Mb, 2 Mb, and 1 Mb PROMs that support Master Serial and Slave Serial FPGA configuration modes.

The XCFxxP version includes 32 Mb, 16 Mb, and 8 Mb PROMs that support Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP FPGA configuration modes.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HSTN

8542.32.00.51


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheet

XCFxx(S,P) Platform Flash PROMS


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors 

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

7910 PCS

Xilinx, Inc.

IC PROM SRL/PAR 1.8V 32M 48CSBGA

Digi-Key

0

Xilinx, Inc.

IC PROM SRL/PAR 1.8V 32M 48CSBGA

Avnet

0

Xilinx, Inc.

-


Alternative Models

XCF32PFSG48 C


Popularity by Region  

XCF32PFS48C Popularity by Region 

XCF32PFS48C Popularity by Region


Market Price Analysis 

There is no relevant information available for this part yet.


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