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XC3S400A-4FTG256I Datasheets| Xilinx| PDF| Price| In Stock

Author: Apogeeweb
Date: 17 Jul 2019
 1817
IC Chips

Product Overview

Kynix Part#:

KY32-XC3S400A-4FTG256I

Manufacturer Part#:

XC3S400A-4FTG256I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx

Click Purchase button to buy original genuine

XC3S400A-4FTG256I

purchase

Description:

-

Datasheet:

XC3S400A-4FTG256I Datasheet

Package:

BGA

Quantity:

3677 PCS


XC3S400A-4FTG256I Images are for reference only:

XC3S400A-4FTG256I


CAD Models

XC3S400A-4FTG256I Symbol

XC3S400A-4FTG256I Symbol

XC3S400A-4FTG256I Footprint

XC3S400A-4FTG256I Footprint


Product Attributes

Manufacturer:

Xilinx

Product Category:

IC Chips

Status:

Active

Series:

Spartan®-3A

Clock Frequency-Max:

250.0 MHz

Combinatorial Delay of a CLB-Max:

4.97 ns

Distributed RAM:

56 kbit

Device Logic Cells:

8064

Device Logic Units:

8064

Device Logic Gates:

400000

Device System Gates:

400000

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

360 kbit

In System Programmability:

No

.JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Internal Frequency:

667 MHz

Number of I/O:

195

Number of Pins:

256

Number of CLBs:

896.0

Number of Inputs:

195.0

Number of Outputs:

160.0

Number of Macrocells:

8064

Number of Terminals:

256

Number of Logic Cells:

8064.0

Number of Equivalent Gates:

400000.0

Organization:

896 CLBS, 400000 GATES

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100.0 °C

Pin Count:

256

Product Type:

FPGA - Field Programmable Gate Array

Power Supplies:

1.2,2.5/3.3

Package / Case:

256-LBGA

Package Code:

LBGA

Package Style:

GRID ARRAY, LOW PROFILE

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA256,16X16,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

260.0 °C

RAM Bits:

368,640 Bit

REACH Compliant:

Yes

Re-programmability Support:

1

Speed Grade:

4

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Industrial

Seated Height-Max:

1.55 mm

Supply Voltage-Nom:

1.2 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

256-FTBGA (17x17)

Tradename:

Spartan

Technology:

CMOS

Total RAM Bits:

368640

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30 s

Voltage - Supply:

1.14 V ~ 1.26 V

Width:

17.0 mm


Product Features

• Very low cost, high-performance logic solution for high-volume, cost-conscious applications

• Dual-range VCCAUX supply simplifies 3.3V-only design

• Suspend, Hibernate modes reduce system power

• Multi-voltage, multi-standard SelectIO™ interface pins

— Up to 502 I/O pins or 227 differential signal pairs

— LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O

— 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

— Selectable output drive, up to 24 mA per pin

— QUIETIO standard reduces I/O switching noise

— Full 3.3V ± 10% compatibility and hot swap compliance

— 640+ Mb/s data transfer rate per differential I/O

— LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors

— Enhanced Double Data Rate (DDR) support

— DDR/DDR2 SDRAM support up to 400 Mb/s

— Fully compliant 32-/64-bit, 33/66 MHz PCI® technology support

• Abundant, flexible logic resources

— Densities up to 25,344 logic cells, including optional shift register or distributed RAM support

— Efficient wide multiplexers, wide logic

— Fast look-ahead carry logic

— Enhanced 18 x 18 multipliers with optional pipeline

— IEEE 1149.1/1532 JTAG programming/debug port

• Hierarchical SelectRAM™ memory architecture

— Up to 576 Kbits of fast block RAM with byte write enables for processor applications

— Up to 176 Kbits of efficient distributed RAM

• Up to eight Digital Clock Managers (DCMs)

— Clock skew elimination (delay locked loop)

— Frequency synthesis, multiplication, division

— High-resolution phase shifting

— Wide frequency range (5 MHz to over 320 MHz)

• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing

• Configuration interface to industry-standard PROMs

— Low-cost, space-saving SPI serial Flash PROM

— x8 or x8/x16 BPI parallel NOR Flash PROM

— Low-cost Xilinx® Platform Flash with JTAG

— Unique Device DNA identifier for design authentication

— Load multiple bitstreams under FPGA control

— Post-configuration CRC checking

• Complete Xilinx ISE® and WebPACK™ development system software support plus Spartan-3A Starter Kit

• MicroBlaze™ and PicoBlazeä embedded processors

• Low-cost QFP and BGA packaging, Pb-free options

— Common footprints support easy density migration

— Compatible with select Spartan-3AN nonvolatile FPGAs

— Compatible with higher density Spartan-3A DSP FPGAs

• XA Automotive version available


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

EAR99

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

RoHS:

Compliant

USHTS:

8542390001

TARIC:

8542399000

REACH SVHC:

No SVHC


Documents & Media

Datasheet

Spartan-3A FPGA Datasheet

Spartan-3A Brochure

Extended Spartan-3A Family Overview

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013

PCN Packaging

Spartan-3A, 3AN Devices 20/Oct/2008


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

3677

Xilinx

-

DigiKey

962

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Mouser

450

Xilinx

FPGA - Field Programmable Gate Array XC3S400A-4FTG256I CONNECTING EBOM TO MARKETING PART


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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