Product Overview
Kynix Part #: | KY32-XC4VLX200-11FF1513C |
Manufacturer Part#: | XC4VLX200-11FF1513C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC4VLX200-11FF1513C | |
Description: | - |
Datasheet: | XC4VLX200-11FF1513C Datasheet |
Package: | BGA |
Quantity: | 67 PCS |
XC4VLX200-11FF1513C Images are for reference only.
CAD Models
XC4VLX200-11FF1513C Symbol
XC4VLX200-11FF1513C Footprint
Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Package Description | FBGA-1513 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Status | Active |
Series | Virtex®-4 LX |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Clock Frequency-Max | 1,205 MHz |
Distributed RAM | 1392 Kbit |
Embedded Block RAM - EBR | 6048 Kbit |
JESD-30 Code | S-PBGA-B1513 |
JESD-609 Code | e0 |
Mounting Type | Surface Mount |
Maximum Operating Frequency | 500 MHz |
Moisture Sensitivity Level | 4 |
Number of CLBs | 22,272 |
Number of Inputs | 960 |
Number of Logic Cells | 200,448 |
Number of Outputs | 960 |
Number of Terminals | 1,513 |
Number of I/O | 960 |
Organization | 22,272 CLBS |
Operating Temperature | 0°C ~ 85°C (TJ) |
Operating Supply Voltage | 1.2 V |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA1513,39X39,40 |
Package Shape | SQUARE |
Packaging | Tray |
Pin Count | 1513 |
Package Style | GRID ARRAY |
Pbfree Code | No |
Peak Reflow Temperature (Cel) | 225 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Package / Case | 1513-BBGA, FCBGA |
RAM Bits | 6,193,152 b |
Risk Rank | 5.2 |
Rohs Code | No |
Radiation Hardening | No |
Supplier Device Package | 1513-FCBGA (40x40) |
Qualification Status | Not Qualified |
Seated Height-Max | 3.25 mm |
Sub Category | Programmable Logic ICs |
Supply Voltage-Nom | 1.2 V |
Supply Voltage-Min | 1.14 V |
Supply Voltage-Max | 1.26 V |
Surface Mount | Yes |
Speed Grade | 11 |
Technology | CMOS |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Terminal Form | BALL |
Total RAM Bits | 4,423,680.0 |
Terminal Pitch | 1.0 mm |
Temperature Grade | OTHER |
Terminal Position | Bottom |
Time@Peak Reflow Temperature-Max (s) | 30 |
Length | 40 mm |
Width | 40 mm |
Base Part Number | XC4VLX200 |
Features
Summary of Virtex-4 Family Features
• Three Families — LX/SX/FX
- Virtex-4 LX: High-performance logic applications solution
- Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications
- Virtex-4 FX: High-performance, full-featured solution for embedded platform applications
• Xesium™ Clock Technology
- Digital clock manager (DCM) blocks
- Additional phase-matched clock dividers (PMCD)
- Differential global clocks
• XtremeDSP™ Slice
- 18 x 18, two’s complement, signed Multiplier
- Optional pipeline stages
- Built-in Accumulator (48-bit) and Adder/Subtracter
• Smart RAM Memory Hierarchy
- Distributed RAM
- Dual-port 18-Kbit RAM blocks
· Optional pipeline stages
· Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
- High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
• SelectIO™ Technology
- 1.5V to 3.3V I/O operation
- Built-in ChipSync™ source-synchronous technology
- Digitally controlled impedance (DCI) active termination
- Fine grained I/O banking (configuration in one bank)
• Flexible Logic Resources
• Secure Chip AES Bitstream Encryption
• 90-nm Copper CMOS Process
• 1.2V Core Voltage
• Flip-Chip Packaging including Pb-Free Package Choices
• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
• IBM PowerPC RISC Processor Core [FX only]
- PowerPC 405 (PPC405) Core
- Auxiliary Processor Unit Interface (User Coprocessor)
• Multiple Tri-Mode Ethernet MACs [FX only]
Advantages and Disadvantages
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Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A001.A.7.A |
HTS | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 67 PCS | Xilinx, Inc. | - |
Digi-Key | 0 | Xilinx, Inc. | IC FPGA 960 I/O 1513FCBGA |
Avnet | Americas - 0 | Xilinx, Inc. | FPGA Virtex-4 LX Family 200448 Cells 90nm (CMOS) Technology 1.2V 1513-Pin FCBGA - Trays (Alt: XC4VLX200-11FF1513C) |
Mouser | 0 | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
Alternative Models
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Market Price Analysis
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