Product Overview
Kynix Part #: | KY32-XC7K160T-1FBG484I |
Manufacturer Part#: | XC7K160T-1FBG484I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC7K160T-1FBG484I | |
Description: | IC FPGA 285 I/O 484FCBGA |
Datasheet: | XC7K160T-1FBG484I Datasheet |
Package: | 484-BBGA, FCBGA |
Quantity: | 580 PCS |
XC7K160T-1FBG484I Images are for reference only.
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Xilinx Inc. |
Series | Kintex®-7 |
Base Part Number | XC7K160 |
Package Description | FBGA-484 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Ethernet | Yes |
Status | Active |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Clock Frequency-Max | 1,098 MHz |
Contact Plating | Tin/Silver/Copper |
Combinatorial Delay of a CLB-Max | 0.74 ns |
Clock Management | MMCM, PLL |
In System Programmability | Yes |
JESD-30 Code | S-PBGA-B484 |
JESD-609 Code | e1 |
Lead Finish | Tin/Silver/Copper |
Moisture Sensitivity Level | 4 |
Maximum Number of User I/Os | 185 |
Max Processing Temp | 250 |
Number of CLBs | 12,675 |
Number of Inputs | 285 |
Number of Logic Cells | 162,240 |
Number of Logic Units | 101,400 |
Number of Registers | 202,800 |
Number of Outputs | 285 |
Number of Terminals | 484 |
Number of I/O | 285 |
Number of Macrocells | 162,240 |
Number of Logic Blocks (LABs) | 12,675 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Organization | 12,675 CLBS |
Operating Frequency Max | 625MHz |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Type | Lidless FCBGA |
Package Equivalence Code | BGA, BGA484,22X22,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 1,1.8,3.3 V |
Product Dimensions | 23 x 23 mm |
Pin Count | 484 |
Pbfree Code | Yes |
PCB | 484 |
Propagation Delay | 0.12 ns |
Packaging | Tray |
Package / Case | 484-BBGA, FCBGA |
Supplier Device Package | 484-FCBGA (23x23) |
Qualification Status | Not Qualified |
RAM Bits | 11,980,800 b |
Rohs Code | Yes |
Risk Rank | 5.82 |
Re-programmability Support | 1 |
Radiation Hardening | No |
Seated Height-Max | 2.54 mm |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 1.0 V |
Supply Voltage-Min | 0.97 V |
Supply Voltage-Max | 1.03 V |
Surface Mount | Yes |
Speed Grade | 1 |
Screening Level | Industrial |
Typical Operating Supply Voltage | 1.0000 V |
Technology | CMOS |
Terminal Form | Ball |
Terminal Pitch | 1.0 mm |
Terminal Position | Bottom |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Turn-On Delay Time | 0.12 ns |
Length | 23 mm |
Width | 23 mm |
Features
lAdvanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
l36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
lHigh-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
lHigh-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
lA user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
lDSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
lPowerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
lIntegrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
lWide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
lLow-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
lDesigned for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Advantages and Disadvantages
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | 8542390001 |
SCHEDULE B | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 580 PCS | Xilinx, Inc. | IC FPGA 285 I/O 484FCBGA |
Digi-Key | Limited Supply | Xilinx, Inc. | IC FPGA 285 I/O 484FCBGA |
Avnet | Americas - 0 Europe - 0 Asia - 0 | Xilinx, Inc. | FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 484-Pin Lidless FCBGA - Trays (Alt: XC7K160T-1FBG484I) |
Mouser | 0 | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
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