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Jun 25 2019

XC7K410T-1FFG676I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7K410T-1FFG676I

Manufacturer Part#:

XC7K410T-1FFG676I

Product Category:

Programmable Logic ICs

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

XC7K410T-1FFG676I Datasheet

Package:

676FCBG

Quantity:

99 PCS


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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K410T

Package Description

FBGA-676

REACH Compliant

Yes

EU RoHS Compliant

Yes

Ethernet

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,098.0 MHz

Contact Plating

Copper , Tin , Silver

Combinatorial Delay of a CLB-Max

0.74 ns

In System Programmability

Yes

JESD-30 Code

S-PBGA-B676

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Moisture Sensitivity Level

4

Maximum Number of User I/Os

250.0

Number of CLBs

31,775.0

Number of Inputs

400.0

Number of Logic Cells

406,720.0

Number of Logic Units

254,200.0

Number of Outputs  

400.0

Number of Terminals

676.0

Number of I/O

400.0

Number of Logic Blocks (LABs)

31,775.0

Number of Registers

508,400

Operating Temperature

-40°C ~ 100°C (TJ)

Operating Frequency Max

400MHz

Organization

31775 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Type

FCBGA

Package Equivalence Code

BGA, BGA676,26X26,40

Product Dimensions

27 x 27 x 1.73 mm

Package Shape

SQUARE

Programmability   

No

Pbfree Code

Yes

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8,3.3 V

Pin Count

676

PCB

676

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27 x 27)

Qualification Status  

Not Qualified

RAM Bits

29,306,880 b

Rohs Code

Yes

Re-programmability Support

1

Risk Rank

2.18

Seated Height-Max

3.37 mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97V

Supply Voltage-Max

1.03 V

Seated Height-Max

3.37 mm

Surface Mount  

Yes

Speed Grade

-1

Screening Level

Commercial

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Typical Operating Supply Voltage

1.0000 V

Length

27.0 mm

Width

27.0 mm


Features

lAdvanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

l36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

lHigh-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

lHigh-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

lA user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

lDSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

lPowerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

lIntegrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

lWide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

lLow-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

lDesigned for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542390001

SCHEDULE B

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet 

7 Series FPGA Overview

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

Design Resources

Development Tool Selector

Featured Product

TE0741 Series with Xilinx Kintex®-7

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

Cross-Ship Lead-Free Notice 31/Oct/2016

Product Marking Chg 31/Oct/2016

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014

PCN Packaging

Mult Devices 26/Jun/2017

HTML Datasheet

7 Series FPGA Overview

Kintex-7 FPGAs Datasheet


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

99 PCS

Xilinx, Inc.

IC FPGA 400 I/O 676FCBGA

Digi-Key

Temporarily Out of Stock

Xilinx, Inc.

IC FPGA 400 I/O 676FCBGA

Avnet

Americas - 0

Xilinx, Inc.

FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V 676-Pin BGA - Trays (Alt: XC7K410T-1FFG676I)

Newark element14

8 PCS

Xilinx, Inc.

FPGA, KINTEX-7, 400 I/O, FCBGA-676, No. of Logic Blocks:63550, No. of Macrocells:406720, FPGA Family:Kintex-7, Logic Case Style:FCBGA, No. of Pins:676Pins, No. of Speed Grades:-1, Total RAM Bits:28620Kbit, No. of I/O s:400I/O s RoHS Compliant: Yes


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7K410T-1FFG676I Popularity by Region 

XC7K410T-1FFG676I Popularity by Region


Market Price Analysis

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