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Jun 25 2019

XC7Z100-2FFG900I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7Z100-2FFG900I

Manufacturer Part#:

XC7Z100-2FFG900I

Product Category:

Programmable Logic ICs

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC SOC CORTEX-A9 KINTEX7 900FBGA

Datasheet:

XC7Z100-2FFG900I Datasheet

Package:

FFG900

Quantity:

206 PCS


XC7Z100-2FFG900I Images are for reference only.

XC7Z100-2FFG900I Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Base Part Number

XC7Z100

Package Description

LEAD FREE, FBGA-900

REACH Compliant

Yes

EU RoHS Compliant

Yes

Ethernet

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

800 MHz

Contact Plating

Copper , Tin , Silver

Combinatorial Delay of a CLB-Max

0.61 ns

Core Architecture

ARM

Device Core

ARM Cortex A9

Data Bus Width

32 b

In System Programmability

Yes

Interface

I2C , SPI , USB , CAN , Ethernet , MMC , SDIO , SD , UART , USART , EBI/EMI

Peripherals

DMA

JESD-30 Code

S-PBGA-B900

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Moisture Sensitivity Level

4

Max Processing Temp

260

Maximum Speed

1000 MHz

Max Frequency

1 GHz

Number of CPU Cores

2

Operating Temperature

-40°C ~ 100°C (TJ)

Organization

31,775 CLBS

Operating Frequency Max

710 MHz

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Type

FCBGA

Package Equivalence Code

BGA, BGA900,30X30,40

Product Dimensions

31 x 31 x 1.84 mm

Package Shape

SQUARE

Programmability   

No

Pbfree Code

Yes

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

245

Pin Count

900

PCB

900

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31 x 31)

Qualification Status  

Not Qualified

RAM Bits

256 KB

Rohs Code

Yes

Radiation Hardening

No

Risk Rank

2.23

Seated Height-Max

3.35 mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.95V

Supply Voltage-Max

1.05 V

Surface Mount  

Yes

Speed Grade

-2

Screening Level

Industrial

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

30

Typical Operating Supply Voltage

1.0000 V

Length

31.0 mm

Width

31.0 mm


Features

nDual-core ARM® Cortex™-A9 Based Application Processor Unit (APU)

n2.5 DMIPS/MHz per CPU

nCPU frequency: Up to 1 GHz

nCoherent multiprocessor support

nARMv7-A architecture

nTrustZone® security

nThumb®-2 instruction set

nJazelle® RCT execution Environment Architecture

nNEON™ media-processing engine

nSingle and double precision Vector Floating Point Unit (VFPU)

nCoreSight™ and Program Trace Macrocell (PTM)

nTimer and Interrupts

n32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

n512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

nByte-parity support

nOn-chip boot ROM

n256 KB on-chip RAM (OCM)

nByte-parity support

nMultiprotocol dynamic memory controller

n16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

nECC support in 16-bit mode

n1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

nStatic memory interfaces

nTwo 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

nTwo USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

nTwo SD/SDIO 2.0/MMC3.31 compliant controllers

nTwo full-duplex SPI ports with three peripheral chip selects

nTwo high-speed UARTs (up to 1 Mb/s)

nTwo master and slave I2C interfaces

nGPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

nUp to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

nTrue Dual-Port

nUp to 72 bits wide

nConfigurable as dual 18 Kb


Advantages and Disadvantages

Advantages

The Xilinx Zynq®-7000 All Programmable SoC (AP SoC) family integrates the software programmability of an ARM® based processor with the hardware programmability of FPGA enabling key analytics and hardware acceleration while integrating CPU, DSP, ASSP and mixed signal functionality on a single device. Available in single-core Zynq®-7000S and dual-core Zynq®-7000 devices. Zynq®-7000S devices feature a single core ARM® Cortex™-A9 processor mated with 28nm Artix®-7 based programmable logic representing the lowest cost entry point to the scalable Zynq®-7000 platform. Ideal for industrial IoT applications such as motor control and embedded vision. Zynq®-7000 devices are equipped with dual-core ARM® Cortex™-A9 processors integrated with 28nm Artix®-7 or Kintex®-7 based programmable logic (up to 6.6M logic cells of logic and 12.5Gb/s transceivers) for excellent performance-per-watt, maximum design flexibility and to enable highly differentiated designs for a wide range of embedded applications.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542390001

SCHEDULE B

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Zynq-7000 All Programmable SoC Overview

Zynq-7000 User Guide

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

Featured Product

All Programmable Zynq®-7000 SoC

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

Zynq-7000 AP Requirement 28/Sep/2015

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

206 PCS

Xilinx, Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

Digi-Key

15 PCS

Xilinx, Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

Avnet

Americas - 0

Xilinx, Inc.

MPU XC7Z100 32-Bit 1000MHz 900-Pin FFG - Trays (Alt: XC7Z100-2FFG900I)

Newark element14

0

Xilinx, Inc.

PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900


Alternative Models

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Popularity by Region

XC7Z100-2FFG900I Popularity by Region 

XC7Z100-2FFG900I Popularity by Region


Market Price Analysis

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