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XC2V1000-4FG256I Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 25 Jun 2019
 2331
IC Chips

Product Overview

Kynix Part #:

KY32-XC2V1000-4FG256I

Manufacturer Part#:

XC2V1000-4FG256I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine

XC2V1000-4FG256I

purchase

Description:

-

Datasheet:

XC2V1000-4FG256I Datasheet

Package:

BGA256

Quantity:

450 PCS


XC2V1000-4FG256I Images are for reference only:

XC2V1000-4FG256I


CAD Models

XC2V1000-4FG256I Symbol

XC2V1000-4FG256I Symbol


XC2V1000-4FG256I Footprint

XC2V1000-4FG256I Footprint


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Series:

Virtex®-II

Clock Frequency-Max:

650.0 MHz

Combinatorial Delay of a CLB-Max:

0.44 ns

.JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17.0 mm

Mounting Type:

Surface Mount

Number of CLBs:

1280.0

Number of I/O:

172

Number of Gates:

1000000

Number of Inputs:

172.0

Number of Outputs:

172.0

Number of Terminals:

256

Number of Logic Cells:

11520.0

Number of Equivalent Gates:

1000000.0

Organization:

1280 CLBS, 1000000 GATES

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100 °C

Power Supplies:

1.5,1.5/3.3,3.3

Package / Case:

256-BGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA256,16X16,40

Peak Reflow Temperature:

225 °C

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Seated Height-Max:

2.0 mm

Supply Voltage-Nom:

1.5 V

Supply Voltage-Min:

1.425 V

Supply Voltage-Max:

1.575 V

Supplier Device Package:

256-FBGA (17x17)

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Position:

BOTTOM

Total RAM Bits:

737280

Time@Peak Reflow Temperature-Max:

30 s

Voltage - Supply:

1.425 V ~ 1.575 V

Width:

17.0 mm


Product Features

• Industry First Platform FPGA Solution

• IP-Immersion Architecture

   — Densities from 40K to 8M system gates

   — 420 MHz internal clock speed (Advance Data)

   — 840+ Mb/s I/O (Advance Data)

• SelectRAM™ Memory Hierarchy

   — 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources

   — Up to 1.5 Mb of distributed SelectRAM resources

• High-Performance Interfaces to External Memory

   — DRAM interfaces

· SDR / DDR SDRAM

· Network FCRAM

· Reduced Latency DRAM

— SRAM interfaces

· SDR / DDR SRAM

· QDR™ SRAM

— CAM interfaces

• Arithmetic Functions

— Dedicated 18-bit x 18-bit multiplier blocks

— Fast look-ahead carry logic chains

• Flexible Logic Resources

— Up to 93,184 internal registers / latches with Clock Enable

— Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers

— Wide multiplexers and wide-input function support

— Horizontal cascade chain and sum-of-products support

— Internal 3-state bussing

• High-Performance Clock Management Circuitry

— Up to 12 DCM (Digital Clock Manager) modules

· Precise clock de-skew

· Flexible frequency synthesis

· High-resolution phase shifting

— 16 global clock multiplexer buffers

• Active Interconnect Technology

— Fourth generation segmented routing structure

— Predictable, fast routing delay, independent of fanout

• SelectIO™-Ultra Technology

— Up to 1,108 user I/Os

— 19 single-ended and six differential standards

— Programmable sink current (2 mA to 24 mA) per I/O

— Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards

— PCI-X compatible (133 MHz and 66 MHz) at 3.3V

— PCI compliant (66 MHz and 33 MHz) at 3.3V

— CardBus compliant (33 MHz) at 3.3V

— Differential Signaling

· 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers

· Bus LVDS I/O

· Lightning Data Transport (LDT) I/O with current driver buffers

· Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O

· Built-in DDR input and output registers

— Proprietary high-performance SelectLink Technology

· High-bandwidth data path

· Double Data Rate (DDR) link

· Web-based HDL generation methodology

• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems

— Integrated VHDL and Verilog design flows

— Compilation of 10M system gates designs

— Internet Team Design (ITD) tool

• SRAM-Based In-System Configuration

— Fast SelectMAP configuration

— Triple Data Encryption Standard (DES) security option (Bitstream Encryption)

— IEEE 1532 support

— Partial reconfiguration

— Unlimited reprogrammability

— Readback capability

• 0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors

• 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies

• IEEE 1149.1 Compatible Boundary-Scan Logic Support

• Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm)

• Wire-Bond BGA Devices Available in Pb-Free Packaging (www.xilinx.com/pbfree)

• 100% Factory Tested


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.D

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Spartan-3E FPGA Family

PCN Obsolescence/ EOL

Spartan, Virtex, XC17V00 24/Apr/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

450

XILINX

-

DigiKey

0

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

Mouser

-

-

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC2V1000-4FG256I Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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pinglun 1 comment

    • pingluntus
    • Stacie on 2019/7/6 2:45:54

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