Product Overview
Kynix Part #: | KY32-XC7VX485T-2FFG1927I |
Manufacturer Part#: | XC7VX485T-2FFG1927I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | XILINX |
Click Purchase button to buy original genuine XC7VX485T-2FFG1927I |
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Description: | - |
Datasheet: | XC7VX485T-2FFG1927I Datasheet |
Package: | BGA1927 |
Quantity: | 70 PCS |
XC7VX485T-2FFG1927I Images are for reference only:
CAD Models
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Product Attributes
Manufacturer: | XILINX |
Product Category: | IC Chips |
Part Status: | Active |
Series: | Virtex®-7 XT |
Clock Frequency-Max: | 1818.0 MHz |
Combinatorial Delay of a CLB-Max: | 0.61 ns |
Device Logic Cells: | 485,760 |
Device Logic Units: | 303,600 |
EU RoHS Compliant: | Yes |
.JESD-30 Code: | S-PBGA-B1927 |
JESD-609 Code: | e1 |
Length: | 45.0 mm |
Mounting Type: | Surface Mount |
Number of I/O: | 600 |
Number of CLBs: | 37950.0 |
Number of Inputs: | 600.0 |
Number of Outputs: | 600.0 |
Number of Terminals: | 1927 |
Number of Registers: | 607,200 |
Number of Logic Cells: | 485760.0 |
Organization: | 37950 CLBS |
Operating Temperature-Min: | -40.0 °C |
Operating Temperature-Max: | 100.0 °C |
Pin Count: | 1927 |
Power Supplies: | 1,1.8 |
Package / Case: | 1924-BBGA, FCBGA |
Package Code: | BGA |
Package Style: | GRID ARRAY |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA1924,44X44,40 |
Peak Reflow Temperature: | NOT SPECIFIED |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
RAM Bits: | 37,969,920 Bit |
REACH Compliant: | Yes |
Re-programmability Support: | 1 |
Sub Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
Speed Grade: | 2 |
Screening Level: | Industrial |
Seated Height-Max: | 3.65 mm |
Supply Voltage-Nom: | 1.0 V |
Supply Voltage-Min: | 0.97 V |
Supply Voltage-Max: | 1.03 V |
Supplier Device Package: | 1927-FCBGA (45x45) |
Technology: | CMOS |
Total RAM Bits: | 37969920 |
Terminal Form: | BALL |
Terminal Pitch: | 1.0 mm |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Position: | BOTTOM |
Time@Peak Reflow Temperature-Max: | NOT SPECIFIED |
Voltage - Supply: | 0.97 V ~ 1.03 V |
Width: | 45.0 mm |
Product Features
· Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
· 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
· High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
· High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
· A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
· DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
· Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
· Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
· Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
· Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
· Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Product Functions
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Applications
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Advantages and Disadvantages
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ECCN / UNSPSC
ECCN: | 3A991.D |
HTSN: | 8542390001"8542.39.00.01 |
SCHEDULE B: | 8542390000"8542.39.00.00 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
There is no relevant information available for this part yet.
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 70 | XILINX | - |
DigiKey | 0 | Xilinx Inc. | IC FPGA 600 I/O 1927FCBGA |
Mouser | - | - | - |
Alternative Models
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Popularity by Region
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