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Jun 19 2019

XC7A200T-2FFG1156C Datasheets| XILINX| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7A200T-2FFG1156C

Manufacturer Part#:

XC7A200T-2FFG1156C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

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Description:

IC FPGA ARTIX7 500 I/O 1156FCBGA

Datasheet:

XC7A200T-2FFG1156C Datasheet

Package:

BGA

Quantity:

254 PCS


XC7A200T-2FFG1156C Images are for reference only:

XC7A200T-2FFG1156C


CAD Models

XC7A200T-2FFG1156C Footprint

XC7A200T-2FFG1156C Footprint


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Part Status:

Active

Series:

Artix-7

Audio I/O:

No

Clock Frequency-Max:

1286.0 MHz

Configuration Memory:

32 MB QSPI

Combinatorial Delay of a CLB-Max:

1.05 ns

Display Mode:

HDMI Output; LCD Display (2 x 16)

Device Logic Cells:

215,360

Device Logic Units:

134,600

Ethernet:

Yes

EU RoHS Compliant:

Yes

GPIO:

Yes

Interface Standards:

FMC HPC; I2C; Pmod; XADC; SMA; SFP

.JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Length:

35.0 mm

Memory Size:

1GB

Memory Type:

DDR3

Mounting Type:

Surface Mount

Memory Card Interface:

SD Card

Number of I/O:

500

Number of CLBs:

16825.0

Number of Inputs:

500.0

Number of Outputs:

500.0

Number of Terminals:

1156

Number of Registers:

269,200

Number of Logic Cells:

215360.0

Organization:

16825 CLBS

Operating Temperature-Min:

0.0 °C

Operating Temperature-Max:

85.0 °C

PCIe:

PCIe

Pin Count:

1156

Power Supplies:

1

Package / Case:

1156-BBGA, FCBGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA1156,34X34,40

Peak Reflow Temperature:

NOT SPECIFIED

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

RAM Bits:

13,455,360 Bit

REACH Compliant:

Yes

Re-programmability Support:

1

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Speed Grade:

2

Screening Level:

Commercial

Seated Height-Max:

3.1 mm

Supply Voltage-Nom:

1.0 V

Supply Voltage-Min:

0.95 V

Supply Voltage-Max:

1.05 V

Supplier Device Package:

1156-FCBGA (35x35)

Technology:

CMOS

Total RAM Bits:

13455360

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position:

BOTTOM

Temperature Grade:

OTHER

Time@Peak Reflow Temperature-Max:

NOT SPECIFIED

USB:

USB-Serial Bridge

Voltage - Supply:

0.95 V ~ 1.05 V

Width:

35.0 mm


Product Features

· Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

· 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

· High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

· High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

· A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

· DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

· Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

· Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

· Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

· Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

· Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.d

HTSN:

PARTS...

SCHEDULE B:

PARTS...


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Artix-7 FPGAs Datasheet

Artix-7 FPGAs Brief

XC7A100T/200T Errata

7 Series FPGA Overview

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

254

XILINX

IC FPGA ARTIX7 500 I/O 1156FCBGA

DigiKey

83

Xilinx Inc.

IC FPGA ARTIX7 500 I/O 1156FCBGA

Mouser

-

-

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7A200T-2FFG1156C Popularity by Region


Market Price Analysis

XC7A200T-2FFG1156C Market Price Analysis


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