Product Overview
Kynix Part #: | KY32-XC7Z035-1FBG676I |
Manufacturer Part#: | XC7Z035-1FBG676I |
Product Category: | Embedded - System On Chip (SoC) |
Stock: | Yes |
Manufacturer: | XILINX |
Click Purchase button to buy original genuine XC7Z035-1FBG676I | |
Description: | IC SOC CORTEX-A9 KINTEX7 676BGA |
Datasheet: | XC7Z035-1FBG676I Datasheet |
Package: | Tray |
Quantity: | 500 PCS |
XC7Z035-1FBG676I Images are for reference only.
CAD Models
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Product Attributes
Manufacturer: | Xilinx Inc. |
Product Category: | Embedded - System On Chip (SoC) |
Series: | ZynqR-7000 |
Status: | Active |
REACH Compliant: | Yes |
EU RoHS Compliant: | Yes |
Connectivity: | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Core-Processor: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Core Architecture: | MCU, FPGA |
Device Logic Cells: | 275,000 |
Device Logic Units: | 275,000 |
Dedicated DSP: | 900 |
Differential I/O Standards Supported: | LVDS|SSTL|HSTL |
Device Number of DLLs/PLLs: | 8 |
Ethernet MACs: | 2 |
Frequency: | 667MHz |
JESD-30 Code: | S-PBGA-B676 |
JESD-609 Code: | e1 |
Lead Shape: | Ball |
Lead Finish(Plating): | SnAgCu |
Mounting Type: | Surface Mount |
MCU-RAM: | 256KB |
Microprocessor/Microcontroller/Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Operating Temperature: | 100 °C |
Minimum Operating Temperature: | -40 °C |
Maximum Number of User I/Os: | 130 |
Maximum Operating Supply Voltage: | 1.05 V |
Typical Operating Supply Voltage: | 1 V |
Minimum Operating Supply Voltage: | 0.95 V |
Maximum Propagation Delay Time: | 0.12 ns |
Maximum Reflow Temperature: | 250 °C |
Reflow Solder Time (Sec): | 30 |
Number of Reflow Cycle: | 3 |
Number of I/Os: | 130 |
Number of Registers: | 343800 |
Number of Multipliers: | 900 (25×18) |
Packaging: | Tray |
Package / Case: | 676-FCBGA (27x27) |
Mfr Package Description: | 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 |
Package Body Material: | PLASTIC/EPOXY |
Package Code: | BGA |
Package Shape: | SQUARE |
Package Style: | GRID ARRAY |
Peripherals: | DMA |
Pin Count: | 676 |
PCB: | 676 |
Package Length: | 27 mm |
Package Width: | 27 mm |
Package Height: | 1.84 mm |
Seated Plane Height: | 2.34 mm |
Pin Pitch: | 1 mm |
Process Technology: | 28nm |
Program Memory Type: | SRAM |
RAM Size: | 2048000 Bit |
Screening Level: | Industrial |
Speed Grade: | 1 |
Supplier-Device-Package: | 676-FCBGA (27x27) |
Technology: | CMOS |
Terminal Finish: | TIN SILVER COPPER |
Terminal Form: | BALL |
Terminal Position: | BOTTOM |
Total Number of Block RAM: | 500 |
Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
Descriptions
The Zynq®-7000 SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges.
Product Features
● Dual-core ARM® Cortex™-A9 Based Application Processor Unit (APU)
● 2.5 DMIPS/MHz per CPU
● CPU frequency: Up to 1 GHz
● Coherent multiprocessor support
● ARMv7-A architecture
● TrustZone® security
● Thumb®-2 instruction set
● Jazelle® RCT execution Environment Architecture
● NEON™ media-processing engine
● Single and double precision Vector Floating Point Unit (VFPU)
● CoreSight™ and Program Trace Macrocell (PTM)
● Timer and Interrupts
● 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)
● 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)
● Byte-parity support
● On-chip boot ROM
● 256 KB on-chip RAM (OCM)
● Byte-parity support
● Multiprotocol dynamic memory controller
● 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories
● ECC support in 16-bit mode
● 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories
● Static memory interfaces
● Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support
● Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints
● Two SD/SDIO 2.0/MMC3.31 compliant controllers
● Two full-duplex SPI ports with three peripheral chip selects
● Two high-speed UARTs (up to 1 Mb/s)
● Two master and slave I2C interfaces
● GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic
● Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments
● True Dual-Port
● Up to 72 bits wide
● Configurable as dual 18 Kb
Product Functions
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Application
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Advantages and Disadvantages
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ECCN / UNSPSC
Description | Value |
ECCN: | 3A991.d |
HTSN: | 8542390001 |
SCHEDULE B: | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3(168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
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Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix | 500 | Xilinx Inc. | IC SOC CORTEX-A9 KINTEX7 676BGA |
Digikey | 0 | Xilinx Inc. | IC SOC CORTEX-A9 KINTEX7 676BGA |
Avnet | 0 | Xilinx | FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA |
Alternative Models
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Popularity by Region
XC7Z035-1FBG676I Popularity by Region
Market Price Analysis
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