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XC7Z035-1FBG676I Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 21 May 2019
 1457
Embedded - System On Chip (SoC)

Product Overview

Kynix Part #:

KY32-XC7Z035-1FBG676I

Manufacturer Part#:

XC7Z035-1FBG676I

Product Category:

Embedded - System On Chip (SoC)

Stock:

Yes

Manufacturer:

XILINX

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Description:

IC SOC CORTEX-A9 KINTEX7 676BGA

Datasheet:

XC7Z035-1FBG676I Datasheet

Package:

Tray

Quantity:

500 PCS

XC7Z035-1FBG676I Images are for reference only.

XC7Z035-1FBG676I


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

Embedded - System On Chip (SoC)

Series:

ZynqR-7000

Status:

Active

REACH Compliant:

Yes

EU RoHS Compliant:

Yes

Connectivity:

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core-Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Core Architecture:

MCU, FPGA

Device Logic Cells:

275,000

Device Logic Units:

275,000

Dedicated DSP:

900

Differential I/O Standards Supported:

LVDS|SSTL|HSTL

Device Number of DLLs/PLLs:

8

Ethernet MACs:

2

Frequency:

667MHz

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Lead Shape:

Ball

Lead Finish(Plating):

SnAgCu

Mounting Type:

Surface Mount

MCU-RAM:

256KB

Microprocessor/Microcontroller/Peripheral IC Type:

MICROPROCESSOR CIRCUIT

Maximum Operating Temperature:

100 °C

Minimum Operating Temperature:

-40 °C

Maximum Number of User I/Os:

130

Maximum Operating Supply Voltage:

1.05 V

Typical Operating Supply Voltage:

1 V

Minimum Operating Supply Voltage:

0.95 V

Maximum Propagation Delay Time:

0.12 ns

Maximum Reflow Temperature:

250 °C

Reflow Solder Time (Sec):

30

Number of Reflow Cycle:

3

Number of I/Os:

130

Number of Registers:

343800

Number of Multipliers:

900 (25×18)

Packaging:

Tray

Package / Case:

676-FCBGA (27x27)

Mfr Package Description:

27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peripherals:

DMA

Pin Count:

676

PCB:

676

Package Length:

27 mm

Package Width:

27 mm

Package Height:

1.84 mm

Seated Plane Height:

2.34 mm

Pin Pitch:

1 mm

Process Technology:

28nm

Program Memory Type:

SRAM

RAM Size:

2048000 Bit

Screening Level:

Industrial

Speed Grade:

1

Supplier-Device-Package:

676-FCBGA (27x27)

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Total Number of Block RAM:

500

Additional Feature

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


Descriptions

The Zynq®-7000 SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges.


Product Features

● Dual-core ARM® Cortex™-A9 Based Application Processor Unit (APU)

● 2.5 DMIPS/MHz per CPU

● CPU frequency: Up to 1 GHz

● Coherent multiprocessor support

● ARMv7-A architecture

● TrustZone® security

● Thumb®-2 instruction set

● Jazelle® RCT execution Environment Architecture

● NEON™ media-processing engine

● Single and double precision Vector Floating Point Unit (VFPU)

● CoreSight™ and Program Trace Macrocell (PTM)

● Timer and Interrupts

● 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

● 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

● Byte-parity support

● On-chip boot ROM

● 256 KB on-chip RAM (OCM)

● Byte-parity support

● Multiprotocol dynamic memory controller

● 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

● ECC support in 16-bit mode

● 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

● Static memory interfaces

● Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

● Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

● Two SD/SDIO 2.0/MMC3.31 compliant controllers

● Two full-duplex SPI ports with three peripheral chip selects

● Two high-speed UARTs (up to 1 Mb/s)

● Two master and slave I2C interfaces

● GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

● Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

● True Dual-Port

● Up to 72 bits wide

● Configurable as dual 18 Kb


Product Functions

There is no relevant information available for this part yet.


Application

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Advantages and Disadvantages

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ECCN / UNSPSC

Description

Value

ECCN:

3A991.d

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Zynq-7000 All Programmable SoC Overview

XC7Z030,35,45,100 Datasheet

Zynq-7000 User Guide


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

500

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Digikey

0

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Avnet

0

Xilinx

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7Z035-1FBG676I   Popularity by Region

XC7Z035-1FBG676I   Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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