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May 20 2019

XC7K420T-2FFG1156C Datasheets| XILINX| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7K420T-2FFG1156C

Manufacturer Part#:

XC7K420T-2FFG1156C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

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Description:

IC FPGA 400 I/O 1156FCBGA

Datasheet:

XC7K420T-2FFG1156C Datasheet

Package:

BGA

Quantity:

94 PCS


XC7K420T-2FFG1156C Images are for reference only.

XC7K420T-2FFG1156C


CAD Models

XC7K420T-2FFG1156C  Symbol

XC7K420T-2FFG1156C  Symbol

XC7K420T-2FFG1156C  Footprint

XC7K420T-2FFG1156C  Footprint


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

IC Chips

Series:

Kintex-7

Status:

Active

REACH Compliant:

Yes

EU RoHS Compliant:

Yes

Clock Frequency-Max:

1286 MHz

Combinatorial Delay of a CLB-Max:

0.61 ns

Device Logic Cells:

416,960

Device Logic Units:

260,600

Dedicated DSP:

1680

Device Number of DLLs/PLLs:

7

In System Programmability

Yes

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Lead Shape:

Ball

Lead Finish(Plating):

SnAgCu

Mounting-Type:

Surface Mount

Maximum Operating Temperature:

85 °C

Minimum Operating Temperature:

0 °C

Maximum Supply Voltage:

1.03 V

Typical Operating Supply Voltage:

1 V

Minimum Supply Voltage:

970 mV

Maximum Reflow Temperature:

245 °C

Reflow Solder Time (Sec):

30

Number of Reflow Cycle:

3

Number of I/Os:

400

Number of Logic Blocks (LABs):

32575

Number of Logic Elements/Cells:

416960

Number of Registers:

521200

Number of Inputs:

350

Number of Outputs:

350

Number of Terminals:

1156

Number of Multipliers:

1680 (25x18)

Organization:

32575 CLBS

Package / Case:

1156-BBGA, FCBGA

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1156,34X34,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Mfr Package Description:

FBGA-1156

PCI Blocks:

1

Process Technology:

28 nm

Product Dimensions:

35 x 35 x 2.9 mm

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Program Memory Type:

SRAM

RAM Size:

30781440b

Re-programmability Support:

1

Screening Level:

Commercial

Seated Height-Max:

3.35 mm

Speed Grade:

2

Sub Category:

Field Programmable Gate Arrays

Supplier Cage Code:

68994

Supplier-Device-Package:

1156-FCBGA (35x35)

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Transceiver Blocks:

28

Transceiver Speed:

12.5Gbps

Total Number of Block RAM:

835


Descriptions

Kintex®-7 FPGAs are available in -3, -2, -1, -1L, and -2L speed grades, with -3 having the highest performance. The -2L devices are screened for lower maximum static power and can operate at lower core voltages for lower dynamic power than the -2 devices. The -2L industrial (I) temperature devices operate only at VCCINT = 0.95V. The -2L extended (E) temperature devices can operate at either VCCINT = 0.9V or 1.0V. The -2LE devices when operated at VCCINT = 1.0V, and the -2LI devices when operated at VCCINT = 0.95V, have the same speed specifications as the -2 speed grade, except where noted. When the -2LE devices are operated at VCCINT = 0.9V, the speed specifications, static power, and dynamic power are reduced. The -1L military (M) temperature devices have the same speed specifications as the -1 military temperature devices and are screened for lower maximum static power.

Kintex-7 FPGA DC and AC characteristics are specified in commercial, extended, industrial, expanded (-1Q), and military (-1M) temperature ranges. Except for the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade military temperature device are the same as for a -1 speed grade commercial temperature device). However, only selected speed grades and/or devices are available in each temperature range. For example, -1M is only available in the defense-grade Kintex-7Q family, and -1Q is only available in XA Kintex-7 FPGAs.


Product Features

Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Product Functions

There is no relevant information available for this part yet.


Application

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN:

3A991.d

HTSN:

PARTS...

SCHEDULE B:

PARTS...


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet

Kintex-7 FPGAs Brief

7 Series FPGA Overview



Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

94

XILINX

IC FPGA 400 I/O 1156FCBGA

Digikey

0

Xilinx Inc.

IC FPGA 400 I/O 1156FCBGA

Avnet

0

Xilinx

FPGA Kintex-7 Family 416960 Cells 28nm Technology 1V 1156-Pin FC-BGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7K420T-2FFG1156C   Popularity by Region

XC7K420T-2FFG1156C   Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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