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XC7Z035-2FFG900I Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 17 May 2019
 1907
Embedded - System On Chip (SoC)

Product Overview

Kynix Part #:

KY36-XC7Z035-2FFG900I

Manufacturer Part#:

XC7Z035-2FFG900I

Product Category:

Embedded - System On Chip (SoC)

Stock:

Yes

Manufacturer:

XILINX

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Description:

IC SOC CORTEX-A9 KINTEX7 900BGA

Datasheet:

XC7Z035-2FFG900I Datasheet

Package:

BGA

Quantity:

7000 PCS 


XC7Z035-2FFG900I Images are for reference only.

XC7Z035-2FFG900I


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

XILINX

Product Category:

Ceramic Capacitors

Series:

ZynqR-7000

Status:

Active

Risk Rank:

2.2

Applications:

General Purpose

REACH Compliant:

Yes

EU RoHS Compliant:

Yes

Capacitance:

100μF

Contact Plating:

Copper, Tin, Silver

Connectivity:

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Architecture:

ARM

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Dedicated DSP:

900

Device Logic Cells:

275,000

Device Logic Units:

275,000

Differential I/O Standards Supported:

LVDS|SSTL|HSTL

Device Number of DLLs/PLLs:

8

Ethernet MACs:

2

Frequency:

800MHz

Interface:

I2C, SPI, USB, CAN, Ethernet, MMC, SDIO, SD, UART, USART, EBI/EMI

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Lead Finish:

Tin|Silver|Copper

Lead Shape:

Ball

Mounting-Type:

Surface Mount, MLCC

Microprocessor/Microcontroller/Peripheral IC Type:

MICROPROCESSOR CIRCUIT

Max Operating Temperature:

100 °C

Min Operating Temperature:

-40 °C

Max Supply Voltage:

1.05 V

Typical Operating Supply Voltage:

1 V

Min Supply Voltage:

950 mV

Maximum Processing Temperature:

250 °C

Maximum Number of User I/Os:

130

Maximum Propagation Delay Time:

0.1 ns

Maximum Thickness:

0.106" (2.70mm)

Maximum Reflow Temperature:

245 °C

Reflow Solder Time (Sec):

30

Number of Reflow Cycle:

3

Number of Multipliers:

900 (25×18)

Number of I/Os:

130

Number of Registers:

343800

Total Number of Block RAM:

500

Packaging:

Digi-ReelR Alternate Packaging

Package-Case:

1210 (3225 Metric)

Mfr Package Description:

31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Package Length:

31 mm

Package Width:

31 mm

Package Height:

2.75(Max) mm

Seated Plane Height:

3.15 mm

Pin Pitch:

1 mm

Peripherals:

DMA

Pin Count:

900

PCB:

900

Process Technology:

28 nm

Product Dimensions:

31 x 31 x 2.65

Propagation Delay:

0.1 ns

RAM Size:

2048000b

Screening Level:

Industrial

Speed Grade:

2

Size-Dimension:

0.126" L x 0.098" W (3.20mm x 2.50mm)

Supplier Device Package:

900-FCBGA (31x31)

Temperature-Coefficient:

X5R

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30 s

Tolerance:

±20%

Voltage-Rated:

6.3 V

Additional Feature:

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


Descriptions

The Zynq®-7000 SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq-7000 device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges.


Product Features

● Dual-core ARM® Cortex™-A9 Based Application Processor Unit (APU)

● 2.5 DMIPS/MHz per CPU

● CPU frequency: Up to 1 GHz

● Coherent multiprocessor support

● ARMv7-A architecture

● TrustZone® security

● Thumb®-2 instruction set

● Jazelle® RCT execution Environment Architecture

● NEON™ media-processing engine

● Single and double precision Vector Floating Point Unit (VFPU)

● CoreSight™ and Program Trace Macrocell (PTM)

● Timer and Interrupts

● 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

● 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

● Byte-parity support

● On-chip boot ROM

● 256 KB on-chip RAM (OCM)

● Byte-parity support

● Multiprotocol dynamic memory controller

● 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

● ECC support in 16-bit mode

● 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

● Static memory interfaces

● Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

● Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

● Two SD/SDIO 2.0/MMC3.31 compliant controllers

● Two full-duplex SPI ports with three peripheral chip selects

● Two high-speed UARTs (up to 1 Mb/s)

● Two master and slave I2C interfaces

● GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

● Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

● True Dual-Port

● Up to 72 bits wide

● Configurable as dual 18 Kb


Product Functions

There is no relevant information available for this part yet.


Application

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN:

3A991.d

HTSN:

PARTS...

SCHEDULE B:

PARTS...


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Zynq-7000 All Programmable SoC Overview

XC7Z030,35,45,100 Datasheet

Zynq-7000 User Guide


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

35359

XILINX

CAP CER 100UF 6.3V X5R 1210

Digikey

5

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

Avnet

5

Xilinx

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA

Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7Z035-2FFG900I   Popularity by Region

XC7Z035-2FFG900I   Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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