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Apr 3 2020

MPC860ENZQ50D4 Datasheets| NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MPC860ENZQ50D4

Manufacturer Part#:

MPC860ENZQ50D4

Product Category:

Embedded - Microprocessors

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

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MPC860ENZQ50D4

Purchase

Description:

IC MPU MPC8XX 50MHZ 357BGA

Datasheet:

MPC860ENZQ50D4 Datasheet

Package:

357-BBGA

Quantity:

250 PCS


MPC860ENZQ50D4 Images are for reference only.

 MPC860ENZQ50D4

CAD Models

MPC860ENZQ50D4 Footprint

MPC860ENZQ50D4 Footprint


Product Attributes

Manufacturer Part Number

MPC860ENZQ50D4

Rohs Code

No

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

BGA, BGA357,19X19,50

Reach Compliance Code

unknown

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Manufacturer

NXP Semiconductors

Risk Rank

5.06

Address Bus Width

32

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

50 MHz

External Data Bus Width

32

Format

FIXED POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B357

JESD-609 Code

e0

Length

25 mm

Low Power Mode

YES

Moisture Sensitivity Level

3

Number of Terminals

357

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA357,19X19,50

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

245

Power Supplies

3.3 V

Qualification Status

Not Qualified

Seated Height-Max

2.52 mm

Speed

50 MHz

Subcategory

Microprocessors

Supply Voltage-Max

3.465 V

Supply Voltage-Min

3.135 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

BALL

Terminal Pitch

1.27 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

25 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Series

MPC8xx

Packaging

Tray

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

NO

Display & Interface Controllers

-

Ethernet

10Mbps (4)

SATA

-

USB

-

Security Features

-

Package / Case

357-BBGA

Supplier Device Package

357-PBGA (25x25)

Additional Interfaces

I²C, IrDA, PCMCIA, SPI, TDM, UART/USART

Base Part Number

MPC860

Mounting Style

SMD/SMT

Core

PowerPC

L1 Cache Instruction Memory

4 kB

L1 Cache Data Memory

4 kB

Memory Type

L1 Cache

Interface Type

Ethernet, I2C, SPI, UART

Moisture Sensitive

YES

Number of Timers/Counters

4 Timers

Factory Pack Quantity

44

Processor Series

PowerQUICC

Watchdog Timers

Watchdog Timers

Unit Weight

2.174 g

Product Type

Microprocessors - MPU

Instruction Set Architecture

RISC

UART

1

USART

0

USB

0

Multiply Accumulate

NO

SPI

1

I2C

1

I2S

0

CAN

0

Maximum Power Dissipation (mW)

735

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Pin Count

357


Features

  • 4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache
  • 4Kb Data Cache; MPC860P - 8Kb Data Cache
  • 8Kb Dual Port RAM
  • Instruction and Data MMUs
  • Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits)
  • 32 Address Lines
  • Complete Static Design (040 MHz Operation)
  • Memory Controller (Eight Banks)
  • General-Purpose Timers
  • System Integration Unit (SIU)
  • Interrupts
  • Communications Processor Module (CPM)
  • Four Baud Rate Generators
  • Four SCCs (Serial Communication Controllers)
  • Two SMCs (Serial Management Channels)
  • One SPI (Serial Peripheral Interface)
  • One I2C (Inter-Integrated Circuit) Port
  • Time-Slot Assigner
  • Parallel Interface Port
  • PCMCIA Interface
  • Low Power Support
  • Debug Interface
  • 3 V Operation with 5V TTL Compatibility

Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542310000"8542.31.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

RoHS Status

RoHS non-compliant


Documents & Media

Datasheets

MPC860ENZQ50D4 Datasheet

PCN

MPC862B, MPC860D4, and MPC850BU PBGA Copper Wire Bond Qualification

Technical Resources

Addendum to MPC860 PowerQUICC™ User’s Manual


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Arm® Processors

Arm® MCUs

Power Architecture® Processors

All Processors and MCUs

Audio

Interfaces

Peripherals and Logic

Power Management

Sensors

RF

RFID/NFC

Security and Authentication


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

250

NXP Semiconductors

IC MPU MPC8XX 50MHZ 357BGA

Digi-Key

0

NXP Semiconductors

IC MPU MPC8XX 50MHZ 357BGA

Avnet

0

NXP Semiconductors

MPU MPC8xx RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray

Mouser

0

NXP Semiconductors

Microprocessors - MPU POWER QUICC


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 MPC860ENZQ50D4 Popularity by Region

MPC860ENZQ50D4 Popularity by Region


Market Price Analysis

 There is no relevant information available for this part yet.


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