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Apr 3 2020

MPC860TVR66D4 Datasheets| NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MPC860TVR66D4

Manufacturer Part#:

MPC860TVR66D4

Product Category:

Embedded - Microprocessors

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

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MPC860TVR66D4

Purchase

Description:

IC MPU MPC8XX 66MHZ 357BGA

Datasheet:

MPC860TVR66D4 Datasheet

Package:

357-BBGA

Quantity:

85 PCS


MPC860TVR66D4 Images are for reference only.

 MPC860TVR66D4

CAD Models

MPC860TVR66D4 Footprint

MPC860TVR66D4 Footprint


Product Attributes

Additional Interfaces

HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART

Address Bus Width

32

Base Part Number

MPC860

Bit Size

32

Boundary Scan

YES

CAN

0

Clock Frequency-Max

50 MHz

Co-Processors/DSP

Communications; CPM

Core

PowerPC

Core Processor

MPC8xx

Data Cache Size

4KB

Display & Interface Controllers

-

ECCN Code

3A991.A.2

Ethernet

10Mbps (4), 10/100Mbps (1)

Ethernet Interface Type

MII

Ethernet Speed

10Mbps/100Mbps

EU RoHS

Compliant

External Data Bus Width

32

Factory Pack Quantity

44

Family Name

PowerQUICC MPC8xx Processor

Format

FIXED POINT

Graphics Acceleration

No

HTS Code

8542.31.00.01

I2C

1

I2S

0

Ihs Manufacturer

NXP SEMICONDUCTORS

Instruction Cache Size

4KB

Instruction Set Architecture

RISC

Integrated Cache

YES

Interface Type

Ethernet, I2C, SPI, UART

JESD-30 Code

S-PBGA-B357

JESD-609 Code

e1

L1 Cache Data Memory

4 kB

L1 Cache Instruction Memory

4 kB

Length

25 mm

Low Power Mode

YES

Manufacturer

NXP Semiconductors

Manufacturer Part Number

MPC860TVR66D4

Maximum Operating Temperature

+ 95 C

Maximum Power Dissipation (mW)

762

Memory Type

L1 Cache

Minimum Operating Temperature

0 C

Moisture Sensitive

YES

Moisture Sensitivity Level

3

Mounting Style

SMD/SMT

Multiply Accumulate

NO

Number of Cores/Bus Width

1 Core, 32-Bit

Number of Terminals

357

Number of Timers/Counters

4 Timers

On-Chip Memory

8KB/RAM

Package / Case

357-BBGA

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Description

BGA, BGA357,19X19,50

Package Equivalence Code

BGA357,19X19,50

Package Shape

SQUARE

Package Style

GRID ARRAY

Packaging

Tray

Part Life Cycle Code

Not Recommended

PCB changed

357

Peak Reflow Temperature (Cel)

245

Pin Count

357

Power Supplies

3.3 V

Processor Series

PowerQUICC

Qualification Status

Not Qualified

RAM Controllers

DRAM

Reach Compliance Code

compliant

Risk Rank

5.13

Rohs Code

Yes

SATA

-

Seated Height-Max

2.52 mm

Security Features

-

Series

MPC8xx

Speed

66 MHz

SPI

1

Subcategory

Microprocessors

Supplier Device Package

357-PBGA (25x25)

Supply Voltage-Max

3.465 V

Supply Voltage-Min

3.135 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1.27 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Typical Operating Supply Voltage (V)

3.3|2.5

UART

1

Unit Weight

2.096 g

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

USART

0

USB

-

USB

0

Watchdog Timers

Watchdog Timers

Width

25 mm


Features

Embedded MPC8xx Core with 88 MIPS at 66 MHz (using Dhrystone 2.1); MPC860P - 106 MIPS at 80 MHz for the MPC860P

  • 4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache
  • 4Kb Data Cache; MPC860P - 8Kb Data Cache
  • 8Kb Dual Port RAM
  • Instruction and Data MMUs
  • Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits)
  • 32 Address Lines
  • Complete Static Design (040 MHz Operation)
  • Memory Controller (Eight Banks)
  • General-Purpose Timers
  • System Integration Unit (SIU)
  • Interrupts
  • Communications Processor Module (CPM)
  • Four Baud Rate Generators
  • Four SCCs (Serial Communication Controllers)
  • Two SMCs (Serial Management Channels)
  • One SPI (Serial Peripheral Interface)
  • One I2C (Inter-Integrated Circuit) Port
  • Time-Slot Assigner
  • Parallel Interface Port
  • PCMCIA Interface
  • Low Power Support
  • Debug Interface
  • 3 V Operation with 5V TTL Compatibility

Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991A2

HTSN

8542310001


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

RoHS Status

ROHS3 Compliant


Documents & Media

Datasheets

MPC860 Family

Environmental Information

NXP RoHS3 Cert

PCN Design/Specification

Copper Wire Bond Update 01/Aug/2014


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Arm® Processors

Arm® MCUs

Power Architecture® Processors

All Processors and MCUs

Audio

Interfaces

Peripherals and Logic

Power Management

Sensors

RF

RFID/NFC

Security and Authentication


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

85

NXP Semiconductors

IC MPU MPC8XX 66MHZ 357BGA

Digi-Key

0

NXP Semiconductors

IC MPU MPC8XX 66MHZ 357BGA

Avnet

44

NXP Semiconductors

MPU MPC8xx RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray

Mouser

0

NXP Semiconductors

Microprocessors - MPU POWER QUICC


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 MPC860TVR66D4 Popularity by Region

MPC860TVR66D4 Popularity by Region


Market Price Analysis

MPC860TVR66D4 Market Price Analysis

MPC860TVR66D4 Market Price Analysis


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