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Jan 19 2020

K6F1008U2C-YF70 Datasheets| SAMSUNG| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-K6F1008U2C-YF70

Manufacturer Part#:

K6F1008U2C-YF70

Product Category:

Memory

Stock:

Yes

Manufacturer:

SAMSUNG

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Description:

-

Datasheet:

K6F1008U2C-YF70 Datasheet

Package:

TSOP

Quantity:

6046 PCS


K6F1008U2C-YF70 Images are for reference only.

K6F1008U2C-YF70 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

8 X 13.40 MM, TSOP1-32

Brand

SAMSUNG

Sub Category

SRAMs

Access Time-Max

70 ns

I/O Type

COMMON

JESD-30 Code

R-PDSO-G32

JESD-609 Code

e0

Memory Density

1048576 bit

Memory IC Type

STANDARD SRAM

Memory Width

8

Number of Terminals

32

Number of Words

131072 words

Number of Words Code

128000

Number of Functions

1

Organization

128KX8

Operating Mode

ASYNCHRONOUS

Operating Temperature

-40°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP1

Parallel/Serial

PARALLEL

Package Equivalence Code

TSSOP32,.56,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

3.0 V

Qualification Status

Not Qualified

Risk Rank

5.57

Rohs Code

No

Seated Height-Max

1.2 mm

Standby Current-Max

0.000005 A

Supply Current-Max

0.015 mA

Supply Voltage-Nom (Vsup)

3.0 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Max (Vsup)

3.3 V

Standby Current-Max

2.7 V

Standby Voltage-Min

2.7 V

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

11.8 mm

Width

8.0 mm


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.41


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / Non-Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

5362 PCS

Samsung Semiconductor

-

Vyrian

960 PCS

Samsung Semiconductor

-

Nexxon

In Stock

Samsung Semiconductor

-

New Strength Electronic

1827 PCS

Samsung Semiconductor

DC:0214+ ; TSOP32


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

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